| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/04/2008 | US7338867 Semiconductor device having contact pads and method for manufacturing the same |
| 03/04/2008 | US7338853 High power radio frequency integrated circuit capable of impeding parasitic current loss |
| 03/04/2008 | US7338843 Method for producing an electronic component, especially a memory chip |
| 03/04/2008 | US7338841 Leadframe with encapsulant guide and method for the fabrication thereof |
| 03/04/2008 | US7338838 Resin-encapsulation semiconductor device and method for fabricating the same |
| 03/04/2008 | US7338837 Semiconductor packages for enhanced number of terminals, speed and power performance |
| 03/04/2008 | US7338836 Method for integrating pre-fabricated chip structures into functional electronic systems |
| 03/04/2008 | US7338723 For a semiconductor production and/or inspection apparatus; the average concentration of free carbon in the work mounting portion is different from the average concentration of free carbon in the base layer |
| 03/04/2008 | US7338568 Method and arrangement for attaching labels to semiconductor modules |
| 03/04/2008 | US7337829 Cooling unit |
| 03/04/2008 | US7337513 Method of making chip type solid electrolytic capacitor having a small size and a simple structure |
| 02/28/2008 | WO2008024845A2 Semiconductive device having improved copper density for package-on-package applications |
| 02/28/2008 | WO2008024368A2 Article having multi-functional elements |
| 02/28/2008 | WO2008024322A1 Shielding floating gate tunneling element structure |
| 02/28/2008 | WO2008023827A1 Semiconductor device |
| 02/28/2008 | WO2008023826A1 Semiconductor device and its manufacturing method |
| 02/28/2008 | WO2008023824A1 Semiconductor device and method for manufacturing the same |
| 02/28/2008 | WO2008023753A1 Solution for removing residue after semiconductor dry process and method of removing the residue using the same |
| 02/28/2008 | WO2008023746A1 Semiconductor device member, liquid for forming semiconductor device member, method for manufacturing semiconductor device member, and liquid for forming semiconductor device member using the method, phosphor composition, semiconductor light emitting device, illuminating apparatus and image display apparatus |
| 02/28/2008 | WO2008023585A1 Method of treating substrate, process for manufacturing semiconductor device, substrate treating apparatus and recording medium |
| 02/28/2008 | WO2008023537A1 Curable orgnopolysiloxane composition and semiconductor device |
| 02/28/2008 | WO2008023465A1 Microelectronic machine mechanism device, and its manufacturing method |
| 02/28/2008 | WO2008022712A1 Heat sink for semiconductor components or similar devices, and method for producing it |
| 02/28/2008 | WO2008022383A1 Thin-film solar module |
| 02/28/2008 | WO2008011255A3 Systems and methods for laser processing during periods having non-constant velocities |
| 02/28/2008 | WO2008008939A3 Emi absorbing gap filling material |
| 02/28/2008 | WO2008005486A3 Electronic module configured for air flow therethrough and system including same |
| 02/28/2008 | WO2007137073A3 Semiconductor device assembly with gap underfill |
| 02/28/2008 | WO2007132423A3 Assembly, chip and method of operating |
| 02/28/2008 | WO2007123695A3 Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same |
| 02/28/2008 | WO2007109486A3 Carrierless chip package for integrated circuit devices, and methods of making same |
| 02/28/2008 | WO2007062247A3 Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields and related structures |
| 02/28/2008 | WO2001001451A3 Microwave circuit packages having a reduced number of vias in the substrate |
| 02/28/2008 | US20080050913 Top layers of metal for high performance IC's |
| 02/28/2008 | US20080050912 Chip structure and process for forming the same |
| 02/28/2008 | US20080050909 Top layers of metal for high performance IC's |
| 02/28/2008 | US20080050906 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/28/2008 | US20080050860 Adhesion by plasma conditioning of semiconductor chip |
| 02/28/2008 | US20080050677 Processing method, manufacturing method of semiconductor device, and processing apparatus |
| 02/28/2008 | US20080049437 Vehicle, display device and manufacturing method for a semiconductor device |
| 02/28/2008 | US20080049379 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 02/28/2008 | US20080049378 Metal-insulator-metal capacitor and method of fabricating same |
| 02/28/2008 | US20080049171 Display Device |
| 02/28/2008 | US20080049127 Solid-state imaging device, camera module, and camera-module manufacturing method |
| 02/28/2008 | US20080048346 Method of fabricating conductive lines and structure of the same |
| 02/28/2008 | US20080048345 Semiconductor device and fabricating method thereof |
| 02/28/2008 | US20080048344 High performance ic package and method |
| 02/28/2008 | US20080048343 Thin flip-chip method |
| 02/28/2008 | US20080048342 Multi-chip module |
| 02/28/2008 | US20080048341 Chip with a vertical contact structure |
| 02/28/2008 | US20080048340 Semiconductor device having fine pattern wiring lines integrally formed with contact plug and method of manufacturing same |
| 02/28/2008 | US20080048339 Metal line structures and methods of forming the same |
| 02/28/2008 | US20080048338 Semiconductor Device and Fabrication Method Thereof |
| 02/28/2008 | US20080048336 Semiconductor Device and Method for Manufacturing the Same |
| 02/28/2008 | US20080048335 Semiconductor device |
| 02/28/2008 | US20080048334 Semiconductor devices and methods of fabricating the same |
| 02/28/2008 | US20080048333 Semiconductor Device Having Buried Word Line Interconnects and Method of Fabricating the Same |
| 02/28/2008 | US20080048332 Method for forming intermetal dielectric in semiconductor device |
| 02/28/2008 | US20080048331 Power/ground network of integrated circuits and arrangement thereof |
| 02/28/2008 | US20080048330 Implantable Microelectronic Device and Method of Manufacture |
| 02/28/2008 | US20080048329 Top layers of metal for high performance IC's |
| 02/28/2008 | US20080048328 Chip structure and process for forming the same |
| 02/28/2008 | US20080048327 Electronic circuit with embedded memory |
| 02/28/2008 | US20080048326 Semiconductor device |
| 02/28/2008 | US20080048325 Semiconductor device and fabricating method thereof |
| 02/28/2008 | US20080048324 Fabricating Semiconductor Device |
| 02/28/2008 | US20080048323 Stacked structure of chips and wafer structure for making the same |
| 02/28/2008 | US20080048322 Semiconductor package including redistribution pattern and method of manufacturing the same |
| 02/28/2008 | US20080048321 Flip chip semiconductor assembly with variable volume solder bumps |
| 02/28/2008 | US20080048320 Low fabrication cost, fine pitch and high reliability solder bump |
| 02/28/2008 | US20080048319 Semiconductor device having pads |
| 02/28/2008 | US20080048318 Semiconductor device and semiconductor package |
| 02/28/2008 | US20080048316 Packaged microdevices and methods for manufacturing packaged microdevices |
| 02/28/2008 | US20080048315 Electronic Device and Package Used for the Same |
| 02/28/2008 | US20080048314 Integrated circuit cooling and insulating device and method |
| 02/28/2008 | US20080048313 Wafer Bonding Method |
| 02/28/2008 | US20080048312 Semiconductor package and method for manufacturing the same |
| 02/28/2008 | US20080048311 Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them |
| 02/28/2008 | US20080048310 Carrier Board Structure Embedded with Semiconductor Component and Method for Fabricating the Carrier Board Structure |
| 02/28/2008 | US20080048309 Metal core foldover package structures, systems including same and methods of fabrication |
| 02/28/2008 | US20080048308 Stackable packages for three-dimensional packaging of semiconductor dice |
| 02/28/2008 | US20080048307 Module and Mounted Structure Using the Same |
| 02/28/2008 | US20080048306 Electro-chemical processor |
| 02/28/2008 | US20080048305 Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging |
| 02/28/2008 | US20080048304 Heat slug for package structure |
| 02/28/2008 | US20080048303 Semiconductive Device Having Improved Copper Density for Package-on-Package Applications |
| 02/28/2008 | US20080048302 Systems and methods for low profile die package |
| 02/28/2008 | US20080048301 Pre-encapsulated lead frames for microelectronic device packages, and associated methods |
| 02/28/2008 | US20080048299 Electronic Component with Semiconductor Chips, Electronic Assembly Composed of Stacked Semiconductor Chips, and Methods for Producing an Electronic Component and an Electronic Assembly |
| 02/28/2008 | US20080048298 Semiconductor devices, assemblies and constructions, and methods of forming semiconductor devices, assemblies and constructions |
| 02/28/2008 | US20080048282 Semiconductor Device and Fabricating Method Thereof |
| 02/28/2008 | US20080048266 ESD protection device and method |
| 02/28/2008 | US20080048229 Method for fabricating metallic bit-line contacts |
| 02/28/2008 | US20080048218 Method and flip chip structure for power devices |
| 02/28/2008 | US20080048186 Design Structures Incorporating Semiconductor Device Structures with Self-Aligned Doped Regions |
| 02/28/2008 | US20080048052 Spray Nozzle Apparatus and Method of Use |
| 02/28/2008 | US20080048018 Methods, Objects and Apparatus Employing Machine Readable Data |
| 02/28/2008 | US20080047490 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects |
| 02/28/2008 | US20080047136 Laminate ceramic circuit board and process therefor |
| 02/28/2008 | DE112006001036T5 Elektronisches Bauelement und elektronische Anordnung Electronic device and electronic device |