Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/05/2008CN101136342A Mould-seal array treating process of packaging wafer and used substrates bar
03/05/2008CN101136341A Crystal coated encapsulation method for preventing image sensing chip sensing section from polluting
03/05/2008CN101135820A TFT LCD panel electrostatic discharge protection circuit
03/05/2008CN101135051A Metal or ceramic base material metallization treating method
03/05/2008CN100373999C Heat radiating system and method for a mobile communication terminal
03/05/2008CN100373998C Power assembly and method for manufacturing the same
03/05/2008CN100373995C Electric conductor embedding method and circuit board and chip using said method
03/05/2008CN100373771C Elastic surface wave apparatus and manufacturing method thereof
03/05/2008CN100373717C Lead frame for semiconductor element and semiconductor device using same
03/05/2008CN100373648C High power led housing and fabrication method thereof
03/05/2008CN100373628C Image sensor adapted for element reducing chip level package
03/05/2008CN100373626C Semiconductor integrated device and method for manufacturing same
03/05/2008CN100373624C Semiconductor device with flowable insulation layer formed on capacitor and method for fabricating the same
03/05/2008CN100373618C System single chip with electromagnetic interference shielding functional design
03/05/2008CN100373616C Semiconductor device and method of manufacturing the same
03/05/2008CN100373615C Mould set structure with multiple package and fins
03/05/2008CN100373614C Packing structure of multichip
03/05/2008CN100373613C Test pattern of semiconductor device and test method using the same
03/05/2008CN100373612C Semiconductor device and method for forming assistant via
03/05/2008CN100373611C Semiconductor structure
03/05/2008CN100373610C Multi-layer wiring structure with dummy patterns for improving surface flatness
03/05/2008CN100373609C Semiconductor device and its manufacturing method
03/05/2008CN100373608C Wire-frame type semiconductor package part and its wire frame
03/05/2008CN100373607C Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus
03/05/2008CN100373606C Pin shared system
03/05/2008CN100373605C Electronic component packaging structure and method for producing the same
03/05/2008CN100373604C High power MCM package
03/05/2008CN100373603C Water delivery and distribution pipeline system of standing reactive compensator thyristor velve set
03/05/2008CN100373602C A high-performance heat sink configurations for air-cooled heat dissipation device
03/05/2008CN100373601C Secondary curved thermal tube finned radiator
03/05/2008CN100373600C Heat radiator
03/05/2008CN100373599C Non-lug type chip encapsulation
03/05/2008CN100373598C Liquid cooling type heat radiation module
03/05/2008CN100373597C Ic chip package structure and underfill process
03/05/2008CN100373596C Ball-grid array packed substrate plate and its structure thereof
03/05/2008CN100373595C Optical electronic apparatus and method for producing the same
03/05/2008CN100373592C PECVD silicon-rich oxide layer for reduced UV charging in an EEPROM
03/05/2008CN100373583C Method of manufacturing semiconductor device
03/05/2008CN100373571C Method of evaluating solution for coating film of semiconductor
03/05/2008CN100373569C Method for reinforcing bond pad structure and forming reinforced bond pad structure
03/05/2008CN100373568C Method of forming bump pad of flip chip and structure thereof
03/05/2008CN100373567C Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device and resin material
03/05/2008CN100373565C Movable particle adsorbing method for hybrid integrated circuit
03/05/2008CN100373533C Semiconductor and method of manufacturing the same
03/05/2008CN100373405C A network card packaging arrangement and packaging method thereof
03/05/2008CN100373294C Electronic device
03/05/2008CN100373249C Display device
03/04/2008US7340699 Analysis apparatus for semiconductor LSI circuit electrostatic discharge by calculating inter-pad voltage between pads
03/04/2008US7340372 Apparatus and method for investigating parameters of layers deposited on semiconductor wafers
03/04/2008US7340181 Electrical die contact structure and fabrication method
03/04/2008US7339837 Configurable embedded processor
03/04/2008US7339798 Electronic assemblies and systems comprising interposer with embedded capacitors
03/04/2008US7339797 Chip mount, methods of making same and methods for mounting chips thereon
03/04/2008US7339791 CVD diamond enhanced microprocessor cooling system
03/04/2008US7339788 Cooling unit and flow distributing element for use in such unit
03/04/2008US7339564 Liquid crystal display device
03/04/2008US7339444 Methods for providing bias to a monolithic microwave integrated circuit
03/04/2008US7339411 Semiconductor integrated circuit having noise detect circuits detecting noise on power supply nets
03/04/2008US7339388 Intra-clip power and test signal generation for use with test structures on wafers
03/04/2008US7339282 Topographically indexed support substrates
03/04/2008US7339281 Circuit device and manufacturing method thereof
03/04/2008US7339280 Semiconductor package with lead frame as chip carrier and method for fabricating the same
03/04/2008US7339279 Chip-size package structure and method of the same
03/04/2008US7339278 Cavity chip package
03/04/2008US7339277 Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate
03/04/2008US7339276 Underfilling process in a molded matrix array package using flow front modifying solder resist
03/04/2008US7339275 Multi-chips semiconductor device assemblies and methods for fabricating the same
03/04/2008US7339273 Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
03/04/2008US7339272 Semiconductor device with scattering bars adjacent conductive lines
03/04/2008US7339271 Metal-metal oxide etch stop/barrier for integrated circuit interconnects
03/04/2008US7339270 Semiconductor device and method for fabricating the same
03/04/2008US7339269 High frequency IC package, high frequency unit using high frequency IC package, and manufacturing method thereof
03/04/2008US7339268 Thermal dissipation from a flip chip through an aperture in a flex cable
03/04/2008US7339267 Semiconductor package and method for forming the same
03/04/2008US7339266 Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
03/04/2008US7339265 Capacitance type semiconductor sensor
03/04/2008US7339264 Semiconductor chip with external connecting terminal
03/04/2008US7339263 Integrated circuit packages, systems, and methods
03/04/2008US7339262 Tape circuit substrate and semiconductor apparatus employing the same
03/04/2008US7339261 Semiconductor device
03/04/2008US7339260 Wiring board providing impedance matching
03/04/2008US7339259 Semiconductor device
03/04/2008US7339258 Dual row leadframe and fabrication method
03/04/2008US7339257 Semiconductor device in which semiconductor chip is mounted on lead frame
03/04/2008US7339256 Semiconductor device
03/04/2008US7339250 Semiconductor integrated circuit having reduced cross-talk noise
03/04/2008US7339249 Semiconductor device
03/04/2008US7339245 Hall sensor
03/04/2008US7339227 Nonvolatile semiconductor memory
03/04/2008US7339212 p channel filed effect transistor and sensor using the same
03/04/2008US7339204 Backside contact for touchchip
03/04/2008US7339186 IC chip with nanowires
03/04/2008US7339118 Printed wiring board and method for manufacturing the same
03/04/2008US7338909 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography
03/04/2008US7338895 Method for dual damascene integration of ultra low dielectric constant porous materials
03/04/2008US7338891 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
03/04/2008US7338890 Low fabrication cost, high performance, high reliability chip scale package
03/04/2008US7338889 Method of improving copper interconnects of semiconductor devices for bonding
03/04/2008US7338885 Alignment mark and method for manufacturing a semiconductor device having the same
03/04/2008US7338884 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device
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