| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/16/2008 | CN100362666C Packaging structure of optical sensing chip and producing method thereof |
| 01/16/2008 | CN100362660C Semiconductor device and its production |
| 01/16/2008 | CN100362658C Ultraviolet blocking layer |
| 01/16/2008 | CN100362657C Inner connected bonding pads of semiconductor IC |
| 01/16/2008 | CN100362656C Semiconductor die package including drain clip |
| 01/16/2008 | CN100362655C Thermal interface materials; and compositions comprising indium and zinc |
| 01/16/2008 | CN100362654C Ball format array structure possessing heat sinks |
| 01/16/2008 | CN100362653C Display assembly |
| 01/16/2008 | CN100362652C Wire bond-less electronic component for use with an external circuit and method of manufacture |
| 01/16/2008 | CN100362651C Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators |
| 01/16/2008 | CN100362650C Semiconductor device having electrical contact from opposite sides and method therefor |
| 01/16/2008 | CN100362646C Semiconductor device, dram integrated circuit device, and method of producing the same |
| 01/16/2008 | CN100362617C Forming folded-stack packaged device using progressive folding tool |
| 01/16/2008 | CN100362358C Scatterometry structure with embedded ring oscillator, and methods of using same |
| 01/15/2008 | US7319598 Electronic component with a housing package |
| 01/15/2008 | US7319590 Conductive heat transfer system and method for integrated circuits |
| 01/15/2008 | US7319587 Electronic apparatus having pump unit |
| 01/15/2008 | US7319377 Method for making high-performance RF integrated circuits |
| 01/15/2008 | US7319277 Chip structure with redistribution traces |
| 01/15/2008 | US7319276 Substrate for pre-soldering material and fabrication method thereof |
| 01/15/2008 | US7319275 Adhesion by plasma conditioning of semiconductor chip |
| 01/15/2008 | US7319274 Methods for selective integration of airgaps and devices made by such methods |
| 01/15/2008 | US7319273 Methods and apparatus for a flexible circuit interposer |
| 01/15/2008 | US7319272 Ball assignment system |
| 01/15/2008 | US7319271 Semiconductor device |
| 01/15/2008 | US7319270 Multi-layer electrode and method of forming the same |
| 01/15/2008 | US7319269 Semiconductor device power interconnect striping |
| 01/15/2008 | US7319268 Semiconductor device having capacitors for reducing power source noise |
| 01/15/2008 | US7319267 Semiconductor device |
| 01/15/2008 | US7319266 Encapsulated electronic device structure |
| 01/15/2008 | US7319265 Semiconductor chip assembly with precision-formed metal pillar |
| 01/15/2008 | US7319264 Semiconductor device |
| 01/15/2008 | US7319239 Substrate for display device having a protective layer provided between the pixel electrodes and wirings of the active matrix substrate, manufacturing method for same, and display device |
| 01/15/2008 | US7319217 Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same |
| 01/15/2008 | US7319197 Structure of stacked vias in multiple layer electrode device carriers |
| 01/15/2008 | US7319066 Semiconductor device and method for fabricating the same |
| 01/15/2008 | US7319051 Thermally enhanced metal capped BGA package |
| 01/15/2008 | US7319050 Wafer level chip scale packaging structure and method of fabricating the same |
| 01/15/2008 | US7319049 Method of manufacturing an electronic parts packaging structure |
| 01/15/2008 | US7319042 Method and apparatus for manufacture and inspection of semiconductor device |
| 01/15/2008 | US7318729 Sheet-form connector and production method and application therefor |
| 01/15/2008 | US7318337 Method and apparatus for measuring frequency characteristics of acceleration sensor |
| 01/15/2008 | CA2350705C Non-contact data carrier and ic chip |
| 01/15/2008 | CA2238754C Method of mounting a chip on a flexible foil substrate for positioning on a capsule |
| 01/10/2008 | WO2008005944A2 Systems and methods for alignment of laser beam (s) for semiconductor link processing |
| 01/10/2008 | WO2008005911A2 Exposed top side copper leadframe manufacturing |
| 01/10/2008 | WO2008005682A1 Attachment for socket and semiconductor device-testing unit having the same |
| 01/10/2008 | WO2008005586A2 Flipped, stacked-chip ic packaging for high bandwidth data transfer buses |
| 01/10/2008 | WO2008005486A2 Electronic module configured for air flow therethrough and system including same |
| 01/10/2008 | WO2008005399A1 Applications of smart polymer composites to integrated circuit packaging |
| 01/10/2008 | WO2008005228A2 Coating compositions and related products and methods |
| 01/10/2008 | WO2008004889A1 Photovoltaic apparatus |
| 01/10/2008 | WO2008004851A1 A hybrid substrate and method of manufacturing the same |
| 01/10/2008 | WO2008004552A1 Ceramic-metal bonded body, method for manufacturing the bonded body and semiconductor device using the bonded body |
| 01/10/2008 | WO2008004151A2 Power supply network |
| 01/10/2008 | WO2008003912A2 Process for producing moulding powder |
| 01/10/2008 | WO2008003545A1 Flexible conductor and use of a glass fiber material and a resin for the flexible conductor |
| 01/10/2008 | WO2008003535A1 Circuit carrier device |
| 01/10/2008 | WO2008003308A1 Method for attaching electronic components to a support by means of pressure sintering and circuit arrangement |
| 01/10/2008 | WO2008003223A1 Semiconductor package system and method of improving heat dissipation of a semiconductor package |
| 01/10/2008 | WO2008003176A1 Lighting device package |
| 01/10/2008 | WO2008003167A1 Lighting device package |
| 01/10/2008 | WO2006104562A3 Method of forming a semiconductor device having asymmetric dielectric regions and structure thereof |
| 01/10/2008 | US20080009153 Semiconductor package and method of making the same |
| 01/10/2008 | US20080009131 Post passivation interconnection schemes on top of the ic chips |
| 01/10/2008 | US20080009130 Underfill and mold compounds including siloxane-based aromatic diamines |
| 01/10/2008 | US20080009125 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 01/10/2008 | US20080009105 Silicide-silicon oxide-semiconductor antifuse device and method of making |
| 01/10/2008 | US20080009098 Structure of high performance combo chip and processing method |
| 01/10/2008 | US20080009087 Miniature optical element for wireless bonding in an electronic instrument |
| 01/10/2008 | US20080009083 Semiconductor device with electrode pad having probe mark |
| 01/10/2008 | US20080007918 Power semiconductor module with connection elements electrically insulated from one another |
| 01/10/2008 | US20080007696 Projection led cooling |
| 01/10/2008 | US20080006952 Misalignment detection devices |
| 01/10/2008 | US20080006951 Copper bonding compatible bond pad structure and method |
| 01/10/2008 | US20080006950 Bonding pad structure for electronic device |
| 01/10/2008 | US20080006949 Semiconductor package and method of fabricating the same |
| 01/10/2008 | US20080006948 Stack die packages |
| 01/10/2008 | US20080006947 Semiconductor device and method of manufacturing the same |
| 01/10/2008 | US20080006946 Post passivation interconnection schemes on top of the ic chips |
| 01/10/2008 | US20080006945 Integrated circuit and method for fabricating the same |
| 01/10/2008 | US20080006944 Interconnect structure and method of fabrication of same |
| 01/10/2008 | US20080006943 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
| 01/10/2008 | US20080006942 Bottom substrate of package on package and manufacturing method thereof |
| 01/10/2008 | US20080006941 Semiconductor package and method of manufacturing the same |
| 01/10/2008 | US20080006940 Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames |
| 01/10/2008 | US20080006939 Packaging of hybrib integrated circuits |
| 01/10/2008 | US20080006938 Method for bonding wafers to produce stacked integrated circuits |
| 01/10/2008 | US20080006937 Solderability Improvement Method for Leaded Semiconductor Package |
| 01/10/2008 | US20080006936 Superfine-circuit semiconductor package structure |
| 01/10/2008 | US20080006935 Semiconductor device with pipe for passing refrigerant liquid |
| 01/10/2008 | US20080006934 Flip Chip Package Including a Non-Planar Heat Spreader and Method of Making the Same |
| 01/10/2008 | US20080006933 Heat-dissipating package structure and fabrication method thereof |
| 01/10/2008 | US20080006932 Semiconductor device |
| 01/10/2008 | US20080006931 Semiconductor constructions and assemblies, electronic systems, and methods of forming semiconductor constructions and assemblies |
| 01/10/2008 | US20080006930 Semiconductor package |
| 01/10/2008 | US20080006929 Integrated circuit package system with ground bonds |
| 01/10/2008 | US20080006928 Composite multi-layer substrate and module using the substrate |
| 01/10/2008 | US20080006927 Manufacturing Process For Single-Chip MMC/SD Flash Memory Device With Molded Asymmetric Circuit Board |
| 01/10/2008 | US20080006926 Integrated circuit package system with stiffener |