Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/12/2008CN100375277C Temperature compensating device of module type integrated circuit test processor
03/12/2008CN100375276C Heat-conducting sheet material and manufacturing method thereof
03/12/2008CN100375275C Diamond composite material radiating fin with heat transfer gradient and its producing method
03/12/2008CN100375274C Circuit device and its manufacturing method
03/12/2008CN100375273C Semiconductor device and method of manufacturing the same
03/12/2008CN100375272C Thermally enhanced component substrate
03/12/2008CN100375268C Semiconductor device and method for manufacturing thereof
03/12/2008CN100375267C Method for manufacturing semiconductor devices
03/12/2008CN100375266C Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
03/12/2008CN100375255C Semiconductor device and its mfg. method
03/12/2008CN100375248C Heterogeneous low K dielectric and forming method thereof
03/12/2008CN100375245C On-wafer monitoring system
03/12/2008CN100375237C Slushing compound filling method and manufacturing method of semiconductor device
03/12/2008CN100375232C Semiconductor device and method of fabricating the same
03/12/2008CN100375198C Semiconductor device equiped with memory and logical chips for testing memory ships
03/12/2008CN100375097C Personalized hardware
03/12/2008CN100374981C Method for computer radiation and control noise
03/12/2008CN100374920C Electro-optical device, method of manufacturing the same, and electronic apparatus
03/12/2008CN100374912C Manufacture of electronic device installing bodies
03/11/2008US7343256 Configurable voltage regulator
03/11/2008US7342805 Capacitor plate for substrate components
03/11/2008US7342803 Printed circuit board and method of manufacturing printed circuit board
03/11/2008US7342802 Multilayer wiring board for an electronic device
03/11/2008US7342794 Heat sink with integral card guide
03/11/2008US7342791 Locking device for heat sink
03/11/2008US7342790 Heat sink fastening device
03/11/2008US7342760 Circuit arrangement for protection against electrostatic discharge and voltage regulating device having a circuit arrangement
03/11/2008US7342707 Indicators and illuminators using a semiconductor radiation emitter package
03/11/2008US7342408 Semiconductor test device using leakage current and compensation system of leakage current
03/11/2008US7342320 Electronic component with semiconductor chips, electronic assembly composed of stacked semiconductor chips, and methods for producing an electronic component and an electronic assembly
03/11/2008US7342319 Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
03/11/2008US7342318 Semiconductor package free of substrate and fabrication method thereof
03/11/2008US7342317 Low coefficient of thermal expansion build-up layer packaging and method thereof
03/11/2008US7342316 Cross-fill pattern for metal fill levels, power supply filtering, and analog circuit shielding
03/11/2008US7342315 Method to increase mechanical fracture robustness of porous low k dielectric materials
03/11/2008US7342314 Device having a useful structure and an auxiliary structure
03/11/2008US7342312 Semiconductor device
03/11/2008US7342311 Electronic unit integrated into a flexible polymer body
03/11/2008US7342310 Multi-chip package with high-speed serial communications between semiconductor die
03/11/2008US7342309 Semiconductor device and fabrication method thereof
03/11/2008US7342308 Component stacking for integrated circuit electronic package
03/11/2008US7342307 Semiconductor device
03/11/2008US7342306 High performance reworkable heatsink and packaging structure with solder release layer
03/11/2008US7342305 Thermally enhanced cavity-down integrated circuit package
03/11/2008US7342304 Semiconductor package with heat dissipating structure
03/11/2008US7342303 Semiconductor device having RF shielding and method therefor
03/11/2008US7342302 Semiconductor device and a method of manufacturing the same
03/11/2008US7342301 Connection device with actuating element for changing a conductive state of a via
03/11/2008US7342300 Integrated circuit incorporating wire bond inductance
03/11/2008US7342299 Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
03/11/2008US7342298 Metal lid with improved adhesion to package substrate
03/11/2008US7342297 Sawn power package
03/11/2008US7342281 Electrostatic discharge protection circuit using triple welled silicon controlled rectifier
03/11/2008US7342267 MOSFET package
03/11/2008US7342263 Circuit device
03/11/2008US7342262 Split-gate power module for suppressing oscillation therein
03/11/2008US7342259 Optical element
03/11/2008US7342257 Optical transmitter
03/11/2008US7342248 Semiconductor device and interposer
03/11/2008US7342177 Wiring board, electro-optical device and electronic instrument
03/11/2008US7342169 thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other; improved thermoelectric coolers and heaters and thermoelectric power converters
03/11/2008US7342063 Dispersion for electrodeposition which has excellent shelf life and can form thin, high dielectric constant films, as well as a high dielectric constant film formed from the aqueous dispersion and electronic parts provided with the high
03/11/2008US7341949 Process for forming lead-free bump on electronic component
03/11/2008US7341947 Methods of forming metal-containing films over surfaces of semiconductor substrates
03/11/2008US7341938 Single mask via method and device
03/11/2008US7341937 Semiconductor device and method of manufacturing same
03/11/2008US7341935 Alternative interconnect structure for semiconductor devices
03/11/2008US7341931 Methods of forming low resistivity contact for an integrated circuit device
03/11/2008US7341919 Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device
03/11/2008US7341898 Thin film transistor circuit device, production method thereof and liquid crystal display using the thin film transistor circuit device
03/11/2008US7341891 Method for manufacturing a memory cell for modification of revision identifier in an integrated circuit chip
03/11/2008US7341890 Circuit board with built-in electronic component and method for manufacturing the same
03/11/2008US7341889 Lead frame for semiconductor package and method of fabricating semiconductor package
03/11/2008US7341888 Balance filter packaging chip having balun mounted therein and manufacturing method thereof
03/11/2008US7341877 Calibration method in a chip mounting device
03/11/2008US7341775 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
03/11/2008US7340828 Method for producing metal/ceramic bonding circuit board
03/11/2008US7340826 Method for producing an electronic device connected to a printed circuit board
03/06/2008WO2008027856A2 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
03/06/2008WO2008027709A2 Microelectronic device having interconnects and conductive backplanes
03/06/2008WO2008027708A2 Semiconductor die package including stacked dice and heat sink structures
03/06/2008WO2008027694A2 Stackable packages for three-dimensional packaging of semiconductor dice
03/06/2008WO2008027080A1 Power core devices and methods of making thereof
03/06/2008WO2008026761A1 Lid for functional part and process for producing the same
03/06/2008WO2008026520A1 Semiconductor device and multilayer wiring board
03/06/2008WO2008026485A1 Electric power converter
03/06/2008WO2008026387A1 Method of forming amorphous silica coating of low dielectric constant and amorphous silica coating of low dielectric constant obtained thereby
03/06/2008WO2008026335A1 Electronic part device and method of manufacturing it and electronic part assembly and method of manufacturing it
03/06/2008WO2008026237A1 Carbon nanotube materials, process for production thereof, and electronic components and devices
03/06/2008WO2008025889A1 Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
03/06/2008WO2008025832A1 Method and apparatus for manufacturing an electronic module
03/06/2008WO2008025805A1 Method and apparatus for manufacturing an electronic module, and electronic module
03/06/2008WO2008025764A1 Device for wetting bumps of a semiconductor chip with a liquid substance
03/06/2008WO2008025676A1 Interconnect structures for integrated circuits and formation methods therefor
03/06/2008WO2008025392A1 Method for applying electric contacts to semi-conductor substrates, semi-conductor substrate and use of said method
03/06/2008WO2008025161A1 Multiple light-emitting element heat pipe assembly
03/06/2008WO2008025057A1 Thin-film diode structure using a sacrificial doped dielectric layer
03/06/2008WO2008011585A3 Package having a plurality of mounting orientations
03/06/2008WO2008011408A3 An integrated circuit device having at least one bond pad with a selectable plurality of input-output functionalities
03/06/2008WO2008004151A3 Power supply network
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