| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/28/2008 | DE112005000672T5 Kühlen eines Chips mit integrierter Schaltung mit Kühlflüssigkeit in einem Mikrokanal und eine thermoelektrischer Dünnfilm-Kühlvorrichtung im Mikrokanal Cooling an integrated circuit chip with the cooling liquid in a micro channel and a thin film thermoelectric cooling device in the microchannel |
| 02/28/2008 | DE10256346B4 Halbleiterbauelement mit MIM-Kondensator und Zwischenverbindung und Herstellungsverfahren dafür A semiconductor device with MIM capacitor and the interconnect and production method thereof |
| 02/28/2008 | DE102007034182A1 Elektronische Gehäuse mit aufgerauhten Benetzungs- und Nicht-Benetzungs-Zonen Electronic housing with roughened wetting and non-wetting zones |
| 02/28/2008 | DE102006039789A1 Flächiges Leuchtelement sowie Verwendung des flächigen Leuchtelementes Two-dimensional light-emitting element and use the flat luminous element |
| 02/28/2008 | DE102006038997A1 Leadframemagazin-Magazindeckel Lead frame magazine magazine cover |
| 02/28/2008 | DE102006028719A1 Halbleiterbauteil mit Halbleiterchipstapel und Verbindungselementen sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising semiconductor chip stack, and connecting elements and processes for producing the semiconductor device |
| 02/28/2008 | DE102005056908B4 Integrierte Schaltungsanordnung mit Shockleydiode oder Thyristor und Verfahren zum Herstellen Integrated circuit arrangement with Shockleydiode or thyristor and methods for preparing |
| 02/27/2008 | EP1893010A1 Cooling assembly |
| 02/27/2008 | EP1892760A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 02/27/2008 | EP1892754A2 Method of electroplating solder bumps of uniform height on integrated circuit substrates |
| 02/27/2008 | EP1892537A2 Manufacturing method for magnetic sensor and lead frame therefor |
| 02/27/2008 | EP1891845A2 Circuit board structure and method for manufacturing a circuit board structure |
| 02/27/2008 | EP1891843A1 Method for manufacturing a circuit board structure, and a circuit board structure |
| 02/27/2008 | EP1891672A2 Selectively grooved cold plate for electronics cooling |
| 02/27/2008 | EP1891661A1 Test cells for semiconductor yield improvement |
| 02/27/2008 | EP1890872A1 Solder joints for copper metallization having reduced interfacial voids |
| 02/27/2008 | EP1754401B1 Heat spreader with controlled z-axis conductivity |
| 02/27/2008 | EP1535325A4 Method of preventing shift of alignment marks during rapid thermal processing |
| 02/27/2008 | EP1500147A4 Modular thermoelectric couple and stack |
| 02/27/2008 | EP1279189B1 A method of forming a conductive coating on a semiconductor device |
| 02/27/2008 | EP1044473B1 Low-inductance, gate-controlled thyristor |
| 02/27/2008 | CN201029094Y Domain improved structure of SMD light emitting diode bracket |
| 02/27/2008 | CN201029093Y Radiator structure used for semiconductor lamp body |
| 02/27/2008 | CN201029092Y Radiator unit adopting large-area flat plate type heat pipes |
| 02/27/2008 | CN201029091Y Commutating combined element of automotive alternator |
| 02/27/2008 | CN101133492A Lead frame |
| 02/27/2008 | CN101133491A Lead-free and multi-layers preplated leadframe |
| 02/27/2008 | CN101133490A Redistributed solder pads using etched lead frame |
| 02/27/2008 | CN101133484A A method of manufacturing semiconductor packages and packages made |
| 02/27/2008 | CN101133480A Semiconductor device and method for manufacturing same |
| 02/27/2008 | CN101133478A Simultaneous and selective partitioning of via structures using plating resist |
| 02/27/2008 | CN101133295A Heat pipe and method for manufacturing same |
| 02/27/2008 | CN101133120A Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 02/27/2008 | CN101133097A Hardening accelerator, hardenable resin composition, and electronic component device |
| 02/27/2008 | CN101132687A Heat radiating device for high-power electronic component |
| 02/27/2008 | CN101132686A Metal and graphite combined cooling structure |
| 02/27/2008 | CN101132685A Heat radiating device |
| 02/27/2008 | CN101132684A Heat radiating device |
| 02/27/2008 | CN101132683A Heat radiating device |
| 02/27/2008 | CN101132682A Fixed part and its manufacturing method, combination of radiating devices using the fixed part |
| 02/27/2008 | CN101132680A Water-cooling radiating device with alarm to exception status and its alarm method |
| 02/27/2008 | CN101132169A Ceramic packing member used for SMD crystal resonator and manufacturing technique thereof |
| 02/27/2008 | CN101132044A Methods of forming semiconductor light emitting device packages by liquid injection molding and molded semiconductor light emitting device strips |
| 02/27/2008 | CN101132039A Improvement of LED radiating structure |
| 02/27/2008 | CN101132035A Substrate suitable for packaging ultra thin LED and packaging method thereof |
| 02/27/2008 | CN101132019A Organic light emitting display device and method of fabricating the same |
| 02/27/2008 | CN101132012A Glass flip-chip packaging construction for image sensor |
| 02/27/2008 | CN101132011A Array substrate with copper conductors, display device having the same and method of manufacturing the same |
| 02/27/2008 | CN101132010A Semiconductor device and method of manufacturing the same |
| 02/27/2008 | CN101132008A Contact structure having a barrier layer containing noble metal, ferroelectric random access memory device employing the same and methods of fabricating the same |
| 02/27/2008 | CN101132005A Multi-bit electromechanical memory devices and methods of manufacturing the same |
| 02/27/2008 | CN101132004A Semiconductor device and method for manufacturing same |
| 02/27/2008 | CN101131999A Semiconductor integrated circuit and testing method of same |
| 02/27/2008 | CN101131998A Conductor screening pattern and semiconductor structure with inductance element |
| 02/27/2008 | CN101131997A Image sensor and fabricating method thereof |
| 02/27/2008 | CN101131996A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131995A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131994A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131993A Packaging structure of conducting wire holder on multi-chip stacking structure |
| 02/27/2008 | CN101131992A Multi-chip stacking type packaging structure |
| 02/27/2008 | CN101131991A Thickness reduced multi-chip stacking and packaging construction |
| 02/27/2008 | CN101131990A Stacked chip packaging construction |
| 02/27/2008 | CN101131989A Electrically reprogrammable efuse device, its manufacturing method and integrated circuit device |
| 02/27/2008 | CN101131988A Radiating type thin-film flip-chip packaging construction |
| 02/27/2008 | CN101131987A Thin-film flip-chip packaging construction and multilayer circuit rewinding structure |
| 02/27/2008 | CN101131986A Method for manufacturing lead frame structure, semiconductor device and flip device |
| 02/27/2008 | CN101131985A Semiconductor package structure and method of manufacture |
| 02/27/2008 | CN101131984A Semiconductor device and fabricating method thereof |
| 02/27/2008 | CN101131983A Connector and light transmitting receiving module |
| 02/27/2008 | CN101131982A Non-pin packaging structure of semiconductor element and packaging technology thereof |
| 02/27/2008 | CN101131981A Thin-film flip-chip packaging construction and circuit thin-film used for it |
| 02/27/2008 | CN101131980A Wafer packaging construction with array connecting pad and method of manufacturing the same |
| 02/27/2008 | CN101131979A Non-exterior pin semiconductor packaging construction plated in sealing glue and method of manufacturing the same |
| 02/27/2008 | CN101131978A Integrated circuit packaging construction and multi-layer conducting wire holder used for it |
| 02/27/2008 | CN101131977A High-frequency integrated circuit packaging construction for improving connectivity of embedded projection and manufacturing method thereof |
| 02/27/2008 | CN101131976A 半导体装置及半导体封装件 Semiconductor device and semiconductor package |
| 02/27/2008 | CN101131975A Stack type projection structure and manufacturing method thereof |
| 02/27/2008 | CN101131974A Packaging structure and radiator piece thereof |
| 02/27/2008 | CN101131973A Heat radiating device |
| 02/27/2008 | CN101131972A Packaging structure |
| 02/27/2008 | CN101131971A Semiconductor packaging construction for mold-sealing array processing and its manufacture process |
| 02/27/2008 | CN101131970A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/27/2008 | CN101131969A Semiconductor substrate |
| 02/27/2008 | CN101131968A Semiconductor device and method for manufacturing the same |
| 02/27/2008 | CN101131967A Semiconductor component protection structure and its manufacturing method |
| 02/27/2008 | CN101131947A Spatial packaging structure and method of manufacturing the same |
| 02/27/2008 | CN101131944A Fabricating method for semiconductor device |
| 02/27/2008 | CN101131943A Fabricating method for semiconductor device |
| 02/27/2008 | CN101131942A Packaging method for LED with rare color of LED homogeneous light |
| 02/27/2008 | CN101131941A Semiconductor chip packaging process and its structure |
| 02/27/2008 | CN101131938A Ram lead frame and its manufacturing method |
| 02/27/2008 | CN101131915A Packaging structure with protection layer and packaging structure thereof |
| 02/27/2008 | CN101131517A Array substrate for organic thin film transistor liquid crystal display device and method of manufacturing the same |
| 02/27/2008 | CN101131512A Encapsulated display devices |
| 02/27/2008 | CN101131455A LSI package provided with interface module and method of mounting the same |
| 02/27/2008 | CN101130861A Tin phosphate barrier film, method and apparatus |
| 02/27/2008 | CN101130461A Underlay substrate semiconductor material for illuminating and heat radiating |
| 02/27/2008 | CN100372120C Ultra-small integrated circuit of inductive component including high quality factor |
| 02/27/2008 | CN100372118C ESD protection circuit |
| 02/27/2008 | CN100372117C Electrostatic discharging protection device for high-voltage assembly and its manufacturing method |