| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/27/2008 | CN100372116C Packaging structure of contact type sensor and its manufacturing method |
| 02/27/2008 | CN100372115C Method for manufacturing silicon rectifier as electro static discharge protection |
| 02/27/2008 | CN100372114C Semiconductor device including a protection circuit |
| 02/27/2008 | CN100372113C Integrated circuit structure with air gap and manufacturing method thereof |
| 02/27/2008 | CN100372112C Semiconductor package and semiconductor deivce |
| 02/27/2008 | CN100372111C Embedded packaging structure and its packaging method |
| 02/27/2008 | CN100372110C Semiconductor device and manufacturing method for the same |
| 02/27/2008 | CN100372109C Wafer stage package and manufacturing method thereof, and method for manufacturing semiconductor device made up of same |
| 02/27/2008 | CN100372108C Radiating moudle of electronic device |
| 02/27/2008 | CN100372107C Liquid-cooled heat sink |
| 02/27/2008 | CN100372106C Heat sink |
| 02/27/2008 | CN100372105C Semiconductor device and method of manufacturing same |
| 02/27/2008 | CN100372104C Substrate plated with enhanced welding pad structure |
| 02/27/2008 | CN100372103C Flip ball grid array packaging base plate and making technique thereof |
| 02/27/2008 | CN100372102C Multiple die interconnect system |
| 02/27/2008 | CN100372091C Semiconductor device and method for evaluating characteristics of the same |
| 02/27/2008 | CN100372085C Automatic assembing machine |
| 02/27/2008 | CN100372084C Method for manufacturing. heat reinforced ball grid array IC packaging substrate and packaging substrate |
| 02/27/2008 | CN100372079C Method of manufacturing semiconductor device having nitride film with improved insulating properties |
| 02/27/2008 | CN100372078C Semiconductor and method for fabricating the same |
| 02/27/2008 | CN100372056C Semiconductor device and producing method thereof |
| 02/27/2008 | CN100372053C Manufacturing tool for wafer level package and method of placing dies |
| 02/27/2008 | CN100371948C Method of manufacturing data carrier by support belt and support belt used in the method |
| 02/27/2008 | CN100371855C High efficiency porous radiation fin array |
| 02/27/2008 | CN100371854C Liquid cooling type heat sink |
| 02/27/2008 | CN100371385C Acrylic-based thermally conductive composition and thermally conductive sheet |
| 02/27/2008 | CN100371368C Preparation method of sealing packing material for in vivo embedding microelectronic device |
| 02/27/2008 | CN100371045C Method of crystallizing organic oligomer, epoxy resin composition containing organic oligomer obtained by the method and epoxy resin cured material |
| 02/26/2008 | USRE40112 Semiconductor package and method for fabricating the same |
| 02/26/2008 | US7336496 Fixing structure for computer mainboard |
| 02/26/2008 | US7336495 Power component cooling device with a heat sink and one or more cooling fins |
| 02/26/2008 | US7336486 Synthetic jet-based heat dissipation device |
| 02/26/2008 | US7336460 Protection of an integrated circuit against electrostatic discharges |
| 02/26/2008 | US7336221 High frequency package, transmitting and receiving module and wireless equipment |
| 02/26/2008 | US7336086 Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure |
| 02/26/2008 | US7335996 Method of room temperature covalent bonding |
| 02/26/2008 | US7335995 Microelectronic assembly having array including passive elements and interconnects |
| 02/26/2008 | US7335994 Semiconductor component having multiple stacked dice |
| 02/26/2008 | US7335993 Multi chip package |
| 02/26/2008 | US7335992 Semiconductor apparatus with improved yield |
| 02/26/2008 | US7335991 Pattern forming structure, pattern forming method, device, electro-optical device, and electronic apparatus |
| 02/26/2008 | US7335990 Process of forming a composite diffusion barrier in copper/organic low-k damascene technology |
| 02/26/2008 | US7335989 Semiconductor device and production method therefor |
| 02/26/2008 | US7335988 Use of palladium in IC manufacturing with conductive polymer bump |
| 02/26/2008 | US7335987 Semiconductor package and method for manufacturing the same |
| 02/26/2008 | US7335986 Wafer level chip scale package |
| 02/26/2008 | US7335985 Method and system for electrically coupling a chip to chip package |
| 02/26/2008 | US7335984 Microfluidics chips and methods of using same |
| 02/26/2008 | US7335983 Carbon nanotube micro-chimney and thermo siphon die-level cooling |
| 02/26/2008 | US7335982 Chip package structure and chip packaging process |
| 02/26/2008 | US7335981 Methods for creating electrophoretically insulated vias in semiconductive substrates |
| 02/26/2008 | US7335980 Hardmask for reliability of silicon based dielectrics |
| 02/26/2008 | US7335979 Device and method for tilted land grid array interconnects on a coreless substrate package |
| 02/26/2008 | US7335978 Semiconductor component having stiffener, circuit decal and terminal contacts |
| 02/26/2008 | US7335977 Semiconductor chip mounting arrangement |
| 02/26/2008 | US7335976 Crosstalk reduction in electrical interconnects using differential signaling |
| 02/26/2008 | US7335975 Integrated circuit stacking system and method |
| 02/26/2008 | US7335974 Multi stack packaging chip and method of manufacturing the same |
| 02/26/2008 | US7335973 Adhesive of folder package |
| 02/26/2008 | US7335972 Heterogeneously integrated microsystem-on-a-chip |
| 02/26/2008 | US7335971 Method for protecting encapsulated sensor structures using stack packaging |
| 02/26/2008 | US7335970 Semiconductor device having a chip-size package |
| 02/26/2008 | US7335968 High permeability composite films to reduce noise in high speed interconnects |
| 02/26/2008 | US7335967 Semiconductor device |
| 02/26/2008 | US7335966 Configurable integrated circuit capacitor array using via mask layers |
| 02/26/2008 | US7335965 Packaging of electronic chips with air-bridge structures |
| 02/26/2008 | US7335957 Semiconductor memory integrated circuit and layout method of the same |
| 02/26/2008 | US7335956 Capacitor device with vertically arranged capacitor regions of various kinds |
| 02/26/2008 | US7335955 ESD protection for passive integrated devices |
| 02/26/2008 | US7335954 Electrostatic discharge protection device |
| 02/26/2008 | US7335953 Circuit substrate, electro-optical device, and electronic apparatus |
| 02/26/2008 | US7335951 Semiconductor device and method for manufacturing the same |
| 02/26/2008 | US7335926 Package structure for light emitting diode and method thereof |
| 02/26/2008 | US7335918 Silicon nitride film and semiconductor device, and manufacturing method thereof |
| 02/26/2008 | US7335592 Wafer level package, multi-package stack, and method of manufacturing the same |
| 02/26/2008 | US7335591 Method for forming three-dimensional structures on a substrate |
| 02/26/2008 | US7335590 Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby |
| 02/26/2008 | US7335589 Method of forming contact via through multiple layers of dielectric material |
| 02/26/2008 | US7335585 Method for preventing the formation of a void in a bottom anti-reflective coating filling a via hole |
| 02/26/2008 | US7335582 Component |
| 02/26/2008 | US7335577 Crack stop for low K dielectrics |
| 02/26/2008 | US7335573 Vehicle, display device and manufacturing method for a semiconductor device |
| 02/26/2008 | US7335571 Method of making a semiconductor device having an opening in a solder mask |
| 02/26/2008 | US7335541 Method for fabricating thin film transistor using the mask for forming polysilicon including slit patterns deviated from each other |
| 02/26/2008 | US7335537 Method of manufacturing semiconductor device including bonding pad and fuse elements |
| 02/26/2008 | US7335535 Method and apparatus for lubricating microelectromechanical devices in packages |
| 02/26/2008 | US7335534 Semiconductor component and method of manufacture |
| 02/26/2008 | US7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another |
| 02/26/2008 | US7335532 Method of assembly for multi-flip chip on lead frame on overmolded IC package |
| 02/26/2008 | US7335531 Semiconductor device package and method of production and semiconductor device of same |
| 02/26/2008 | US7335529 Manufacturing method of a semiconductor device utilizing a flexible adhesive tape |
| 02/26/2008 | US7335528 Methods of nanotube films and articles |
| 02/26/2008 | US7335522 Package structure for light emitting diode and method thereof |
| 02/26/2008 | US7335517 Multichip semiconductor device, chip therefor and method of formation thereof |
| 02/26/2008 | US7335259 Growth of single crystal nanowires |
| 02/26/2008 | US7334630 Closed-loop microchannel cooling system |
| 02/26/2008 | US7334324 Method of manufacturing multilayer wiring board |
| 02/26/2008 | US7334320 Method of making an electronic fuse with improved ESD tolerance |
| 02/26/2008 | CA2457818C Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods |
| 02/21/2008 | WO2008021935A1 Thermal method to control underfill flow in semiconductor devices |