Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/20/2008US20080067598 Layout structure of electrostatic discharge protection circuit and production method thereof
03/20/2008US20080067592 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof
03/20/2008US20080067566 ferroelectric memory device may include a substrate, an interlayer insulating layer on the semiconductor substrate, a contact plug penetrating the interlayer insulating layer, the contact plug being formed of a sequentially stacked metal plug and buffer plug, a conductive protection pattern covering
03/20/2008US20080067555 Self-assembled monolayer based silver switches
03/20/2008US20080067552 Semiconductor integrated circuit device and method for desiging the same
03/20/2008US20080067509 Chip Comprising at Least One Test Contact Configuration
03/20/2008US20080066894 Normal-flow heat exchanger
03/20/2008US20080066890 Apparatus and method for passive phase change thermal management
03/20/2008US20080066304 Technique for laminating multiple substrates
03/20/2008US20080066302 Manufacturing method of package substrate
03/20/2008DE112004001131T5 Preßmassenaufsatz in einem Flip-Chip Multi-Matrix Anordnungspaket und Verfahren zu dessen Herstellung Preßmassenaufsatz in a flip-chip multi-array package and process for its preparation
03/20/2008DE112004000155T5 Anschlussrahmen für ein Halbleiterbauelement Lead frame for a semiconductor device
03/20/2008DE102006041515A1 Coated carbon nanotubes, e.g. useful as catalysts, comprise one or more transition metal layers formed by chemical vapor deposition
03/20/2008DE102006040764A1 Tranistor mit einem lokal vorgesehenem Metallsilizidgebiet in Kontaktbereichen und Herstellung des Transistors Tranistor with a locally the intended metal silicide contact areas and fabrication of the transistor
03/20/2008DE102004048745B4 Verfahren zum Ausbilden einer Bitleitungsstruktur A method of forming a bit line
03/20/2008DE102004022178B4 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way
03/20/2008DE102004004880B4 Verbindungsverfahren für direkt verbundene gestapelte integrierte Schaltungen sowie integrierter Schaltungschip und integriertes Schaltungsgehäuse Connection method to directly connected stacked integrated circuits and integrated circuit chip and integrated circuit package
03/20/2008CA2630824A1 Semiconductor device
03/19/2008EP1901353A2 Integrated passive devices with high Q inductors
03/19/2008EP1901352A1 Heat sink device generating an ionic wind
03/19/2008EP1901351A1 Heat transfer layer and method for producting the same
03/19/2008EP1901350A1 Heat dissipation device and power module
03/19/2008EP1901349A2 Semiconductor device and method of fabricating the same
03/19/2008EP1901348A2 Method for sealing microcomponent
03/19/2008EP1901344A1 Gold alloy wire for use as bonding wire exhibiting high initial bonding capability, high bonding reliability, high circularity of press bonded ball, high straight advancing property and high resin flow resistance
03/19/2008EP1901343A1 Gold alloy wire for use as bonding wire exhibiting high bonding reliability, high circularity of press bonded ball, high straight advancing property and high resin flow resistance
03/19/2008EP1901085A1 GNSS Receiver IC package
03/19/2008EP1900471A1 Silver-coated ball and method for manufacturing same
03/19/2008EP1900263A1 Fabrication of electronic components in plastic
03/19/2008EP1900040A1 Light emitting diode and method of fabricating the same
03/19/2008EP1900026A1 Method for the forgery-proof identification of individual electronic subassemblies
03/19/2008EP1900025A1 Hybrid conductive coating method for electrical bridging connection of rfid die chip to composite antenna
03/19/2008EP1900024A2 B-stageable film, electronic device, and associated process
03/19/2008EP1900023A2 Package, subassembly and methods of manufacturing thereof
03/19/2008EP1900022A1 Complete power management system implemented in a single surface mount package
03/19/2008EP1900019A2 Method for making electronic devices
03/19/2008EP1899416A1 Molding composition and method, and molded article
03/19/2008EP1531985A4 Thermal interconnect and interface systems, methods of production and uses thereof
03/19/2008EP1360726B1 Semiconductor component comprising ESD protection
03/19/2008CN201039657Y Heat radiator and its applying electronic device
03/19/2008CN201039655Y Heat radiator structure
03/19/2008CN201039653Y Fixing structure for no fan heat radiator
03/19/2008CN201039651Y Heat radiator
03/19/2008CN201039649Y Liquid-cooling heat radiator
03/19/2008CN201039646Y Heat equalizer for slot flat heat tube
03/19/2008CN201039645Y A heat radiation device of liquid recycling compound heat tube for electronic parts
03/19/2008CN201039644Y Efficient heat radiation cooling plate for electronic parts
03/19/2008CN201039643Y Combined base body structure for heat radiator
03/19/2008CN201039642Y Novel radiator
03/19/2008CN201039640Y Heat radiator with wind collection cover
03/19/2008CN201039638Y Heat radiator structure
03/19/2008CN201039637Y Composite heat exchange device
03/19/2008CN201039636Y Radiator
03/19/2008CN201039635Y Heat radiation structure
03/19/2008CN201039630Y Location structure for heat radiation device
03/19/2008CN201039523Y A high color index high-power white light LED part
03/19/2008CN201038990Y A three-phase commutation bridge encapsulation shell
03/19/2008CN201038192Y Sleeve structure thermocouple protection device
03/19/2008CN201038191Y Semiconductor refrigeration chip radiating device
03/19/2008CN201038190Y LED package structure
03/19/2008CN201038187Y Boring insert type light-emitting diode package structure
03/19/2008CN201038186Y Large power LED
03/19/2008CN201038162Y Power type separation device metal oxide semiconductor field effect transistor
03/19/2008CN201038161Y Wafer structure, chip structure and chip package structure
03/19/2008CN201038160Y Large power rectifying bridge device
03/19/2008CN201038159Y Light emitting diode module substrate with heat-conductive efficiency
03/19/2008CN201038158Y Audion lead wire frame
03/19/2008CN201038157Y Dot type electroplating audion lead wire frame
03/19/2008CN201038156Y Dot type electroplating lead wire frame
03/19/2008CN201038155Y Local electroplating large power lead wire frame
03/19/2008CN201038154Y Package method for improving element lamination in semiconductor plastic package
03/19/2008CN201038153Y Package method for preventing element lamination in semiconductor plastic package
03/19/2008CN201038152Y Package method for capable of improving element lamination of semiconductor plastic package
03/19/2008CN201038151Y Package method for effectively improving element lamination of semiconductor plastic package
03/19/2008CN201038150Y Semiconductor package structure possessing composite insulation layer
03/19/2008CN201038149Y Semiconductor package structure possessing composite insulation layer
03/19/2008CN201038148Y Packaging frame for three-electrode tube
03/19/2008CN201038147Y Chip packaging device
03/19/2008CN201038146Y Fastener structure
03/19/2008CN201038145Y CPU radiator fastener
03/19/2008CN201038144Y LED heat dissipation structure
03/19/2008CN201038143Y Radiator
03/19/2008CN201038142Y Computer CPU heat radiator
03/19/2008CN201038141Y Silicon rectifying element capable of outputting instant temperature signal
03/19/2008CN201038140Y Integral CPU water-cooling radiator
03/19/2008CN201038139Y Chip rack of digital optical processor
03/19/2008CN201038138Y Photovoltaic diode
03/19/2008CN201038137Y Infrared tube, tube holder and infrared tube module device
03/19/2008CN201038136Y CPU device
03/19/2008CN201038135Y Power amplifier LDMOS power amplifier tube fixing structure
03/19/2008CN201037636Y Lamp with heat dissipation structure
03/19/2008CN201037635Y Luminescent diode lamp with cover plate
03/19/2008CN101147255A An integrated circuit device package with an additional contact pad, a lead frame and an electronic device
03/19/2008CN101147254A Device and method for determining the temperature of a heat sink
03/19/2008CN101146434A Capillary organization structure of uniform heating board
03/19/2008CN101146433A Heat pipe structure of radiator
03/19/2008CN101146430A Ion wind heat radiator
03/19/2008CN101146429A Radiator of electronic device
03/19/2008CN101146428A Heat radiation module
03/19/2008CN101146427A Heat pipe radiator
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