Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/19/2008CN101146426A Heat radiation module
03/19/2008CN101146425A Heat radiator
03/19/2008CN101146424A Heat radiator
03/19/2008CN101146423A Heat radiator
03/19/2008CN101146422A Heat radiator
03/19/2008CN101146408A Wiring forming system and wiring forming method for forming wiring on wiring board
03/19/2008CN101146403A Pressing base board bar
03/19/2008CN101145688A Electrostatic discharge protection structures with reduced latch-up risks
03/19/2008CN101145592A High heat dispersion light emitting diode device
03/19/2008CN101145579A Inverted-trench grounded-source FET structure with trenched source body short electrode
03/19/2008CN101145568A Pixel structure and manufacture method of liquid crystal panel possessing same
03/19/2008CN101145567A Mother board, pixel array substrate, photoelectrical device and its manufacture method
03/19/2008CN101145565A Thin film transistor array substrate with multiple chamfers and liquid crystal display device
03/19/2008CN101145564A Active matrix display base plate preparing method
03/19/2008CN101145559A System-in-package type static random access memory device and manufacturing method thereof
03/19/2008CN101145558A Stackable semi-conductor package structure and manufacture method thereof
03/19/2008CN101145557A Stack type semiconductor packaging structure
03/19/2008CN101145556A System-in-package structure
03/19/2008CN101145555A Stack type semiconductor packaging structure
03/19/2008CN101145554A Signal transmission circuit and method thereof
03/19/2008CN101145553A Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same
03/19/2008CN101145552A Integrated circuit package substrate and making method
03/19/2008CN101145551A Integrated device
03/19/2008CN101145550A Semiconductor device and electronic circuit device using the same
03/19/2008CN101145549A Ball grating array package structure and package method
03/19/2008CN101145548A Universal packaging substrate and its application device
03/19/2008CN101145547A Ground wire layout graph for reducing microwave single-sheet integrated circuit standing wave ratio
03/19/2008CN101145546A Semiconductor device and method for fabricating the same
03/19/2008CN101145545A Semiconductor device containing wiring substrate coated with resin layer on element mounting surface
03/19/2008CN101145533A Method of fabricating semiconductor device
03/19/2008CN101145532A Semiconductor sensor and method of plating semiconductor devices
03/19/2008CN101145531A Solid package structure and manufacture method thereof
03/19/2008CN101145530A Electronic packages with fine particle wetting and non-wetting zones
03/19/2008CN101145527A Semiconductor device and method of manufacturing the same
03/19/2008CN101145526A Semiconductor package structure having electromagnetic shielding and making method thereof
03/19/2008CN101145516A Silicon base nitride single crystal thin film epitaxial structure and growth method
03/19/2008CN101145426A Inductor element and integrated electronic component
03/19/2008CN101145147A Three-dimensional multiprocessor system chip
03/19/2008CN101144741A Temperature detector
03/19/2008CN101144701A Insulation layer and semiconductor conducting layer aligning error electrical testing structure in micro-electro-mechanical system
03/19/2008CN101144608A Light source assembly and backlight module comprising same
03/19/2008CN101144605A Section bar
03/19/2008CN101144604A Section bar
03/19/2008CN101144591A LED fluorescent lamp
03/19/2008CN101144588A LED fluorescent tube
03/19/2008CN101144000A Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package
03/19/2008CN100376127C Heating element radiating structure
03/19/2008CN100376107C Photoelectric acquisition sensor
03/19/2008CN100376038C Electronics assembly and method for fabricating the same
03/19/2008CN100376036C Metal contact structure and method of manufacturing the same
03/19/2008CN100376030C 电路装置及其制造方法 Circuit device and manufacturing method thereof
03/19/2008CN100376029C Semiconductor package device and method for fabricating the same
03/19/2008CN100376028C Electronic module
03/19/2008CN100376027C Positioning fixture of heat sink module and assembling method
03/19/2008CN100376026C Method for making dual daascence interconnection of microelectronic device
03/19/2008CN100376023C Electronic component unit
03/19/2008CN100376022C Method for packing semiconductor device on printing circuit board and the printing circuit board
03/19/2008CN100376021C Flat bump package technics for integrated circuit or discrete component
03/18/2008US7345929 Semiconductor memory device and defect remedying method thereof
03/18/2008US7345892 Semiconductor device, noise reduction method, and shield cover
03/18/2008US7345885 Heat spreader with multiple stacked printed circuit boards
03/18/2008US7345882 Semiconductor module with heat sink and method thereof
03/18/2008US7345880 Heat sink module
03/18/2008US7345874 Heat dissipating device with dust-collecting mechanism
03/18/2008US7345873 System and method for cooling electronic systems
03/18/2008US7345645 Method of manufacturing substrate for circuit board and smart label having the substrate
03/18/2008US7345563 Embedded inductor for semiconductor device circuit
03/18/2008US7345497 Protection circuit for semiconductor device and semiconductor device including the same
03/18/2008US7345370 Wiring patterns formed by selective metal plating
03/18/2008US7345369 Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same
03/18/2008US7345368 Semiconductor device and the manufacturing method for the same
03/18/2008US7345367 Magnetic memory device and producing method thereof
03/18/2008US7345366 Apparatus and method for testing component built in circuit board
03/18/2008US7345365 Electronic component with die and passive device
03/18/2008US7345364 Structure and method for improved heat conduction for semiconductor devices
03/18/2008US7345363 Semiconductor device with a rewiring level and method for producing the same
03/18/2008US7345362 Electronic component and method for manufacturing the same
03/18/2008US7345361 Stackable integrated circuit packaging
03/18/2008US7345360 Multiple chips image sensor package
03/18/2008US7345359 Integrated circuit package with chip-side signal connections
03/18/2008US7345358 Copper interconnect for semiconductor device
03/18/2008US7345357 High density chip scale leadframe package and method of manufacturing the package
03/18/2008US7345356 Optical package with double formed leadframe
03/18/2008US7345353 Silicon carrier having increased flexibility
03/18/2008US7345352 Insulating tube, semiconductor device employing the tube, and method of manufacturing the same
03/18/2008US7345350 Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias
03/18/2008US7345349 Solid state imaging device and producing method thereof
03/18/2008US7345345 Semiconductor device
03/18/2008US7345342 Power semiconductor devices and methods of manufacture
03/18/2008US7345340 Semiconductor integrated circuit and a semiconductor device
03/18/2008US7345306 Corona based charge voltage measurement
03/18/2008US7345305 Control of liner thickness for improving thermal cycle reliability
03/18/2008US7345245 Robust high density substrate design for thermal cycling reliability
03/18/2008US7345102 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range
03/18/2008US7345000 Method and system for treating a dielectric film
03/18/2008US7344986 Plating solution, semiconductor device and method for manufacturing the same
03/18/2008US7344971 Manufacturing method of semiconductor device
03/18/2008US7344969 Stacked die in die BGA package
03/18/2008US7344968 Semiconductor chip having pads with plural junctions for different assembly methods
03/18/2008US7344960 Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
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