Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/06/2008US20080054330 Tantalum lanthanide oxynitride films
03/06/2008US20080054297 Electrostatic discharge protection circuit using a double-triggered silicon controlling rectifier
03/06/2008US20080054263 Semiconductor device and method of fabricating the same
03/06/2008US20080054262 Semiconductor device
03/06/2008US20080054261 Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
03/06/2008US20080054260 Semiconductor Integrated Circuit Device, Method For Testing The Semiconductor Integrated Circuit Device, Semiconductor Wafer And Burn-In Test Apparatus
03/06/2008US20080054225 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer
03/06/2008US20080053964 Wire bonders and methods of wire-bonding
03/06/2008US20080053700 Sealed electronic component
03/06/2008US20080053692 Strip line device, printed wiring board mounting member, circuit board, semiconductor package, and method of forming same
03/06/2008US20080053648 Structure for cooling a surface
03/06/2008US20080052904 Method Of Manufacturing An Electronic Circuit Assembly
03/06/2008DE112006001179T5 Einbetten von Dünnschichtwiderständen in Substrate in Leistungsversorgungsnetzwerken Embedding of thin film resistors in substrates in power supply networks
03/06/2008DE112006001177T5 Thermisches Schnittstellenmaterial und Verfahren Thermal Interface Material and methods
03/06/2008DE112006000840T5 Leitbahnende-Erweiterung Leitbahnende extension
03/06/2008DE112004002527T5 Verfahren zum Verkapseln von Schaltkreischips A method for encapsulating circuit chip
03/06/2008DE10316355C5 Leistungshalbeitermodul mit flexibler äusserer Anschlussbelegung Power semiconductor module with flexible outer pin assignment
03/06/2008DE10297756B4 Microchip package for electronic assembly e.g. printed circuit board, has interposer with segmented apertures mounted on microchip device
03/06/2008DE102007041785A1 Halbleitervorrichtung und deren Herstellungsverfahren A semiconductor device and its manufacturing method
03/06/2008DE102006041046A1 Solarzelle, Verfahren zur Herstellung von Solarzellen sowie elektrische Leiterbahn Solar cell process for the production of solar cells and electrical trace
03/06/2008DE102006035865B3 Material placing method for use in integrated circuit, involves positioning transfer plate opposite to target plate, where material is casted out from blind holes to contact with target plate and to place at target plate
03/06/2008CA2586342A1 Led module
03/05/2008EP1895829A2 Shielding device for emi shielding
03/05/2008EP1895600A1 White semiconductor light emitting element and manufacturing method thereof
03/05/2008EP1895590A1 Passive component and electronic component module
03/05/2008EP1895589A2 Semiconductor package substrate
03/05/2008EP1895588A2 Capacitor built-in interposer and method of manufacturing the same and electronic component device
03/05/2008EP1895587A2 Semiconductor package substrate
03/05/2008EP1895586A2 Semiconductor package substrate
03/05/2008EP1895585A2 Chip film package and display panel assembly having the same
03/05/2008EP1895584A1 Thermally conductive substrate with leadframe and heat radiation plate and manufacturing method thereof
03/05/2008EP1895583A1 Electronic control unit and manufacturing method thereof
03/05/2008EP1894241A2 Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
03/05/2008EP1894240A1 Electronic module
03/05/2008EP1894239A1 Flip chip die assembly using thin flexible substrates
03/05/2008EP1894238A1 Heat exchanger for small components
03/05/2008EP1894237A1 Electronic module assembly with heat spreader
03/05/2008EP1894236A2 In-chip structures and methods for removing heat from integrated circuits
03/05/2008EP1709674B1 Method for fabricating electronic component module using a plasma processing method
03/05/2008EP1604401B1 Semiconductor device, semiconductor body and method of manufacturing thereof
03/05/2008EP1537187A4 Organic species that facilitate charge transfer to or from nanostructures
03/05/2008CN201032636Y Light emitting diode packaging structure
03/05/2008CN201032631Y Window type grid array semiconductor package member
03/05/2008CN201032630Y Screw fixing element skidproof structure of CPU radiating module
03/05/2008CN201032629Y Heat radiator of semiconductor refrigerating device
03/05/2008CN101138086A Copper bonding or superfine wire with improved bonding and corrosion properties
03/05/2008CN101138085A Low k dielectric cvd film formation process with in-situ imbedded nanolayers to improve mechanical properties
03/05/2008CN101138084A Semiconductor device package with bump overlying a polymer layer
03/05/2008CN101138083A Semiconductor package
03/05/2008CN101137881A A multi-orientational cooling system with a bubble pump
03/05/2008CN101137280A High-power element heat radiator manufacturing method
03/05/2008CN101137279A Temperature control structure
03/05/2008CN101137278A Heat radiating device
03/05/2008CN101137277A Radiation device assembly and fastener using the same
03/05/2008CN101136517A Module power supply base pin structure
03/05/2008CN101136445A Ultra-high power illumination LED metallic packaging structure
03/05/2008CN101136430A Semiconductor device
03/05/2008CN101136428A Organic electroluminescence device, manufacturing method therefor, and electronic apparatus
03/05/2008CN101136427A Organic light emitting display
03/05/2008CN101136426A Semiconductor device and method of manufacturing the same
03/05/2008CN101136424A CMOS image sensor and method for manufacturing thereof
03/05/2008CN101136422A CMOS image sensor and method for manufacturing the same
03/05/2008CN101136416A Pixel array structure and manufacturing method therefor
03/05/2008CN101136415A Thin-film transistor array substrates, manufacturing method and LCD device containing the same
03/05/2008CN101136413A Thin film transistor array panel and method of manufacturing the same
03/05/2008CN101136411A Memory and manufacturing method thereof
03/05/2008CN101136410A Semiconductor structure
03/05/2008CN101136407A Semiconductor device
03/05/2008CN101136406A Semiconductor device having lateral mos transistor and zener diode
03/05/2008CN101136403A Semiconductor device and methods for forming same
03/05/2008CN101136402A Semiconductor device and manufacturing method thereof
03/05/2008CN101136401A Input/output device and method of controlling integrated circuit with plurality of input/output devices
03/05/2008CN101136400A Electrostatic prevention protection structure of grids coupling used for high voltage drain spreading NMOS
03/05/2008CN101136398A Polycrystal pieces packaging structure
03/05/2008CN101136396A Power electronic packing member including two pieces of substrate with multiple semiconductor chips and electronic elements
03/05/2008CN101136395A Power electronic packing member including two pieces of substrate with multiple electronic elements
03/05/2008CN101136394A Multiple chip semi-conductor packaging structure and encapsulation method
03/05/2008CN101136393A Semiconductor package and method therefor
03/05/2008CN101136392A Semiconductor device and method for manufacturing thereof
03/05/2008CN101136391A Semiconductor device
03/05/2008CN101136390A Semiconductor device
03/05/2008CN101136389A Semiconductor device and fabricating method thereof
03/05/2008CN101136388A Chip film package and display panel assembly having the same
03/05/2008CN101136387A Tape coiling structure applied to packag
03/05/2008CN101136386A Chip packaging structure and method of producing the same
03/05/2008CN101136385A Internally burying type chip packaging manufacture process and circuit board having the same
03/05/2008CN101136384A Semiconductor package structure and method of manufacture
03/05/2008CN101136383A Electronic component, semiconductor device employing same, and method for manufacturing electronic component
03/05/2008CN101136382A Chip package member
03/05/2008CN101136381A Passive component and electronic component module
03/05/2008CN101136380A Semiconductor package structure having multiple heat dissipation paths and method of manufacture
03/05/2008CN101136379A Chip packaging construct and manufacturing method thereof
03/05/2008CN101136378A Semiconductor device, packaging air tightness detecting method and distribution device
03/05/2008CN101136377A Semi-penetrate inverse type indicator element and method of producing the same
03/05/2008CN101136376A Pixel structure and manufacturing method therefor
03/05/2008CN101136358A Semiconductor device and method of fabricating the same
03/05/2008CN101136357A Method and semiconductor device for manufacturing connections within transistor elements on semiconductor substrate
03/05/2008CN101136356A Copper interconnected fabricating method for semiconductor device and structure thereof
03/05/2008CN101136348A Semiconductor device and method for evaluating characteristics of the same
03/05/2008CN101136344A Semiconductor device and method of manufacturing the semiconductor device
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