Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/18/2008US7344940 Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors
03/18/2008US7344939 Ferroelectric capacitor with parallel resistance for ferroelectric memory
03/18/2008US7344932 Use of silicon block process step to camouflage a false transistor
03/18/2008US7344924 Fuse structures, methods of making and using the same, and integrated circuits including the same
03/18/2008US7344921 Integrated circuit device having reduced bow and method for making same
03/18/2008US7344918 Electronic assembly with integrated IO and power contacts
03/18/2008US7344916 Package for a semiconductor device
03/18/2008US7344914 Organic semiconductor element having multi protection layers and process of making the same
03/18/2008US7344899 Die assembly and method for forming a die on a wafer
03/18/2008US7344826 Method for forming a capacitor
03/18/2008US7344589 Solution/suspension of precursors of lead, zirconium and titanium, which do not undergo ligand exchange (2,2,6,6-tetramethyl-3,5-heptanedione complexes); vaporized including Ar, N2, H2, He, or NH3 as a carrier and O2, N2O, or O3 as an oxidizing reactant
03/18/2008US7344363 Remedies to prevent cracking in a liquid system
03/18/2008US7344061 Multi-functional solder and articles made therewith, such as microelectronic components
03/13/2008WO2008030188A1 Electrical current distribution in light emitting devices
03/13/2008WO2008030176A1 Substrate-penetrating electrical connections
03/13/2008WO2008029956A1 Semiconductor integrated circuit device, and wire forming method
03/13/2008WO2008029858A1 Semiconductor package and semiconductor package assembly
03/13/2008WO2008029847A1 Ceramic substrate manufacturing method and ceramic substrate
03/13/2008WO2008029813A1 Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device
03/13/2008WO2008029654A1 Semiconductor sensor device and method for manufacturing same
03/13/2008WO2008028850A1 CuSiN/SiN DIFFUSION BARRIER FOR COPPER IN INTEGRATED-CIRCUIT DEVICES
03/13/2008WO2008028827A2 Base material for photostructureable resists and dielectrics
03/13/2008WO2008028660A2 Device with pb-based high-k dielectric thin-film capacitor comprising pb-donating layers
03/13/2008WO2008028460A2 Regulated power supply for a circuit
03/13/2008WO2008014506A3 Dual inductor circuit for multi-band wireless communication device
03/13/2008WO2008007327A3 Integrated circuit, transponder, method of producing an integrated circuit and method of producing a transponder
03/13/2008WO2007144264A3 Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
03/13/2008WO2007136651A3 Semiconductor device with a distributed plating pattern
03/13/2008WO2007106209A3 Thermally conductive grease and methods and devices in which said grease is used
03/13/2008WO2007098219A3 A circuit lid with a thermocouple
03/13/2008WO2007063510A3 Bumpless flip-chip assembly with a compliant interposer contractor
03/13/2008US20080064849 Adhesive film for circuit connection, and circuit connection structure
03/13/2008US20080064233 Circuit-connecting material and circuit terminal connected structure and connecting method
03/13/2008US20080064208 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
03/13/2008US20080064207 Semiconductor Device Power Interconnect Striping
03/13/2008US20080064202 Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
03/13/2008US20080064189 Crack stop for low k dielectrics
03/13/2008US20080064183 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
03/13/2008US20080064146 Method for manufacturing semiconductor device
03/13/2008US20080064140 Semiconductor device having curved leads offset from the center of bonding pads
03/13/2008US20080064138 Perimeter matrix ball grid array circuit package with a populated center
03/13/2008US20080063880 Ultra-large scale integrated (ULSI); film stack; hydrosilation
03/13/2008US20080063123 GNSS receiver package
03/13/2008US20080062735 Nanoscale wire coding for stochastic assembly
03/13/2008US20080062623 Pad over active circuit system and method with frame support structure
03/13/2008US20080062607 Electrostatic discharge protection circuit
03/13/2008US20080062389 Method and apparatus for personalization of semiconductor
03/13/2008US20080061805 Voltage contrast monitor for integrated circuit defects
03/13/2008US20080061452 Bonded wafer and method of manufacturing the same
03/13/2008US20080061451 Semiconductor package and fabrication method thereof
03/13/2008US20080061450 Bonding wire and bond using a bonding wire
03/13/2008US20080061449 Semiconductor Component Arrangement
03/13/2008US20080061448 System and method for thermal expansion pre-compensated package substrate
03/13/2008US20080061447 Wire-bonded package with electrically insulating wire encapsulant and thermally conductive overmold
03/13/2008US20080061446 Semiconductor device with contact structure and manufacturing method thereof
03/13/2008US20080061445 Semiconductor device and method for manufacturing the same
03/13/2008US20080061444 Post passivation interconnection schemes on top of IC chip
03/13/2008US20080061443 Method of manufacturing semiconductor device
03/13/2008US20080061442 Interconnect structures and methods for fabricating the same
03/13/2008US20080061441 Flexible via design to improve reliability
03/13/2008US20080061440 Copper alloy bonding wire for semiconductor device
03/13/2008US20080061439 Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond
03/13/2008US20080061438 Method of forming metal line in semiconductor device
03/13/2008US20080061437 Packaging board, semiconductor module, and portable apparatus
03/13/2008US20080061436 Wafer level chip scale package and method for manufacturing the same
03/13/2008US20080061435 Structure of mounting electronic component and method of mounting the same
03/13/2008US20080061434 Substrate for semiconductor package and method of manufacturing the same
03/13/2008US20080061433 Methods and substrates to connect an electrical member to a substrate to form a bonded structure
03/13/2008US20080061432 Semiconductor device tape carrier, manufacturing method for semiconductor device, semiconductor device, and semiconductor module device
03/13/2008US20080061431 Power semiconductor module
03/13/2008US20080061430 Structure of heat dissipated submount
03/13/2008US20080061429 Instruments and method relating to thermal cycling
03/13/2008US20080061428 Package for sealing an integrated circuit die
03/13/2008US20080061427 Packaging structure and fabricating method thereof
03/13/2008US20080061426 Electronic Circuit Unit
03/13/2008US20080061425 Chip package structure and fabricating method thereof
03/13/2008US20080061424 Semiconductor apparatus
03/13/2008US20080061423 Method for producing a circuit module comprising at least one integrated circuit
03/13/2008US20080061422 Spacer spraying method and liquid crystal display manufactured by the same
03/13/2008US20080061421 Stacked chip package structure with leadframe having bus bar
03/13/2008US20080061420 Integrated passive devices with high q inductors
03/13/2008US20080061417 Mounting structure for ic tag and ic chip for mounting
03/13/2008US20080061415 Semiconductor device, method for manufacturing semiconductor device, and electric equipment system
03/13/2008US20080061414 Method of Producing a Semiconductor Package
03/13/2008US20080061413 Semiconductor component having a semiconductor die and a leadframe
03/13/2008US20080061412 Chip-stacked package structure with leadframe having multi-piece bus bar
03/13/2008US20080061411 Chip-stacked package structure for lead frame having bus bars with transfer pads
03/13/2008US20080061410 Electronic Device having wiring substrate and lead frame
03/13/2008US20080061409 Micro electro-mechanical system module package
03/13/2008US20080061408 Integrated circuit package
03/13/2008US20080061407 Semiconductor device package and manufacturing method
03/13/2008US20080061406 Semiconductor package having electromagnetic shielding part
03/13/2008US20080061405 Shielding noisy conductors in integrated passive devices
03/13/2008US20080061404 Electronic circuit package and fabricating method thereof
03/13/2008US20080061403 Dielectric layers for metal lines in semiconductor chips
03/13/2008US20080061402 Packaged Stacked Semiconductor Device And Method For Manufacturing The Same
03/13/2008US20080061398 Method for forming trench isolation structure
03/13/2008US20080061392 Photo-sensitive chip module package
03/13/2008US20080061382 Transistors, semiconductor integrated circuit interconnections and methods of forming the same
03/13/2008US20080061381 Method of manufacturing semiconductor integrated circuit device having capacitor element
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