Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/13/2008US20080061344 Semiconductor device
03/13/2008US20080061326 Semiconductor device
03/13/2008US20080061323 Examination apparatus for biological sample and chemical sample
03/13/2008US20080061319 Systems and methods for distributing io in a semiconductor device
03/13/2008US20080061291 Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method
03/13/2008US20080060792 High performance integrated mlc cooling device for high power density ics and method for manufacturing
03/13/2008US20080060372 Cooling air flow loop for a data center in a shipping container
03/13/2008US20080060193 Methods of fabricating substrates including at least one conductive via
03/13/2008DE112006000682T5 Heizvorrichtung, Reflow-Vorrichtung, Heizverfahren und Verfahren zur Herstellung von Bumps Heater reflow device, heating method and process for producing bumps
03/13/2008DE112004002811T5 Verbesserte Mikrokanal-Wärmesenke Improved microchannel heat sink
03/13/2008DE102007041266A1 Sensor device particularly magnetic sensor device, has sensor element mounted above substrate and coplanr to which heating element is mounted and heat diffusion element is provided for thermal connection between sensor and heating element
03/13/2008DE102006045900A1 Sensor module manufacturing method, arranging sensor with sensing area on support and sensing area represents support and matrial is applied to sensor and support is removed from sensing area
03/13/2008DE102006040820A1 Electronic power package for e.g. diode, has two non-planar insulating substrates connected in connection regions, so that mechanical separation between substrates is controlled by number, arrangement, design and material of regions
03/13/2008DE102006040187A1 Power electronics component cooling system, for use in e.g. passenger aircraft, has cooling device including heat sinks, where heat sinks are separately supplied with cooling fluids from different cooling fluid sources
03/13/2008DE102006039877A1 Chip mit einer vertikalen Kontakt-Struktur Chip with a vertical contact structure
03/13/2008DE102006038980A1 Kühlkörper für Halbleiterbauelemente od.dgl. Heat sink for semiconductor devices or the like. Geräte sowie Verfahren zu seiner Herstellung Device and process for its preparation
03/13/2008DE102006037118B3 Halbleiterschaltmodul für Bordnetze mit mehreren Halbleiterchips, Verwendung eines solchen Halbleiterschaltmoduls und Verfahren zur Herstellung desselben Of the same semiconductor switching module for vehicle electrical systems with several semiconductor chips, use of such a semiconductor switching module and process for preparing
03/13/2008DE102005061015B4 Verfahren zum Herstellen eines Halbleiterbauteils mit einem vertikalen Halbleiterbauelement A method of manufacturing a semiconductor device with a vertical semiconductor device
03/13/2008DE10110100B4 Schaltungsanordnung für einen Treiber für Leistungsableitermodule Circuit arrangement for a driver for Leistungsableitermodule
03/12/2008EP1898684A1 Sealed electronic component
03/12/2008EP1898683A1 Multilayer printed wiring board
03/12/2008EP1898466A2 Encased PCB switch assembly with contact device
03/12/2008EP1898465A2 Power semiconductor module
03/12/2008EP1898464A1 Heat sink for power module
03/12/2008EP1898463A1 Cu-Mo SUBSTRATE AND METHOD FOR PRODUCING SAME
03/12/2008EP1898462A2 Semiconductor apparatus
03/12/2008EP1898458A1 Semiconductor device package with via plug and methods for manufacturing the same
03/12/2008EP1898455A1 Interlayer insulating film and wiring structure, and process for producing the same
03/12/2008EP1897423A1 Sensor for a hardware protection system for sensitive electronic-data modules protecting against external manipulations
03/12/2008EP1897140A1 Packaging logic and memory integrated circuits
03/12/2008EP1897139A1 Method for generating and/or memorising a retrievable cryptographic key during the production of a topographical structure
03/12/2008EP1897138A1 Semiconductor device and mounting structure thereof
03/12/2008EP1897137A2 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
03/12/2008EP1897136A2 System for liquid cooling of electrical components
03/12/2008EP1614166A4 Fluidic nanotubes and devices
03/12/2008EP1523784B1 Integrated circuit and method for manufacturing same
03/12/2008EP1346412B1 Semiconductor device comprising an arrangement of an electrically programmable non-volatile memory element
03/12/2008CN201035487Y Cylinder type heat radiating module with display screen
03/12/2008CN201034395Y Semiconductor refrigerating heat exchanger
03/12/2008CN201034307Y Light-emitting diode illuminator with heat dissipation structure
03/12/2008CN201034306Y Light-emitting diode daylight lamp
03/12/2008CN101142866A Heat-absorbing member, cooling device, and electronic apparatus
03/12/2008CN101142677A Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
03/12/2008CN101142676A Electronic device and carrier substrate
03/12/2008CN101142675A An integrated circuit package device with improved bond pad connections, a leadframe and an electronic device
03/12/2008CN101142674A 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers
03/12/2008CN101142673A Semiconductor device and its making method
03/12/2008CN101142672A Lid frame, semiconductor device, and manufacturing method thereof
03/12/2008CN101142670A A method for forming a ruthenium metal layer on a patterned substrate
03/12/2008CN101142666A Heating device, reflow device, heating method, and bump forming method
03/12/2008CN101142576A Nested voltage island architecture
03/12/2008CN101142280A Curable silicone composition and electronic device produced therefrom
03/12/2008CN101142080A Metal substrate/ carbon based metal composite material structure and method for manufacturing said structure
03/12/2008CN101141871A Integration designed heat radiator with flat heat pipe spreader
03/12/2008CN101141868A Non-fan chip heat radiator
03/12/2008CN101141867A Heat conduction pipe and radiating rib combining method
03/12/2008CN101141866A Heat radiating device
03/12/2008CN101141865A Heat radiating device
03/12/2008CN101141864A Fastener and heat radiating device using the same
03/12/2008CN101141863A Heat radiating device
03/12/2008CN101141862A Buckling device and heat radiator for applying the same
03/12/2008CN101141861A Fastener
03/12/2008CN101141858A Fixer for heat radiator
03/12/2008CN101141849A Built-in capacity cell structure and method for producing same
03/12/2008CN101141063A Esd protection circuit using self-biased current trigger technique and pumping source mechanism
03/12/2008CN101140975A 发光装置 Light-emitting device
03/12/2008CN101140972A Power luminous diode packaging structure
03/12/2008CN101140950A Transistor, memory cell array and method of manufacturing a transistor
03/12/2008CN101140945A Organic light emitting display device
03/12/2008CN101140943A Array substrate and display apparatus having the same
03/12/2008CN101140942A Display apparatus and manufacturing method of the same
03/12/2008CN101140939A Display panel and method for manufacturing the same
03/12/2008CN101140936A Integrated memory cell array
03/12/2008CN101140935A Memory cell array and method of forming the memory cell array
03/12/2008CN101140934A EMS memory structure and its preparation method
03/12/2008CN101140933A Semiconductor device and method of manufacture thereof
03/12/2008CN101140927A Ground circuit, electric power circuit and IC chip having the same
03/12/2008CN101140926A Stacked dual mosfet package
03/12/2008CN101140925A Semiconductor chip packaging structure
03/12/2008CN101140924A Power supply wiring configuration in semiconductor integrated circuit
03/12/2008CN101140923A 半导体器件 Semiconductor devices
03/12/2008CN101140922A Semiconductor structure and methods for forming the same
03/12/2008CN101140921A Integrated circuit
03/12/2008CN101140920A Circuit structure for realizing upper/lower layer metallic interconnect
03/12/2008CN101140919A Film carrier tape for mounting electronic components and method of manufacturing the film carrier tape
03/12/2008CN101140918A Semiconductor device, manufacturing method for semiconductor device, and semiconductor module device
03/12/2008CN101140917A Power semiconductor apparatus and circuit module using the same
03/12/2008CN101140916A Semiconductor device
03/12/2008CN101140915A Heat radiation substrate of electronic element
03/12/2008CN101140914A Semiconductor switching module optimized for resistance to short circuits
03/12/2008CN101140911A Thin-film transistor and method for forming same
03/12/2008CN101140865A III nitride semi-conductor material and growing method thereof
03/12/2008CN101138833A Group iii nitride substrate and manufacturing method of group iii nitride substrate
03/12/2008CN100375391C Double-usage of integrated circuit tube pin and signal switch over on the pin
03/12/2008CN100375283C Semiconductor device
03/12/2008CN100375282C Electrical fuses structure
03/12/2008CN100375281C Ball grid array x-ray oreintation mark
03/12/2008CN100375280C Conducting material and mfg. method thereof
03/12/2008CN100375279C Decouping network in integrated circuit
03/12/2008CN100375278C Semiconductor device and its mfg. method
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