Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/20/2008WO2008032785A1 Shield case and mems microphone having the same
03/20/2008WO2008032749A1 Resin composition and radiating spacer formed from the same
03/20/2008WO2008032706A1 Solid-state imaging device and method for manufacturing the same
03/20/2008WO2008032620A1 Semiconductor device
03/20/2008WO2008032566A1 Semiconductor device and method for manufacturing the same
03/20/2008WO2008032470A1 Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device
03/20/2008WO2008031638A1 Arrangement for cooling an electric circuitry in an engine driven motor vehicle
03/20/2008WO2008031633A1 Modular microelectronic system
03/20/2008WO2008031391A1 Surface-mountable housing for a semiconductor chip
03/20/2008WO2008031372A1 Power semiconductor module comprising an explosion protection system
03/20/2008WO2008031370A1 Power semiconductor module for energy distribution, comprising an explosion protection system
03/20/2008WO2008031281A1 A plugin, combined with a cooler, and thermoelectric separate led bulb
03/20/2008WO2008014193A3 Electrically inactive via for electromigration reliability improvement
03/20/2008WO2008014171A3 Thermal interconnect and interface materials, methods of production and uses thereof
03/20/2008WO2008014157A3 Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same
03/20/2008WO2008010982A3 Thermally imageable dielectric layers, thermal transfer donors and receivers
03/20/2008WO2007079277A3 Manufacturing method and device for making an in-mold circuit comprising a chip
03/20/2008US20080070453 Solder-bearing contacts and method of manufacture thereof and use in connectors
03/20/2008US20080070415 Method for burying resist and method for manufacturing semiconductor device
03/20/2008US20080070403 Method and arrangement for contacting terminals
03/20/2008US20080070401 Memory device and method for manufacturing the same
03/20/2008US20080070400 Semiconductor device and manufacturing method thereof
03/20/2008US20080070398 Method For Fabricating Semiconductor Device Having Metal Fuse
03/20/2008US20080070349 Formation of holes in substrates using dewetting coatings
03/20/2008US20080070348 Method for fabricating resin-molded semiconductor device having posts with bumps
03/20/2008US20080070346 Structure of high performance combo chip and processing method
03/20/2008US20080070345 Structure of high performance combo chip and processing method
03/20/2008US20080069971 Electrically sensing a specific binding between the recognition molecule and an analyte by controlled deposition by attaching or adsorption of molecules on the surface of the device by thermal and/or electrochemical spotting of (bio)molecules; anchoring layer for immobilization; simplification
03/20/2008US20080068817 Printed circuit board unit and electronic apparatus
03/20/2008US20080068806 Plasma Display Panel
03/20/2008US20080068037 Semiconductor device, method for measuring characteristics of element to be measured, and characteristic management system of semiconductor device
03/20/2008US20080067699 Semiconductor Apparatus and Method of Producing the Same
03/20/2008US20080067698 Integrated circuit package system with encapsulation lock
03/20/2008US20080067697 Integrated circuit wire patterns including integral plug portions and methods of fabricating the same
03/20/2008US20080067696 Method and apparatus for prevention of solder corrosion
03/20/2008US20080067695 Semiconductor assembly with component attached on die back side
03/20/2008US20080067694 Post passivation interconnection schemes on top of IC chip
03/20/2008US20080067693 Post passivation interconnection schemes on top of IC chip
03/20/2008US20080067692 Semiconductor devices having contact pad protection for reduced electrical failures and methods of fabricating the same
03/20/2008US20080067691 Transistor Structure and Control Unit Comprising the Same
03/20/2008US20080067690 Semiconductor device
03/20/2008US20080067689 Deep Via Construction for a Semiconductor Device and a Method of Manufacturing Same
03/20/2008US20080067688 Power-via structure for integration in advanced logic/smart-power technologies
03/20/2008US20080067687 Pad over active circuit system and method with meshed support structure
03/20/2008US20080067686 Post passivation interconnection schemes on top of IC chip
03/20/2008US20080067685 Semiconductor Device Manufacturing Method
03/20/2008US20080067684 Semiconductor device
03/20/2008US20080067683 Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
03/20/2008US20080067682 Bonding Pad for Contacting a Device
03/20/2008US20080067681 Interconnection structure and manufacturing method thereof
03/20/2008US20080067680 Semiconductor device and fabrication process thereof
03/20/2008US20080067679 Semiconductor Device and Method for Manufacturing the Same, and Processing Liquid
03/20/2008US20080067678 Semiconductor Devices Having Contact Holes Including Protrusions Exposing Contact Pads and Methods of Fabricating the Same
03/20/2008US20080067677 Structure and manufacturing method of a chip scale package
03/20/2008US20080067676 Electrical interconnection structure formation
03/20/2008US20080067675 Castellation wafer level packaging of integrated circuit chips
03/20/2008US20080067674 System in package (sip) integrated circuit and packaging method thereof
03/20/2008US20080067673 Semiconductor device
03/20/2008US20080067672 Semiconductor device and method for fabricating the same
03/20/2008US20080067671 Semiconductor device and method for manufacturing the same
03/20/2008US20080067670 Underfill film having thermally conductive sheet
03/20/2008US20080067669 Systems, devices and methods for controlling thermal interface thickness in a semiconductor die package
03/20/2008US20080067668 Microelectronic package, method of manufacturing same, and system containing same
03/20/2008US20080067667 Semiconductor device with a semiconductor chip stack and plastic housing, and methods for producing the same
03/20/2008US20080067666 Circuit board structure with embedded semiconductor chip and method for fabricating the same
03/20/2008US20080067665 Via structure
03/20/2008US20080067664 Cap wafer, semiconductor chip having the same, and fabrication method thereof
03/20/2008US20080067663 Wafer level chip package and a method of fabricating thereof
03/20/2008US20080067662 Modularized Die Stacking System and Method
03/20/2008US20080067661 Resin wiring substrate, and semiconductor device and laminated semiconductor device using the same
03/20/2008US20080067660 Semiconductor device package
03/20/2008US20080067659 Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring
03/20/2008US20080067658 Stacked die semiconductor package
03/20/2008US20080067657 Integrated circuit devices with multi-dimensional pad structures
03/20/2008US20080067656 Stacked multi-chip package with EMI shielding
03/20/2008US20080067655 Device Comprising an Encapsulated Microsystem and Production Method Thereof
03/20/2008US20080067654 Electronic component package and electronic component device
03/20/2008US20080067653 Reduction in Thickness of Semiconductor Component on Substrate
03/20/2008US20080067652 Integrated mems packaging
03/20/2008US20080067650 Electronic component package with EMI shielding
03/20/2008US20080067649 Semiconductor device, lead-frame product used for the same and method for manufacturing the same
03/20/2008US20080067648 Locking Feature and Method for Manufacturing Transfer Molded IC Packages
03/20/2008US20080067647 Semiconductor device
03/20/2008US20080067646 Semiconductor leadframe for uniform mold compound flow
03/20/2008US20080067645 Heat spreader for semiconductor package
03/20/2008US20080067644 Microelectronic component assemblies and microelectronic component lead frame structures
03/20/2008US20080067643 Semiconductor device and method of manufacturing the same
03/20/2008US20080067642 Packaged microelectronic components
03/20/2008US20080067641 Package semiconductor and fabrication method thereof
03/20/2008US20080067640 Integrated circuit package system with encapsulation lock
03/20/2008US20080067639 Integrated circuit package system with encapsulation lock
03/20/2008US20080067638 Chip-scale packaging leadframe for memory chip
03/20/2008US20080067636 Insulating film and semiconductor device using this film
03/20/2008US20080067635 Chip-mounted film package
03/20/2008US20080067634 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
03/20/2008US20080067624 Lateral high-voltage devices with optimum variation lateral flux by using field plate
03/20/2008US20080067602 Multi-pad shared current dissipation with heterogenic current protection structures
03/20/2008US20080067601 Esd protection apparatus and circuit thereof
03/20/2008US20080067600 Storage Elements with Disguised Configurations and Methods of Using the Same
03/20/2008US20080067599 Semiconductor device and method of manufacturing the same
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