| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/03/2008 | US20080003806 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080003801 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 01/03/2008 | US20080003714 Chip-packaging with bonding options connected to a package substrate |
| 01/03/2008 | US20080003407 Circuitized substrate with dielectric layer having dielectric composition not including continuous or semi-continuous fibers |
| 01/03/2008 | US20080003351 Method for the manufacture of printed circuit boards with plated resistors |
| 01/03/2008 | US20080002460 Structure and method of making lidded chips |
| 01/03/2008 | US20080002379 Secure Electronic Entity Such as a Passport |
| 01/03/2008 | US20080001683 Integrated circuit incorporating wire bond inductance |
| 01/03/2008 | US20080001310 Multiple-dice packages with controlled underfill and methods of manufacture |
| 01/03/2008 | US20080001309 Semiconductor Device, Wiring Board, And Manufacturing Method Thereof |
| 01/03/2008 | US20080001308 Flip-chip package structure with stiffener |
| 01/03/2008 | US20080001307 Method, system, and apparatus for a secure bus on a printed circuit board |
| 01/03/2008 | US20080001306 High density nanostructured interconnection |
| 01/03/2008 | US20080001305 Semiconductor device and manufacturing method of same |
| 01/03/2008 | US20080001304 Stack package having pattern die redistribution |
| 01/03/2008 | US20080001303 Stacked, interconnected semiconductor packages |
| 01/03/2008 | US20080001302 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080001301 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080001300 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080001299 Method of manufacturing semiconductor device and semiconductor device |
| 01/03/2008 | US20080001298 Semiconductor device and method of fabricating the same |
| 01/03/2008 | US20080001297 Laser patterning and conductive interconnect/materials forming techniques for fine line and space features |
| 01/03/2008 | US20080001296 Bond pad structures and semiconductor devices using the same |
| 01/03/2008 | US20080001295 Method for reducing defects after a metal etching in semiconductor devices |
| 01/03/2008 | US20080001294 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080001293 Post passivation interconnection schemes on top of IC chip |
| 01/03/2008 | US20080001292 Hermetic Passivation Layer Structure for Capacitors with Perovskite or Pyrochlore Phase Dielectrics |
| 01/03/2008 | US20080001291 Semiconductor device and method of manufacturing the same |
| 01/03/2008 | US20080001290 Integrated circuit (IC) chip and method for fabricating the same |
| 01/03/2008 | US20080001289 Stacked-type wafer level package, method of manufacturing the same, wafer-level stack package and method of manufacturing the same |
| 01/03/2008 | US20080001288 Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus |
| 01/03/2008 | US20080001287 Semiconductor device having an inductor |
| 01/03/2008 | US20080001286 Shielded via |
| 01/03/2008 | US20080001285 Semiconductor package having embedded passive elements and method for manufacturing the same |
| 01/03/2008 | US20080001284 Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use |
| 01/03/2008 | US20080001283 Stack package with vertically formed heat sink |
| 01/03/2008 | US20080001282 Microelectronic assembly having a periphery seal around a thermal interface material |
| 01/03/2008 | US20080001281 Power amplifier module |
| 01/03/2008 | US20080001280 Ic Chip, Antenna, and Manufacturing Method of the Ic Chip and The Antenna |
| 01/03/2008 | US20080001278 Semiconductor device having terminals |
| 01/03/2008 | US20080001277 Semiconductor package system and method of improving heat dissipation of a semiconductor package |
| 01/03/2008 | US20080001276 Chip stack, chip stack package, and method of forming chip stack and chip stack package |
| 01/03/2008 | US20080001275 Planar Array Contact Memory Cards |
| 01/03/2008 | US20080001274 Rectangular Semi-Conducting Support for Microelectronics and Method for Making Same |
| 01/03/2008 | US20080001273 Semiconductor package having optimal interval between bond fingers for reduced substrate size |
| 01/03/2008 | US20080001272 System-in-package structure |
| 01/03/2008 | US20080001271 Flipped, stacked-chip IC packaging for high bandwidth data transfer buses |
| 01/03/2008 | US20080001270 Flexible joint methodology to attach a die on an organic substrate |
| 01/03/2008 | US20080001269 Conductive interconnects along the edge of a microelectronic device |
| 01/03/2008 | US20080001268 Heat spreader as mechanical reinforcement for ultra-thin die |
| 01/03/2008 | US20080001267 Alternative to desmear for build-up roughening and copper adhesion promotion |
| 01/03/2008 | US20080001264 Exposed top side copper leadframe manufacturing |
| 01/03/2008 | US20080001263 Integrated circuit package system |
| 01/03/2008 | US20080001262 Silicon level solution for mitigation of substrate noise |
| 01/03/2008 | US20080001259 Wafer With Improved Sawing Loops |
| 01/03/2008 | US20080001255 Semiconductor device |
| 01/03/2008 | US20080001244 System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System |
| 01/03/2008 | US20080001241 Structure and method of making lidded chips |
| 01/03/2008 | US20080001232 Substrate of liquid crystal device and method for manufacturing the same |
| 01/03/2008 | US20080001229 Semiconductor device |
| 01/03/2008 | US20080001222 Semiconductor Device Of High Breakdown Voltage And Manufacturing Method Thereof |
| 01/03/2008 | US20080001164 Flip chip type LED lighting device manufacturing method |
| 01/03/2008 | US20080001147 Semiconductor device and method for manufacturing the same |
| 01/03/2008 | US20080001146 Semiconductor device |
| 01/03/2008 | US20080001145 Handler for testing packaged chips |
| 01/03/2008 | US20080000948 Vent Closing Method And The Use Of An Ultrasonic Bonding Machine For Carrying Out The Method |
| 01/03/2008 | DE19823140B4 Abtast-Feldeffekttransistor Sample field effect transistor |
| 01/03/2008 | DE112004002138T5 Optobauteil-Gehäusekonstruktion Optocomponent housing construction |
| 01/03/2008 | DE10237326B4 Asymmetrische Vorrichtung zum Automatikbandbonden für eine Druckkopfpatrone Asymmetric device for automatic bonding tape for a print cartridge |
| 01/03/2008 | DE102007012818A1 Semiconductor device for use in inverter controller, has fastener with multiple fixing positions, formed along edge, forms opening and connection, which is fastened to edge and is electrically connected with semiconductor assembly substrate |
| 01/03/2008 | DE102006052753A1 Heat dissipation module for dissipating heat produced by electronic element, has heat dissipating plate, provided at upper side with multiple parallel grooves, which penetrate through front and rear front surface of heat dissipating plate |
| 01/03/2008 | DE102006030038A1 Sealing layer for an integrated circuit, comprises a hydrophilic region on the side, which is faces towards environment, and hydrophobic region facing away from the environment |
| 01/03/2008 | DE102006029142A1 Electrical circuit protecting method for use during electrostatic discharging, involves monitoring voltage on electrical circuit with holding circuit, which is connected with electrical circuit by connection |
| 01/03/2008 | DE102006013078B4 Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung Compact power semiconductor module with connector |
| 01/03/2008 | DE102006007797B4 Verfahren zur Herstellung eines Halbleiterbauelements sowie dessen Verwendung A process for producing a semiconductor device and its use |
| 01/03/2008 | CA2658027A1 Coated molecular sieve |
| 01/02/2008 | EP1874102A1 Wiring board with built-in capacitor |
| 01/02/2008 | EP1873923A1 High frequency module |
| 01/02/2008 | EP1873829A2 Semiconductor device |
| 01/02/2008 | EP1873828A2 Heat sink for electronic component |
| 01/02/2008 | EP1873827A1 Heat sink device |
| 01/02/2008 | EP1873826A2 Electronic component module |
| 01/02/2008 | EP1873812A1 Wafer frame |
| 01/02/2008 | EP1873692A2 Semiconductor device |
| 01/02/2008 | EP1872401A1 Electronic device package with an integrated evaporator |
| 01/02/2008 | EP1872400A1 Mounting assembly for optoelectronic devices |
| 01/02/2008 | EP1872396A1 Superjunction device having oxide lined trenches and method for manufacturing a superjunction device having oxide lined trenches |
| 01/02/2008 | EP1872387A2 Method and system for fabricating semiconductor components with through wire interconnects |
| 01/02/2008 | EP1676086A4 Flat plate heat transfer device |
| 01/02/2008 | EP1664652A4 System for configuring the geometric parameters for a micro channel heat exchanger |
| 01/02/2008 | EP1520294B1 Thin-film electronic device, in particular power device, and method for making same |
| 01/02/2008 | EP1442265A4 Heat collector with mounting plate |
| 01/02/2008 | EP1149419B1 Multi-chip module for use in high-power applications |
| 01/02/2008 | EP0928016B1 Process for manufacturing semiconductor wafer, semiconductor chip, and ic card |
| 01/02/2008 | CN201001252Y Radiation fin for PCB plate |
| 01/02/2008 | CN201001249Y Sunflower integrated heat pipe radiator |
| 01/02/2008 | CN201001248Y Fan latching structure |
| 01/02/2008 | CN201001247Y Pulsatile hot pipe type cooling plate |
| 01/02/2008 | CN201001246Y Fastener structure for heat radiator |
| 01/02/2008 | CN201001036Y Remote diode in cordless tool |