| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 01/23/2008 | CN101110436A Array substrate and LCD with the same |
| 01/23/2008 | CN101110434A Tft array substrate and manufacturing method thereof, and display device using such substrate |
| 01/23/2008 | CN101110433A Semiconductor device and manufacturing method thereof |
| 01/23/2008 | CN101110430A System for displaying images including thin film transistor device and method for fabricating the same |
| 01/23/2008 | CN101110428A Multi-layer insulator silicon material used for MEMS and method thereof |
| 01/23/2008 | CN101110424A Dual port memory device with reduced coupling effect |
| 01/23/2008 | CN101110419A Integrated circuit structure with metallic programmable sheet metal used for generating identification data and manufacturing method thereof |
| 01/23/2008 | CN101110415A Uninsulated double tower type diode |
| 01/23/2008 | CN101110413A Semiconductor apparatus |
| 01/23/2008 | CN101110411A Semiconductor package and its manufacturing method |
| 01/23/2008 | CN101110410A Power semiconductor device |
| 01/23/2008 | CN101110409A System packaging package |
| 01/23/2008 | CN101110408A Light emitting diode module group |
| 01/23/2008 | CN101110407A Light emitting diode module group |
| 01/23/2008 | CN101110406A Multiple chip packaging structure and its packaging method |
| 01/23/2008 | CN101110405A Semiconductor structure having extra power/ground source connections and layout method thereof |
| 01/23/2008 | CN101110404A Hybrid integrated circuit device, and method for fabricating the same, and electronic device |
| 01/23/2008 | CN101110403A Chip packaging structure and its manufacturing method |
| 01/23/2008 | CN101110402A 半导体芯片 Semiconductor chip |
| 01/23/2008 | CN101110401A Interconnect structure for semiconductor package |
| 01/23/2008 | CN101110400A Wafer structure |
| 01/23/2008 | CN101110399A Chip packaging structure |
| 01/23/2008 | CN101110398A Flip chip and its manufacturing method |
| 01/23/2008 | CN101110397A Chip packaging structure |
| 01/23/2008 | CN101110396A Chip packaging structure and its packaging manufacture process |
| 01/23/2008 | CN101110395A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/23/2008 | CN101110394A Semiconductor substrate having low defects and method of manufacturing the same |
| 01/23/2008 | CN101110389A Semiconductor wafer and manufacturing method therefor |
| 01/23/2008 | CN101110386A Process for improving the reliability of interconnect structures and resulting structure |
| 01/23/2008 | CN101110385A Method for integrating insulation film between fluorine doped silicon oxide glass layers |
| 01/23/2008 | CN101110377A Method for forming soldering projection |
| 01/23/2008 | CN101110376A Method for forming soldering projection and its etchant |
| 01/23/2008 | CN101110374A Module and method of manufacturing the same |
| 01/23/2008 | CN101110371A Chip packaging manufacturing method and its structure |
| 01/23/2008 | CN101110370A Radiating packaging structure and manufacturing method thereof |
| 01/23/2008 | CN101110369A 半导体封装件及其制法 Semiconductor package Jiqizhifa |
| 01/23/2008 | CN101110367A Substrate and its layout method |
| 01/23/2008 | CN101110366A Semiconductor substrate with bare conducting circuit and forming method thereof |
| 01/23/2008 | CN101110293A Micro power converter and method of manufacturing same |
| 01/23/2008 | CN101109502A High power led lamp with heat dissipation enhancement |
| 01/23/2008 | CN101109501A Cooling device for light emitting diode (led) module and method for fabricating the same |
| 01/23/2008 | CN101109500A High-power cluster light emitting diode lighting equipment of coupling high efficiency soaking/radiating module |
| 01/23/2008 | CN100364093C High-voltage electrostatic discharging protector with gap structure |
| 01/23/2008 | CN100364092C Semiconductor device and its producing method |
| 01/23/2008 | CN100364091C Semiconductor device and its producing method |
| 01/23/2008 | CN100364090C Light-thin laminated packaged semiconductor device and manufacturing process thereof |
| 01/23/2008 | CN100364089C Substrate-triggered ESD circuit by using triple-well |
| 01/23/2008 | CN100364088C Receptacle for a programmable, electronic processing device |
| 01/23/2008 | CN100364087C Semiconductor device and its mfg. method, circuidboard, electronic device and apparatus for mfg. semiconductor device |
| 01/23/2008 | CN100364086C Semiconductor device and electronic device, and methods for manufacturing thereof |
| 01/23/2008 | CN100364085C Air outlet flow guiding structure of radiating fan |
| 01/23/2008 | CN100364084C Air outlet flow guiding structure of radiating fan |
| 01/23/2008 | CN100364083C 热管 Heat pipe |
| 01/23/2008 | CN100364082C Electronic assembly having heat pipe that conducts heat from semicanductor substrate |
| 01/23/2008 | CN100364081C Radiator and producing method thereof |
| 01/23/2008 | CN100364080C Heat sink and manufacturing method |
| 01/23/2008 | CN100364079C Heating radiator and method for making same |
| 01/23/2008 | CN100364078C Circuit board, process for producing the same and power module |
| 01/23/2008 | CN100364077C High wireability microvia substrate |
| 01/23/2008 | CN100364076C Bridging chip package structure |
| 01/23/2008 | CN100364074C Method of making a low profile highly-packaged semiconductor device |
| 01/23/2008 | CN100364073C Welding pad layout method and structure |
| 01/23/2008 | CN100364072C Motor drive device with power semiconductor module life testing function |
| 01/23/2008 | CN100364043C Semiconductor device, electrical inspection method thereof, and electronic apparatus including the semiconductor device |
| 01/23/2008 | CN100364042C Method of manufacturing substrate joint body, substrate joint body and electrooptical device |
| 01/23/2008 | CN100363864C Cooler for several heating elements |
| 01/22/2008 | US7321495 Capacitor and method for manufacturing the same |
| 01/22/2008 | US7321492 Heat sink module for an electronic device |
| 01/22/2008 | US7321455 Microelectronic devices and methods for packaging microelectronic devices |
| 01/22/2008 | US7321252 Semiconductor integrated circuit |
| 01/22/2008 | US7321172 Selective plating of package terminals |
| 01/22/2008 | US7321171 Semiconductor integrated circuit device |
| 01/22/2008 | US7321170 High frequency semiconductor device |
| 01/22/2008 | US7321169 Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus |
| 01/22/2008 | US7321168 Semiconductor package and method for manufacturing the same |
| 01/22/2008 | US7321167 Flex tape architecture for integrated circuit signal ingress/egress |
| 01/22/2008 | US7321166 Wiring board having connecting wiring between electrode plane and connecting pad |
| 01/22/2008 | US7321165 Semiconductor device and its manufacturing method |
| 01/22/2008 | US7321164 Stack structure with semiconductor chip embedded in carrier |
| 01/22/2008 | US7321163 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 01/22/2008 | US7321162 Semiconductor package having reduced thickness |
| 01/22/2008 | US7321161 LED package assembly with datum reference feature |
| 01/22/2008 | US7321160 Multi-part lead frame |
| 01/22/2008 | US7321099 Component mounting substrate and structure |
| 01/22/2008 | US7321098 Laminate ceramic circuit board and process therefor |
| 01/22/2008 | US7321097 Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same |
| 01/22/2008 | US7321005 Encapsulant composition and electronic package utilizing same |
| 01/22/2008 | US7320940 Method for manufacturing electronic device including package |
| 01/22/2008 | US7320935 Semiconductor device using an interconnect |
| 01/22/2008 | US7320933 Double bumping of flexible substrate for first and second level interconnects |
| 01/22/2008 | US7320932 Semiconductor device and manufacturing method thereof |
| 01/22/2008 | US7320918 Method and structure for buried circuits and devices |
| 01/22/2008 | US7320917 Semiconductor device and method for manufacturing the same |
| 01/22/2008 | US7320906 Thin film transistor array panel and manufacturing method thereof |
| 01/22/2008 | US7320903 Apparatus for and method of packaging semiconductor devices |
| 01/22/2008 | US7320902 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
| 01/22/2008 | US7320817 Holding structure and a molding with the same |
| 01/22/2008 | US7320738 Method for encapsulation of a chip card and module obtained thus |
| 01/22/2008 | US7320177 Radiator and method of manufacturing the same |
| 01/22/2008 | CA2450412C Support with getter-material for microelectronic, microoptoelectronic or micromechanical device |