| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/09/2008 | CN101101908A LED module |
| 01/09/2008 | CN101101907A Making method for semiconductor part and semiconductor tube core |
| 01/09/2008 | CN101101906A An encapsulated chip and its encapsulation method for chip |
| 01/09/2008 | CN101101905A Semiconductor device mounted with fuse memory |
| 01/09/2008 | CN101101904A Metal line of semiconductor device and method of fabricating the same |
| 01/09/2008 | CN101101903A Interlayer wiring of semiconductor device using carbon nanotube and its production method |
| 01/09/2008 | CN101101902A Chip encapsulation structure and its circuit board |
| 01/09/2008 | CN101101901A Chip encapsulation structure |
| 01/09/2008 | CN101101900A Die configurations and methods of manufacture |
| 01/09/2008 | CN101101899A Laminose board, manufacturing method thereof, electronic element and device with the laminose board |
| 01/09/2008 | CN101101898A Bottom substrate of package on package and manufacturing method thereof |
| 01/09/2008 | CN101101897A Electronic device with the embedded semiconductor encapsulation part |
| 01/09/2008 | CN101101896A Semiconductor device for one-line protruding block interleaving detection |
| 01/09/2008 | CN101101895A Semiconductor power component |
| 01/09/2008 | CN101101894A Semiconductor structure and its making method |
| 01/09/2008 | CN101101890A Method of fabricating semiconductor device and semiconductor device fabricated thereby |
| 01/09/2008 | CN101101884A Semiconductor device with stacked chips and method for manufacturing thereof |
| 01/09/2008 | CN101101881A Heat-radiation type package structure and its method for making |
| 01/09/2008 | CN101101880A Heat-radiation type package structure and its method for making |
| 01/09/2008 | CN101101875A Electronic structure and method for forming medium film |
| 01/09/2008 | CN101101868A Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same |
| 01/09/2008 | CN101101272A Biochemical microsensing integrated chip, its manufacture and mould preparation method |
| 01/09/2008 | CN100361319C Manufacturing method of lead frame and optical coupling device using this lead frame |
| 01/09/2008 | CN100361300C Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same |
| 01/09/2008 | CN100361299C Packed module with positioning structure, electronic device and inspection after assembly |
| 01/09/2008 | CN100361298C Ball grid array package structure and its base plate |
| 01/09/2008 | CN100361297C Thin film transistor substrate and manufacturing method |
| 01/09/2008 | CN100361296C Print circuit board with improved heat rejection structure and electronic device |
| 01/09/2008 | CN100361295C Radiator and its noise reducing method |
| 01/09/2008 | CN100361294C Cooling structure of electronic element |
| 01/09/2008 | CN100361293C Exposed active element base module with embedded passive element |
| 01/09/2008 | CN100361291C Integrate circuit and method for making the same |
| 01/09/2008 | CN100361290C Differentially doped copper enchasing structure and its manufacturing method |
| 01/09/2008 | CN100361289C Method of forming a raised contact for a substrate |
| 01/09/2008 | CN100361285C Wire bonding method and semiconductor device |
| 01/09/2008 | CN100361284C IC packing substrate structure and its manufacture |
| 01/09/2008 | CN100361272C Multilayer device and its producing method |
| 01/09/2008 | CN100360627C Flexible heat sink |
| 01/09/2008 | CN100360597C Material for insulating substrate and products therefrom |
| 01/08/2008 | US7317633 Protection of NROM devices from charge damage |
| 01/08/2008 | US7317615 Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment |
| 01/08/2008 | US7317258 Thermal interface apparatus, systems, and fabrication methods |
| 01/08/2008 | US7317257 Inhibiting underfill flow using nanoparticles |
| 01/08/2008 | US7317256 Electronic packaging including die with through silicon via |
| 01/08/2008 | US7317255 Reliable printed wiring board assembly employing packages with solder joints |
| 01/08/2008 | US7317254 Semiconductor device mounting structure for reducing thermal stress and warpage |
| 01/08/2008 | US7317252 Ohmic contact configuration |
| 01/08/2008 | US7317251 Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components |
| 01/08/2008 | US7317250 High density memory card assembly |
| 01/08/2008 | US7317249 Microelectronic package having stacked semiconductor devices and a process for its fabrication |
| 01/08/2008 | US7317248 Memory module having memory chips protected from excessive heat |
| 01/08/2008 | US7317247 Semiconductor package having heat spreader and package stack using the same |
| 01/08/2008 | US7317246 Package for electronic device and method for manufacturing electronic device |
| 01/08/2008 | US7317245 Method for manufacturing a semiconductor device substrate |
| 01/08/2008 | US7317244 Semiconductor device and manufacturing method thereof |
| 01/08/2008 | US7317243 Encapsulated lead having step configuration |
| 01/08/2008 | US7317241 Semiconductor apparatus having a large-size bus connection |
| 01/08/2008 | US7317240 Redundant interconnect high current bipolar device and method of forming the device |
| 01/08/2008 | US7317228 Optimization of NMOS drivers using self-ballasting ESD protection technique in fully silicided CMOS process |
| 01/08/2008 | US7317224 Semiconductor device |
| 01/08/2008 | US7317221 High density MIM capacitor structure and fabrication process |
| 01/08/2008 | US7317216 Ultrasensitive biochemical sensing platform |
| 01/08/2008 | US7317204 Test structure of semiconductor device |
| 01/08/2008 | US7317203 Method and monitor structure for detecting and locating IC wiring defects |
| 01/08/2008 | US7317199 Circuit device |
| 01/08/2008 | US7317165 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 01/08/2008 | US7316954 Methods of fabricating integrated circuit devices that utilize doped poly-Si1−xGex conductive plugs as interconnects |
| 01/08/2008 | US7316939 Semiconductor device manufacturing method and manufacturing apparatus |
| 01/08/2008 | US7316935 Reticle for layout modification of wafer test structure areas |
| 01/08/2008 | US7316790 Securing a document by applying a metal sulfide phosphor powder containing particles that are spherical and have an average particle size of 0.3 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths |
| 01/08/2008 | US7316789 Conducting liquid crystal polymer nature comprising carbon nanotubes, use thereof and method of fabrication |
| 01/08/2008 | US7316725 Copper powders methods for producing powders and devices fabricated from same |
| 01/08/2008 | US7316266 Liquid-cooled pipe |
| 01/08/2008 | US7316265 Method for passive phase change thermal management |
| 01/08/2008 | US7316263 Cold plate |
| 01/08/2008 | US7316174 Cutting machine for plate-shaped material |
| 01/08/2008 | US7316063 Methods of fabricating substrates including at least one conductive via |
| 01/08/2008 | US7316061 Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface |
| 01/08/2008 | CA2443149C Semiconductor device and method of manufacturing the same |
| 01/08/2008 | CA2287814C Grid control electrode manufacturing process for igbt transistor |
| 01/03/2008 | WO2008003051A2 Stress mitigation in packaged microchips |
| 01/03/2008 | WO2008003010A1 Silicon level solution for mitigation of substrate noise |
| 01/03/2008 | WO2008002944A1 Flexible joint methodology to attach a die on an organic substrate |
| 01/03/2008 | WO2008002376A2 Electrical connector with elongated ground contacts |
| 01/03/2008 | WO2008002268A1 Ltcc substrate structure |
| 01/03/2008 | WO2008002088A1 Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
| 01/03/2008 | WO2008001915A1 Wiring board, semiconductor device using wiring board and their manufacturing methods |
| 01/03/2008 | WO2008001698A1 Substrate processing method and substrate processing apparatus |
| 01/03/2008 | WO2008001697A1 Substrate processing method and substrate processing apparatus |
| 01/03/2008 | WO2008001282A2 Flip-chip interconnection with a small passivation layer opening |
| 01/03/2008 | WO2008001248A2 Integrated circuit |
| 01/03/2008 | WO2008000949A1 Adjustable capacity device and process thereof |
| 01/03/2008 | WO2008000551A2 Cooling member |
| 01/03/2008 | WO2008000457A2 Coated molecular sieve |
| 01/03/2008 | WO2008000425A1 Method for producing a transponder |
| 01/03/2008 | WO2007130706A3 Electronic assemly and method for forming the same |
| 01/03/2008 | WO2007087247A3 Wafer level chip packaging |
| 01/03/2008 | WO2006094025A3 Fabricated adhesive microstructures for making an electrical connection |
| 01/03/2008 | US20080003849 S&P2 CWW1 connector with wipe |
| 01/03/2008 | US20080003807 Post passivation interconnection schemes on top of the IC Chips |