| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/13/2008 | CN101122690A Display device and manufacturing method of the same |
| 02/13/2008 | CN101122377A Displaceable light-emitting diode module |
| 02/13/2008 | CN101121775A Method for preparing line-type o-cresol novolac epoxy resin |
| 02/13/2008 | CN101121497A Carbon nano-tube composite material and preparation method thereof |
| 02/13/2008 | CN100369532C Module and method of manufacturing module |
| 02/13/2008 | CN100369530C Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 02/13/2008 | CN100369468C Image sensor module of camera apparatus and assembling method thereof |
| 02/13/2008 | CN100369385C Portable communication terminal having parts cooling way and its cooling method |
| 02/13/2008 | CN100369335C Spiral contactor, contact sheet and connecting device |
| 02/13/2008 | CN100369329C Anisotropic electrically conductive film and method of producing the same |
| 02/13/2008 | CN100369258C Active component array substrate |
| 02/13/2008 | CN100369254C 半导体集成电路器件 The semiconductor integrated circuit device |
| 02/13/2008 | CN100369252C Static discharge protection circuit and its diode |
| 02/13/2008 | CN100369250C Semiconductor integrated circuit |
| 02/13/2008 | CN100369249C Semiconductor device and method of manufacturing the same, electronic device, electronic instrument |
| 02/13/2008 | CN100369248C Stack MCP and manufacturing method thereof |
| 02/13/2008 | CN100369247C Improved HDP-based ILD capping layer |
| 02/13/2008 | CN100369246C Microstructure cooling device and use thereof |
| 02/13/2008 | CN100369245C Wafer radiating element |
| 02/13/2008 | CN100369244C Radiating fin with flow guiding function |
| 02/13/2008 | CN100369243C Semiconductor sealer with radiating structure |
| 02/13/2008 | CN100369242C Pre-soldering arrangement for semiconductor packaging substrate and method for making same |
| 02/13/2008 | CN100369241C Packaging structure of cubic flat pin-free type chips and packaging process thereof |
| 02/13/2008 | CN100369240C Crystal wafer assembling structure |
| 02/13/2008 | CN100369233C Method of manufacture semiconductor component with low dielectric constant dielectric layer |
| 02/13/2008 | CN100369227C Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method |
| 02/13/2008 | CN100369226C Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 02/13/2008 | CN100369216C Semiconductor device and production method therefor |
| 02/13/2008 | CN100369205C Method of forming a conductive line for a semiconductor device using a carbon nanotube and semiconductor device manufactured using the method |
| 02/13/2008 | CN100368909C Thin film transistor array substrate and fabricating method thereof, liquid crystal display using the same and fabricating method thereof, and method of inspecting liquid crystal display |
| 02/13/2008 | CN100368757C Modular capillary pumped loop cooling system |
| 02/12/2008 | USRE40061 Multi-chip stacked devices |
| 02/12/2008 | US7330492 Optical coupler and electronic equipment using same |
| 02/12/2008 | US7330357 Integrated circuit die/package interconnect |
| 02/12/2008 | US7330353 Modular heat sink fin modules for CPU |
| 02/12/2008 | US7330352 Interface module-mounted LSI package |
| 02/12/2008 | US7330261 Marker structure for optical alignment of a substrate, a substrate including such a marker structure, an alignment method for aligning to such a marker structure, and a lithographic projection apparatus |
| 02/12/2008 | US7330222 Display device and method for fabricating the same |
| 02/12/2008 | US7329958 Method and apparatus with power and ground strips for connecting to decoupling capacitors |
| 02/12/2008 | US7329957 Circuit device and manufacturing method thereof |
| 02/12/2008 | US7329956 Dual damascene cleaning method |
| 02/12/2008 | US7329955 Metal-insulator-metal (MIM) capacitor |
| 02/12/2008 | US7329954 Top layers of metal for high performance IC's |
| 02/12/2008 | US7329953 Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same |
| 02/12/2008 | US7329952 Method of fabricating a semiconductor device |
| 02/12/2008 | US7329951 Solder bumps in flip-chip technologies |
| 02/12/2008 | US7329950 RFIC die and package |
| 02/12/2008 | US7329949 Packaged microelectronic devices and methods for packaging microelectronic devices |
| 02/12/2008 | US7329948 Microelectronic devices and methods |
| 02/12/2008 | US7329947 Heat treatment jig for semiconductor substrate |
| 02/12/2008 | US7329946 I/O architecture for integrated circuit package |
| 02/12/2008 | US7329945 Flip-chip adaptor package for bare die |
| 02/12/2008 | US7329944 Leadframe for semiconductor device |
| 02/12/2008 | US7329943 Microelectronic devices and methods for forming interconnects in microelectronic devices |
| 02/12/2008 | US7329942 Array-type modularized light-emitting diode structure and a method for packaging the structure |
| 02/12/2008 | US7329939 Metal-insulator-metal capacitor and method of fabricating same |
| 02/12/2008 | US7329925 Device for electrostatic discharge protection |
| 02/12/2008 | US7329911 Semiconductor device including memory cell and anti-fuse element |
| 02/12/2008 | US7329907 Phosphor-converted LED devices having improved light distribution uniformity |
| 02/12/2008 | US7329900 Bonding strength testing device |
| 02/12/2008 | US7329899 Wafer-level redistribution circuit |
| 02/12/2008 | US7329888 Alignment systems and methods for lithographic systems |
| 02/12/2008 | US7329816 Electronic package with optimized lamination process |
| 02/12/2008 | US7329614 Heat resistant ohmic electrode and method of manufacturing the same |
| 02/12/2008 | US7329612 Semiconductor device and process for producing the same |
| 02/12/2008 | US7329608 Method of processing a substrate |
| 02/12/2008 | US7329607 Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
| 02/12/2008 | US7329605 Semiconductor structure formed using a sacrificial structure |
| 02/12/2008 | US7329603 Semiconductor device and manufacturing method thereof |
| 02/12/2008 | US7329602 Wiring structure for integrated circuit with reduced intralevel capacitance |
| 02/12/2008 | US7329601 Method of manufacturing semiconductor device |
| 02/12/2008 | US7329600 Low dielectric semiconductor device and process for fabricating the same |
| 02/12/2008 | US7329597 Semiconductor chip and tab package having the same |
| 02/12/2008 | US7329585 Method of manufacturing semiconductor device |
| 02/12/2008 | US7329565 Silicide-silicon oxide-semiconductor antifuse device and method of making |
| 02/12/2008 | US7329563 Method for fabrication of wafer level package incorporating dual compliant layers |
| 02/12/2008 | US7329562 Process of producing semiconductor chip with surface interconnection at bump |
| 02/12/2008 | US7329551 Manufacturing and testing of electrostatic discharge protection circuits |
| 02/12/2008 | US7329458 Wiring member and method of manufacturing the same |
| 02/12/2008 | US7329056 Device package and methods for the fabrication and testing thereof |
| 02/12/2008 | US7329030 Assembling structure for LED road lamp and heat dissipating module |
| 02/12/2008 | US7328836 Smart tag holder and cover housing |
| 02/12/2008 | US7328830 Structure and method for bonding to copper interconnect structures |
| 02/12/2008 | US7328506 Method for forming a plated microvia interconnect |
| 02/07/2008 | WO2008016513A1 Electrical insulating layer for metallic thermal interface material |
| 02/07/2008 | WO2008016333A1 Integrated circuit package-on-package stacking system |
| 02/07/2008 | WO2008016332A1 Stackable multi-chip package system with support structure |
| 02/07/2008 | WO2008016128A1 Production method of soldier circuit board |
| 02/07/2008 | WO2008016004A1 Method for film formation, apparatus for film formation, computer program, and storage medium |
| 02/07/2008 | WO2008015862A1 Connector for connecting electronic component |
| 02/07/2008 | WO2008015817A1 Connector for connecting electronic component |
| 02/07/2008 | WO2008015738A1 Substrate inspection and repair device, and substrate evaluation system |
| 02/07/2008 | WO2008015500A1 Method and apparatus for improvements in chip manufacture and design |
| 02/07/2008 | WO2008015499A1 Method and apparatus for improving probing of devices |
| 02/07/2008 | WO2008014957A1 Monolithically integratable circuit arrangement |
| 02/07/2008 | WO2008014633A1 Apparatus, system, and method for wireless connection in integrated circuit packages |
| 02/07/2008 | WO2008005586A3 Flipped, stacked-chip ic packaging for high bandwidth data transfer buses |
| 02/07/2008 | WO2003021680A3 Power semiconductor module |
| 02/07/2008 | US20080033271 Analyte monitoring device and methods of use |
| 02/07/2008 | US20080032499 Method for manufacturing contact structures of wiring |