Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/26/2008CN101150095A Enhanced encapsulation structure and its reinforced part
03/26/2008CN101150094A Semiconductor crystal circle structure
03/26/2008CN101150091A Pixel structure and its making method
03/26/2008CN101150087A Device with plating through structure and its making method
03/26/2008CN101150081A Solid encapsulation structure and its making method
03/26/2008CN101150078A Making method for semiconductor device and semiconductor device
03/26/2008CN101150076A Making method for semiconductor encapsulation component and semiconductor part location structure and method
03/26/2008CN101150075A Carrier and its making method
03/26/2008CN101150073A A thin film transistor and its making method
03/26/2008CN101149964A Semiconductor memory device
03/26/2008CN101149818A Semiconductor device
03/26/2008CN101149564A Alignment mark and its imaging optical system and imaging method
03/26/2008CN101149550A Array substrate and display apparatus having the same
03/26/2008CN101149458A Chip packaged fixed focus focusing-free imaging module processing method
03/26/2008CN101149143A LED energy-saving lamp panel and its drive circuit
03/26/2008CN101148542A Heat-curable silicone composition and light emitting diode element using same
03/26/2008CN100377633C Electronic apparatus incorporating a cooling unit
03/26/2008CN100377374C Method for fabricating lead wire rack of light emitting diode
03/26/2008CN100377361C Structure of image sensor module and wafer level package and its forming method
03/26/2008CN100377353C Semiconductor wafer and its producing method
03/26/2008CN100377351C Integrated circuit and layered lead frame package
03/26/2008CN100377349C 半导体装置 Semiconductor device
03/26/2008CN100377348C Partial inter-locking metal contact structure for semiconductor devices and method of manufacturing the same
03/26/2008CN100377347C 半导体器件 Semiconductor devices
03/26/2008CN100377346C Encapsulation piece
03/26/2008CN100377345C Method for molding air tightness cavity
03/26/2008CN100377344C Mini-size trench flat plate, heat pipe and manufacturing method of the heat pipe
03/26/2008CN100377343C Manufacturing method of heat radiation device
03/26/2008CN100377342C Hot pipe
03/26/2008CN100377341C Heat radiator and manufacturing method thereof
03/26/2008CN100377340C Thermal module and manufacturing method thereof
03/26/2008CN100377339C Heat radiator
03/26/2008CN100377338C Semiconductor device and electronic apparatus
03/26/2008CN100377337C Semiconductor device, wiring substrate, and method for manufacturing wiring substrate
03/26/2008CN100377336C Semiconductor device and its producing method
03/26/2008CN100377333C Semiconductor structure with one or more through-holes
03/26/2008CN100377325C Film carrier tape for mounting electronic component
03/26/2008CN100377309C Method and equipment for applying adhesive tape
03/26/2008CN100377284C Conductive sintering briquette for fixing electrode of electronic element envelop
03/26/2008CN100376993C Thin film transistor array panel for a liquid crystal display
03/26/2008CN100376622C Polyimide film and process for producing the same
03/25/2008USRE40188 System and method for providing an integrated circuit with a unique identification
03/25/2008US7349724 Radio frequency arrangement and production method and also use
03/25/2008US7349575 Pattern inspection method and apparatus, and pattern alignment method
03/25/2008US7349224 Semiconductor device and printed circuit board
03/25/2008US7349217 IC socket assembly
03/25/2008US7349214 Heat dissipation structure of intelligent power module, display module having the same, and method for installing heat dissipation plate for intelligent power module
03/25/2008US7348864 Integrated MMIC modules for millimeter and submillimeter wave system applications
03/25/2008US7348856 Semiconductor device
03/25/2008US7348682 Method and structures for indexing dice
03/25/2008US7348681 Comprising sets of colored particles in dielectric fluid, where at least one of sets of particles is poly(meth)acrylate/hydrophilic monomer) emulsion aggregation polymer particles capable of field-induced charging; capable of generating and displaying full color images reliably and rapidly; stability
03/25/2008US7348680 Electronic device and use thereof
03/25/2008US7348679 Electronic part having reinforcing member
03/25/2008US7348678 Integrated circuit package to provide high-bandwidth communication among multiple dice
03/25/2008US7348676 Semiconductor device having a metal wiring structure
03/25/2008US7348675 Microcircuit fabrication and interconnection
03/25/2008US7348674 Low capacitance wiring layout
03/25/2008US7348673 Semiconductor device
03/25/2008US7348672 Interconnects with improved reliability
03/25/2008US7348671 Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
03/25/2008US7348670 Nanostructure, electronic device and method of manufacturing the same
03/25/2008US7348669 Bump structure of semiconductor device and method of manufacturing the same
03/25/2008US7348668 Semiconductor device and method of manufacturing the same
03/25/2008US7348667 System and method for noise reduction in multi-layer ceramic packages
03/25/2008US7348666 Chip-to-chip trench circuit structure
03/25/2008US7348665 Liquid metal thermal interface for an integrated circuit device
03/25/2008US7348664 Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device
03/25/2008US7348663 Integrated circuit package and method for fabricating same
03/25/2008US7348662 Composite multi-layer substrate and module using the substrate
03/25/2008US7348661 Array capacitor apparatuses to filter input/output signal
03/25/2008US7348660 Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package
03/25/2008US7348659 Semiconductor device and method of manufacturing thereof
03/25/2008US7348654 Capacitor and inductor scheme with e-fuse application
03/25/2008US7348649 Transparent conductive film
03/25/2008US7348623 Semiconductor device including a MIM capacitor
03/25/2008US7348599 Semiconductor device and manufacturing method thereof
03/25/2008US7348597 Apparatus for performing high frequency electronic package testing
03/25/2008US7348594 Test structures and models for estimating the yield impact of dishing and/or voids
03/25/2008US7348499 Electrical enclosure removable backplate
03/25/2008US7348493 Metal-ceramic circuit board
03/25/2008US7348492 Flexible wiring board and electrical device using the same
03/25/2008US7348271 Method for fabricating conductive bumps with non-conductive juxtaposed sidewalls
03/25/2008US7348261 Wafer scale thin film package
03/25/2008US7348251 Modulated trigger device
03/25/2008US7348230 Manufacturing method of semiconductor device
03/25/2008US7348217 Method and structure for interfacing electronic devices
03/25/2008US7348215 Methods for assembly and packaging of flip chip configured dice with interposer
03/25/2008US7348214 Integrated circuit package with improved power signal connection
03/25/2008US7348213 Method for forming component mounting hole in semiconductor substrate
03/25/2008US7348211 Method for fabricating semiconductor packages
03/25/2008US7348203 Hermetic packaging
03/25/2008US7348191 Semiconductor device with terminals, and method of manufacturing the same
03/25/2008US7348069 Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate
03/25/2008US7347955 Thermoconductive molecular oriented liquid crystal polymers used as heat exchanger in electronics
03/25/2008US7347702 Contact carriers (tiles) for populating larger substrates with spring contacts
03/25/2008US7347354 Metallic solder thermal interface material layer and application of the same
03/25/2008US7347347 Head assembly, disk unit, and bonding method and apparatus
03/20/2008WO2008033708A2 Methods and apparatus for bonding electrical member to substrate
03/20/2008WO2008032944A1 Flip chip semiconductor package and fabrication method thereof
03/20/2008WO2008032786A1 Display device
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