Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2008
03/27/2008US20080073757 Semiconductor dies and methods and apparatus to mold lock a semiconductor die
03/27/2008US20080073756 Module with a shielding and/or heat dissipating element
03/27/2008US20080073754 Coating compositions for photolithography
03/27/2008US20080073753 Test line placement to improve die sawing quality
03/27/2008US20080073725 Buried guard ring structures and fabrication methods
03/27/2008US20080073721 Semiconductor integrated circuit device
03/27/2008US20080073720 Electrostatic discharge protection device
03/27/2008US20080073714 Semiconductor device
03/27/2008US20080073711 Method of manufacturing a semiconductor integrated circuit device having a columnar laminate
03/27/2008US20080073436 Memory Card
03/27/2008US20080073027 Alignment method and mounting method using the alignment method
03/27/2008DE202008000623U1 Kühlrippe Fin
03/27/2008DE112004002466T5 Verfahren und Vorrichtung zur verbesserten Energieführung Method and apparatus for improved energy management
03/27/2008DE10248373B4 Teststruktur zum Bestimmen eines Kurzschlusses zwischen Grabenkondensatoren in einem Speicherzellenfeld Test structure for determining a short circuit between grave capacitors in a memory cell array
03/27/2008DE102007047245A1 Metallic intermediate connection manufacturing method for semiconductor memory components, involves forming germ layer on surface of recess and electro polishing germ layer before filling recess with metal material
03/27/2008DE102007043710A1 Tiefe Durchkontaktierungskonstruktion für eine Halbleitereinrichtung und ein Verfahren zu Ihrer Herstellung Depth Durchkontaktierungskonstruktion for a semiconductor device and a method for their preparation
03/27/2008DE102007038385A1 Halbleitervorrichtung Semiconductor device
03/27/2008DE102007038169A1 Verfahren zum Verpacken auf Waferebene unter Verwendung von Waferdurchgangslöchern mit geringem Aspektverhältnis A method of packaging at the wafer level using wafer through holes with a low aspect ratio
03/27/2008DE102007036345A1 Gekapselter integrierter Schaltkreis Encapsulated integrated circuit
03/27/2008DE102007034014A1 Wechselstromgenerator für ein Fahrzeug An alternator for a vehicle
03/27/2008DE102006045131A1 Die has strip conductor test structure, which has two conductive structures, arranged for detecting short-circuit damage between two conductive structures
03/27/2008DE102006045094A1 Chip-to-chip connections manufacturing method for three dimensional-integration of individual chip-to-chip stack, involves attaching adhesive material on joint contacts, where adhesive material has recesses in pattern of connection model
03/27/2008DE102006044691A1 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making
03/27/2008DE102006043785A1 Elektronische Baugruppe Electronic assembly
03/27/2008DE102006043404A1 Oberflächenmontierbares Gehäuse für einen Halbleiterchip Surface mount housing for a semiconductor chip
03/27/2008DE102006043163A1 Verfahren zur Herstellung eines Verbundwerkstoffs, zugehöriger Verbundwerkstoff sowie zugehörige Halbleiterschaltungsanordnungen A process for producing a composite material, associated composite material and associated semiconductor circuitry
03/27/2008DE102006043133A1 Anschlusspad zu einem Kontaktieren eines Bauelements Connection pad to a contact of a component
03/27/2008DE102006042774A1 Verfahren zur Herstellung einer elektrischen Ankontaktierung A method for producing an electrical contacting of
03/27/2008DE102006040838A1 Electronic power package for high power electronic device, has two non-planar insulating substrates with high thermal conductivity with electrical conductivity layers which are separated and isolated from each other
03/27/2008DE102006039975A1 Niederinduktives Leistungshalbleitermodul für stromeingeprägte Leistungsschaltungen Niederinduktives power semiconductor module for power-embossed power circuits
03/27/2008DE102005033254B4 Verfahren zur Herstellung eines Chip-Trägersubstrats aus Silizium mit durchgehenden Kontakten A method of manufacturing a chip carrier substrate of silicon with through contacts
03/27/2008DE102004045009B4 Elektrisches Bauelement und dessen Verwendung The electrical component and the use thereof
03/27/2008DE10200399B4 Verfahren zur Erzeugung einer dreidimensional integrierten Halbleitervorrichtung und dreidimensional integrierte Halbleitervorrichtung Method for producing a three-dimensional integrated semiconductor device and three-dimensionally integrated semiconductor device
03/27/2008DE10085150B4 Wärmesenke mit Klemmvorrichtung für elektrische Komponenten Heat sink with clamping device for electrical components
03/27/2008CA2663058A1 Electronic device module comprising an ethylene multi-block copolymer
03/26/2008EP1903606A2 Stackable tier structure comprising an IC die and a high density feedthrough structure
03/26/2008EP1903605A1 Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the same
03/26/2008EP1902468A1 Method for the production of a functional assembly, and functional assembly
03/26/2008EP1902467A1 Mmic having back-side multi-layer signal routing
03/26/2008EP1902466A2 Schottky diode with improved surge capability
03/26/2008EP1751800B1 Method for suppressing latch-ups occurring in a circuit, and systems for carrying out said method
03/26/2008EP1733424A4 A semiconductor apparatus
03/26/2008EP1719174B1 Protective diode for protecting semiconductor switching circuits from electrostatic discharges
03/26/2008EP1697991A4 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
03/26/2008EP1668704A4 Integrated circuit suitable for use in radio receivers
03/26/2008EP1573256A4 Compact, high-efficiency thermoelectric systems
03/26/2008EP1421609B1 Process and apparatus for treating a workpiece such as a semiconductor wafer
03/26/2008EP1384266B1 Arrangement comprising at least two different electronic semiconductor circuits
03/26/2008CN201042116Y Clamper for heat radiator
03/26/2008CN201041806Y An ESD protection part for enlarging valid pass area of static current
03/26/2008CN201041805Y A protective part for constructing ESD discharge channel based on multi-crystal silicon
03/26/2008CN201041804Y A static discharge protection part
03/26/2008CN101151728A Anisotropic electrically conductive structure
03/26/2008CN101151727A 集成电路芯片封装和方法 An integrated circuit chip package and method
03/26/2008CN101151726A Radiation curable cycloaliphatic barrier sealants
03/26/2008CN101151683A Conductor powder and process for producing the same, and electrically conductive resin composition
03/26/2008CN101151585A Cooling unit
03/26/2008CN101151385A Cu-Ni-Si-Co-Cr based copper alloy for electronic material and method for production thereof
03/26/2008CN101150945A Radiator
03/26/2008CN101150944A Heat radiator
03/26/2008CN101150943A Heat radiation device and its fan fixing part
03/26/2008CN101150173A Nonvolatile memory device and fabrication method thereof
03/26/2008CN101150146A Semiconductor device and method for fabricating thereof
03/26/2008CN101150143A Semiconductor chip and its encapsulation structure and making method
03/26/2008CN101150140A Organic light emitting display
03/26/2008CN101150139A Organic light emitting display device
03/26/2008CN101150136A Metal connection structure for CMOS image sensor integrated circuit and its making method
03/26/2008CN101150135A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/26/2008CN101150133A Transistor nonvolatile memory cell and its related memory array
03/26/2008CN101150127A Storage elements with disguised configurations and methods of using the same
03/26/2008CN101150126A ESD protection apparatus and circuit thereof
03/26/2008CN101150124A Encapsulation structure and electronic device using this encapsulation structure
03/26/2008CN101150123A Semiconductor encapsulation structure with electromagnetic shielding cover
03/26/2008CN101150122A Semiconductor encapsulation structure with electromagnetic shielding function
03/26/2008CN101150121A Flexible circuits having improved reliability and thermal dissipation
03/26/2008CN101150120A Stacked semiconductor package, method of fabrication, and method of wire-bond monitoring
03/26/2008CN101150119A Stacked semiconductor package and method of manufacturing the same
03/26/2008CN101150118A 半导体装置 Semiconductor device
03/26/2008CN101150117A Semiconductor encapsulation structure and its making process
03/26/2008CN101150116A Semiconductor encapsulation structure with electromagnetic shielding function and its making method
03/26/2008CN101150115A Conductive resistance blocking layer material for copper interconnection and making method
03/26/2008CN101150114A Semiconductor device
03/26/2008CN101150113A A semiconductor device and a method of increasing a resistance value of an electric fuse
03/26/2008CN101150112A Semiconductor device and fabrication process thereof
03/26/2008CN101150111A Encapsulation base plate
03/26/2008CN101150110A Semiconductor package and its base plate structure
03/26/2008CN101150109A Leading wire frame
03/26/2008CN101150108A Semiconductor encapsulation structure
03/26/2008CN101150107A Base plate impedance match device
03/26/2008CN101150106A Encapsulation structure and its encapsulation base plate
03/26/2008CN101150105A Semiconductor device and method of manufacturing the same
03/26/2008CN101150104A External pin structure, active part array base plate, photoelectric device and making method
03/26/2008CN101150103A A crystal wafer chip dimension encapsulation line and its making method
03/26/2008CN101150102A Semiconductor device and method for manufacturing the same
03/26/2008CN101150101A Integrated heat radiation method, system and corresponding heat radiation device
03/26/2008CN101150100A Power conversion device and heat-pipe cooler therefor
03/26/2008CN101150099A Power conversion device and heat-pipe cooler therefor
03/26/2008CN101150098A 半导体器件 Semiconductor devices
03/26/2008CN101150097A Semiconductor device and method for manufacturing the same
03/26/2008CN101150096A Recycling pressing and printing device for crystal wafer connection
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