| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/30/2008 | EP1883107A2 Method for forming packaged microelectronic devices and devices thus obtained |
| 01/30/2008 | EP1882893A2 Heat exchanger |
| 01/30/2008 | EP1882269A1 Apparatus for attenuating reflections of electromagnetic waves, method for its manufacture and its use |
| 01/30/2008 | EP1728277B1 Housing for an electronic circuit and method for sealing the housing |
| 01/30/2008 | EP1273017B1 Distributed capacitor |
| 01/30/2008 | CN201015253Y Fastener for heat radiator |
| 01/30/2008 | CN201015251Y Minisize radiating module |
| 01/30/2008 | CN201015121Y Water-cooling heat radiator of semiconductor refrigeration system |
| 01/30/2008 | CN201015120Y Heat radiation type SMD LED support structure and metal support thereof |
| 01/30/2008 | CN201014392Y Lamp radiating structure of LED |
| 01/30/2008 | CN201014327Y LED road lamp bulb holder |
| 01/30/2008 | CN101116382A Ceramic multilayer board and method for manufacturing same |
| 01/30/2008 | CN101116184A Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulation |
| 01/30/2008 | CN101115999A Assembly for regulating the temperature of an integrated circuit |
| 01/30/2008 | CN101115379A Liquid cooling unit and heat exchanger therefor |
| 01/30/2008 | CN101115378A Liquid cooling unit and heat exchanger therefor |
| 01/30/2008 | CN101115377A Liquid cooling unit and heat receiver therefor |
| 01/30/2008 | CN101115376A Electronic apparatus |
| 01/30/2008 | CN101115375A Electronic apparatus |
| 01/30/2008 | CN101115374A Liquid cooling unit and heat receiver therefor |
| 01/30/2008 | CN101115372A Heat exchanger |
| 01/30/2008 | CN101115369A Method for manufacturing heat conducting module |
| 01/30/2008 | CN101115368A Heat radiating device |
| 01/30/2008 | CN101115367A Heat radiating device |
| 01/30/2008 | CN101115366A Heat radiating device |
| 01/30/2008 | CN101115365A Heat radiating device |
| 01/30/2008 | CN101115364A Heat radiating device |
| 01/30/2008 | CN101115351A Electronic components packaging structure |
| 01/30/2008 | CN101114684A SMD light-emitting diode packaging structure |
| 01/30/2008 | CN101114683A Method and structure for packaging LED |
| 01/30/2008 | CN101114672A Grid grounding transistor of electrostatic discharge protective equipment |
| 01/30/2008 | CN101114667A Organic thin film transistor substrate and fabrication thereof |
| 01/30/2008 | CN101114666A Anti-irradiation high-reliability phase transition memory device unit and manufacturing method thereof |
| 01/30/2008 | CN101114664A Image sensing device packaging digital camera module group using the same |
| 01/30/2008 | CN101114663A Image sensing device packaging digital camera module group using the same |
| 01/30/2008 | CN101114659A CMOS imaging sensor and method of producing same |
| 01/30/2008 | CN101114658A Thin film transistor substrates and making method |
| 01/30/2008 | CN101114657A Display panel, mask and method of manufacturing the same |
| 01/30/2008 | CN101114656A Distortion resistant touch-sensitive display panel |
| 01/30/2008 | CN101114655A Film transistor array substrates and its producing method, repairing method |
| 01/30/2008 | CN101114650A Method and structure for self-aligned device contacts |
| 01/30/2008 | CN101114646A Semiconductor device and method for fabricating the same |
| 01/30/2008 | CN101114645A Integrated circuit and method for making the same |
| 01/30/2008 | CN101114642A Power semiconductor module as H - bridge circuit and method for producing the same |
| 01/30/2008 | CN101114641A Assembly with a high performance semiconductor element and a contact device |
| 01/30/2008 | CN101114640A Semiconductor device |
| 01/30/2008 | CN101114639A 集成电路模块 IC module |
| 01/30/2008 | CN101114638A Stack type semiconductor packaging structure containing flexible circuit board |
| 01/30/2008 | CN101114637A Semiconductor component packaging structure |
| 01/30/2008 | CN101114634A A test structure and method for detecting charge effects during semiconductor processing |
| 01/30/2008 | CN101114633A Interconnection substrate, semiconductor chip package including the same, and display system including the same |
| 01/30/2008 | CN101114632A Semiconductor device and method for improving horizontal carrier capability |
| 01/30/2008 | CN101114631A Semiconductor device and method for manufacturing the same |
| 01/30/2008 | CN101114630A Semiconductor device and method for manufacturing same |
| 01/30/2008 | CN101114629A Resin molded semiconductor device on a lead frame and method of manufacturing the same |
| 01/30/2008 | CN101114628A Semiconductor device and manufacturing method for the same |
| 01/30/2008 | CN101114627A Wafer structure |
| 01/30/2008 | CN101114626A Wafer structure |
| 01/30/2008 | CN101114625A Combined structure of image sensing wafer and glass substrates and manufacturing method therefor |
| 01/30/2008 | CN101114624A Heat radiation type semiconductor package and heat radiating structure |
| 01/30/2008 | CN101114623A Packaging module and electronic device |
| 01/30/2008 | CN101114622A Flip-chip type semiconductor packaging structure and chip bearing member |
| 01/30/2008 | CN101114621A Integrated circuit package structure and anti-warp substrates |
| 01/30/2008 | CN101114618A Photomask, active device array substrates and manufacturing method therefor |
| 01/30/2008 | CN101114616A Capacitor contact structure and technique for dynamic random access memory |
| 01/30/2008 | CN101114610A Methods of trench and contact formation in memory cells |
| 01/30/2008 | CN101114600A Method and structure for preventing soldering pad stripping |
| 01/30/2008 | CN101114598A Electronic packages with roughened wetting and non-wetting zones |
| 01/30/2008 | CN101114518A Sram device and operating method |
| 01/30/2008 | CN101113812A Heat radiating device of LED light source |
| 01/30/2008 | CN101113499A Copper alloy having high strength and high softening resistance |
| 01/30/2008 | CN101113318A Phosphor-containing curable silicone composition for LED and LED light-emitting device using the composition |
| 01/30/2008 | CN101113196A Silicon-phosphor-containing heat-stable hybridized epoxide resin and the preparing method and application thereof |
| 01/30/2008 | CN100366136C Radiating fin and radiating method using the radiating fin |
| 01/30/2008 | CN100366132C A method of forming an opening or cavity in a substrate for receiving an electronic component |
| 01/30/2008 | CN100366130C Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 01/30/2008 | CN100365832C Luminous device and lighting device |
| 01/30/2008 | CN100365814C Back-to-back packaging integrated circuit and its producing method |
| 01/30/2008 | CN100365813C Stacking packaging structure for light sensitive chips and semiconductor chips |
| 01/30/2008 | CN100365812C Semiconductor device and method for producing high contrast identifying mark |
| 01/30/2008 | CN100365811C Interconnect for a semiconductor device |
| 01/30/2008 | CN100365810C Diffusion and laser photoelectric coupling integrated circuit signal line |
| 01/30/2008 | CN100365809C Semiconductor device |
| 01/30/2008 | CN100365808C Narrow-pitch connector, electrostatic actuator, piezoelectric actuator, ink jet head |
| 01/30/2008 | CN100365807C Plural semiconductor devices in monolithic flip chip |
| 01/30/2008 | CN100365806C Semiconductor package with non-oxide copper-wire |
| 01/30/2008 | CN100365805C Soldered heat sink anchor and method of use |
| 01/30/2008 | CN100365804C Encapsulated integrated circuit component and its producing method |
| 01/30/2008 | CN100365803C Hermetic sealing cap and method for producing same |
| 01/30/2008 | CN100365798C Electronic device, assembly and methods of manufacturing an electronic device |
| 01/30/2008 | CN100365796C Semiconductor device and production method thereof |
| 01/30/2008 | CN100365792C Electronic device and method of manufacturing same |
| 01/30/2008 | CN100365784C Electronic circuit device and its manufacturing method and device |
| 01/30/2008 | CN100365782C Open-window type ball grid array semiconductor packaging elements and its producing method and used chip bearing elements |
| 01/30/2008 | CN100365760C Method for manufacturing semiconductor device, semeconductor device and electronic product |
| 01/30/2008 | CN100365737C Wiring material and wiring board using the same |
| 01/30/2008 | CN100365497C Display device and method for fabricating the same |
| 01/30/2008 | CN100364744C Semiconductor-sealing-purpose epoxy resin compound producing method |
| 01/29/2008 | US7325213 Nested design approach |
| 01/29/2008 | US7324333 Lock for notebook computer or other personal electronic device |