Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/06/2008WO2007127784A3 Methods of inter-integrated circuit addressing and devices for performing the same
03/06/2008WO2007089874A3 Thermal diodic devices for high cooling rate applications and methods for manufacturing same
03/06/2008US20080057742 Circuit-connecting material and circuit terminal connected structure and connecting method
03/06/2008US20080057714 Polished semiconductor wafer and process for producing it
03/06/2008US20080057704 Semiconductor device with a barrier film
03/06/2008US20080057703 Post passivation interconnection schemes on top of IC chip
03/06/2008US20080057677 Chip location identification
03/06/2008US20080057626 Method of manufacturing a semiconductor device
03/06/2008US20080055872 Printed circuit board and method for manufacturing printed circuit board
03/06/2008US20080055291 Chip film package and display panel assembly having the same
03/06/2008US20080055015 Compact Impedance Transformation Circuit
03/06/2008US20080054915 Semiconductor device and method for measuring analog channel resistance thereof
03/06/2008US20080054810 Composition of dielectric for plasma display panel
03/06/2008US20080054496 High temperature operating package and circuit design
03/06/2008US20080054495 Functional device, semiconductor device, and electronic device
03/06/2008US20080054494 IC package
03/06/2008US20080054493 Systems and arrangements for interconnecting integrated circuit dies
03/06/2008US20080054492 Semiconductor device and method for manufacturing the same
03/06/2008US20080054491 Semiconductor device, relay chip, and method for producing relay chip
03/06/2008US20080054490 Flip-Chip Ball Grid Array Strip and Package
03/06/2008US20080054489 Distributed semiconductor device methods, apparatus, and systems
03/06/2008US20080054488 Systems and arrangements for interconnecting integrated circuit dies
03/06/2008US20080054487 Dielectric material with a reduced dielectric constant and methods of manufacturing the same
03/06/2008US20080054486 Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same
03/06/2008US20080054485 Semiconductor device and fabricating method thereof
03/06/2008US20080054484 Method for protecting an alignment mark
03/06/2008US20080054483 Semiconductor devices including fine pitch arrays with staggered contacts and methods for designing and fabricating the same
03/06/2008US20080054482 Semiconductor package having non-aligned active vias
03/06/2008US20080054481 Semiconductor Structure Formed Using a Sacrificial Structure
03/06/2008US20080054480 Semiconductor device and fabricating method thereof
03/06/2008US20080054479 Semiconductor device and method of producing the same
03/06/2008US20080054478 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054477 Processing with Reduced Line End Shortening Ratio
03/06/2008US20080054476 Circuitized substrate with increased roughness conductive layer as part thereof
03/06/2008US20080054475 Method of fabricating semiconductor device
03/06/2008US20080054474 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054473 Metal Wiring and Method for Forming the Same
03/06/2008US20080054472 a ruthenium(Ru) thin film on a substrate in a reaction chamber, includes: (i) supplying a gas of a ruthenium precursor into the reaction chamber so that the gas of the ruthenium precursor is adsorbed onto the substrate, wherein the ruthenium precursor a ruthenium complex contains a non-cyclic diene
03/06/2008US20080054471 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054470 Semiconductor Device and Method of Fabricating the Same
03/06/2008US20080054469 Electroformed metal structure
03/06/2008US20080054468 Semiconductor device and methods of forming the same
03/06/2008US20080054467 Method for manufacturing a semiconductor device and semiconductor device
03/06/2008US20080054466 Semiconductor device and method of manufacturing semiconductor device
03/06/2008US20080054465 Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the same
03/06/2008US20080054464 Semiconductor Device and Method for Fabricating the Same
03/06/2008US20080054463 Semiconductor apparatus and manufacturing method of semiconductor apparatus
03/06/2008US20080054462 Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same
03/06/2008US20080054461 Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor device
03/06/2008US20080054460 Structure of wafer level package with area bump
03/06/2008US20080054459 Low fabrication cost, fine pitch and high reliability solder bump
03/06/2008US20080054458 Electronic device and method of manufacturing the same
03/06/2008US20080054457 Semiconductor chip and method for fabricating the same
03/06/2008US20080054456 Semiconductor package including silver bump and method for fabricating the same
03/06/2008US20080054455 Semiconductor ball grid array package
03/06/2008US20080054454 Semiconductor device and method for manufacturing semiconductor device
03/06/2008US20080054453 Method and Structure for Implementing Component Placement Suspended within Grid Array Packages for Enhanced Electrical Performance
03/06/2008US20080054451 Multi-chip assembly
03/06/2008US20080054450 Chip package structure and heat sink for chip package
03/06/2008US20080054449 Semiconductor component with cooling apparatus
03/06/2008US20080054448 Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same
03/06/2008US20080054447 Chip package and digital camera module using same
03/06/2008US20080054446 Flexible core for enhancement of package interconnect reliability
03/06/2008US20080054445 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
03/06/2008US20080054444 Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
03/06/2008US20080054443 Carrier board structure with semiconductor chip embedded therein
03/06/2008US20080054442 Semiconductor module arrangement and method
03/06/2008US20080054441 Chip package and method for fabricating the same
03/06/2008US20080054440 Wire bonding method, wire bonding apparatus and semiconductor device
03/06/2008US20080054439 Power electronic package having two substrates with multiple semiconductor chips and electronic components
03/06/2008US20080054438 Semiconductor package structure having multiple heat dissipation paths and method of manufacture
03/06/2008US20080054437 Pop package and method of fabricating the same
03/06/2008US20080054436 Semiconductor Device and Fabricating Method Thereof
03/06/2008US20080054435 Stacked Die Packages
03/06/2008US20080054434 Semiconductor stack package for optimal packaging of components having interconnections
03/06/2008US20080054433 Multi-chip package with spacer for blocking interchip heat transfer
03/06/2008US20080054432 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
03/06/2008US20080054431 Embedded package in package
03/06/2008US20080054430 Through board stacking of multiple LGA-connected components
03/06/2008US20080054429 Spacers for separating components of semiconductor device assemblies, semiconductor device assemblies and systems including spacers and methods of making spacers
03/06/2008US20080054428 A stacked-die electronics package with planar and three-dimensional inductor elements
03/06/2008US20080054427 Semiconductor devices and manufacturing method therefor
03/06/2008US20080054426 Semiconductor device and manufacturing method thereof
03/06/2008US20080054425 Power electronic package having two substrates with multiple electronic components
03/06/2008US20080054424 Semiconductor package and method therefor
03/06/2008US20080054423 Apparatus and method for packaging circuits
03/06/2008US20080054422 Semiconductor device
03/06/2008US20080054421 Integrated circuit package system with interlock
03/06/2008US20080054420 Semiconductor package structure and method of manufacture
03/06/2008US20080054419 Semiconductor package
03/06/2008US20080054418 Chip carrier with signal collection tape and fabrication method thereof
03/06/2008US20080054417 Semiconductor die package including stacked dice and heat sink structures
03/06/2008US20080054416 Photodefinable buffer coating materials
03/06/2008US20080054415 n-channel field effect transistor having a contact etch stop layer in combination with an interlayer dielectric sub-layer having the same type of intrinsic stress
03/06/2008US20080054414 Method of manufacturing semiconductor device having impurity region under isolation region
03/06/2008US20080054413 Self-aligned dual segment liner and method of manufacturing the same
03/06/2008US20080054398 Method for making high-performance RF integrated circuits
03/06/2008US20080054395 Semiconductor device and method of manufacturing the semiconductor device
03/06/2008US20080054384 Semiconductor device and method of manufacturing same
03/06/2008US20080054373 Power semiconduction device and circuit module having such power semiconduction device
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