Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2008
04/01/2008US7352046 Semiconductor integrated circuit device
04/01/2008US7352045 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
04/01/2008US7352039 Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device
04/01/2008US7352032 Output driver with split pins
04/01/2008US7352031 Electrostatic-breakdown-preventive and protective circuit for semiconductor-device
04/01/2008US7352019 Capacitance reduction by tunnel formation for use with a semiconductor device
04/01/2008US7352014 Semiconductor device based on a SCR
04/01/2008US7352010 Photoelectric conversion module with cooling function
04/01/2008US7352001 Method of editing a semiconductor die
04/01/2008US7351993 Rare earth-oxides, rare earth-nitrides, rare earth-phosphides and ternary alloys with silicon
04/01/2008US7351920 IC card and semiconductor integrated circuit device package
04/01/2008US7351918 Surface-mount base for electronic element
04/01/2008US7351655 Copper interconnect systems which use conductive, metal-based cap layers
04/01/2008US7351651 Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
04/01/2008US7351650 Post passivation interconnection schemes on top of the IC chips
04/01/2008US7351649 Recording head unit and method of producing the same
04/01/2008US7351645 Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
04/01/2008US7351610 Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate
04/01/2008US7351479 Durable EMI shielding film
04/01/2008US7351361 Metal or alloy having a melting point of 230 degrees C. or higher, alloy having a melting point lower than 230 degrees C.; epoxy-based, phenolic-based or acrylic-based thermosetting or thermoset resin or polyethylene type, polyester type, polypropylene type or acrylic type thermoplastic resin
04/01/2008US7350988 Optical module and method of manufacturing the same
04/01/2008US7350686 Method for supplying solder
04/01/2008US7350293 Low profile ball-grid array package for high power
04/01/2008CA2409912C Improvements in grounding and thermal dissipation for integrated circuit packages
04/01/2008CA2177276C Method for fabricating self-assembling microstructures
03/2008
03/27/2008WO2008036722A2 Locking feature and method for manufacturing transfer molded ic packages
03/27/2008WO2008036707A2 Electronic device module comprising an ethylene multi-block copolymer
03/27/2008WO2008036571A2 An integrated circuit micro-cooler with double-sided tubes of a cnt array
03/27/2008WO2008036568A2 An integrated circuit micro-cooler having multi-layers of tubes of a cnt array
03/27/2008WO2008036556A2 Semiconductor leadframe for uniform mold compound flow
03/27/2008WO2008036208A2 Wafer level chip package and a method of fabricating thereof
03/27/2008WO2008036052A1 Electronic package and method of assembling the same
03/27/2008WO2008035742A1 Thermal interface structure and method for manufacturing the same
03/27/2008WO2008035650A1 Socket, module board, and inspection system using the module board
03/27/2008WO2008035614A1 Semiconductor module and semiconductor module manufacturing method
03/27/2008WO2008035579A1 Cooling apparatus
03/27/2008WO2008035570A1 Electric connector
03/27/2008WO2008035536A1 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
03/27/2008WO2008035452A1 Cooling device for mobile body
03/27/2008WO2008035270A2 Method of manufacturing a vertical contact in a semiconductor substrate
03/27/2008WO2008035261A1 Electronic device and method for making the same
03/27/2008WO2008034814A2 Benzoxazine-containing formulations polymerizable/curable at low temperature
03/27/2008WO2008034597A1 Integrated circuit arrangement and use of supply cables
03/27/2008WO2008034356A1 Electronic component package with emi shielding and method of making the same
03/27/2008WO2008012678A3 Leaded stacked packages having elevated die paddle
03/27/2008WO2008006045A3 Guided pin and plunger
03/27/2008WO2007076090A3 Passive fluid recovery system
03/27/2008WO2007050774B1 Universal pad arrangement for surface mounted semiconductor devices
03/27/2008US20080077195 Package for an Implantable Device
03/27/2008US20080076997 Analyte monitoring device and methods of use
03/27/2008US20080076262 Method and system for treating a dielectric film
03/27/2008US20080076235 Buffer layers for device isolation of devices grown on silicon
03/27/2008US20080076206 Lead frame routed chip pads for semiconductor packages
03/27/2008US20080075887 Electronic Device and Method for Manufacturing the Same
03/27/2008US20080075855 Carbiding, nitriding or metallization; vapor deposition of carbides, carbonitrides, nitrides or metal silicon nitrides or carbides from organometallic compounds in presence of adhesion promoter; forming copper film
03/27/2008US20080074929 Application specific semiconductor integrated circuit and its manufacturing method thereof
03/27/2008US20080074913 Semiconductor integrated circuit device and method for designing the same
03/27/2008US20080074852 Elimination of RDL using tape base flip chip on flex for die stacking
03/27/2008US20080073799 Mould having nano-scaled holes
03/27/2008US20080073798 Semiconductor device and manufacturing method thereof
03/27/2008US20080073797 Semiconductor die module and package and fabricating method of semiconductor package
03/27/2008US20080073796 Electrically Optimized and Structurally Protected Via Structure for High Speed Signals
03/27/2008US20080073795 Integrated circuit interconnection devices and methods
03/27/2008US20080073794 Semiconductor apparatus and fabrication method thereof
03/27/2008US20080073793 Al-Ni-BASED ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
03/27/2008US20080073792 Electronic device and method for production
03/27/2008US20080073791 Wire pad of semiconductor device
03/27/2008US20080073790 METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION
03/27/2008US20080073789 Method Of Identifying And/Or Programming An Integrated Circuit
03/27/2008US20080073788 Semiconductor device and method of fabricating the same
03/27/2008US20080073787 Method forming metal interconnection filling recessed region using electro-plating technique
03/27/2008US20080073786 Semiconductor device and method of manufacturing the same
03/27/2008US20080073785 Semiconductor device having sealing film and manufacturing method thereof
03/27/2008US20080073784 Circuit substrate for preventing warpage and package using the same
03/27/2008US20080073783 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
03/27/2008US20080073782 Semiconductor package comprising alignment members
03/27/2008US20080073781 Integrated circuit package system for chip on lead
03/27/2008US20080073780 Semiconductor device and method for manufacturing the same
03/27/2008US20080073779 Stacked semiconductor package and method of manufacturing the same
03/27/2008US20080073778 Two-way heat extraction from packaged semiconductor chips
03/27/2008US20080073777 Multiple integrated circuit die package with thermal performance
03/27/2008US20080073776 Sintered metallic thermal interface materials for microelectronic cooling assemblies
03/27/2008US20080073775 Surface adapting cap with integral adapting material for single and multi chip module assembly
03/27/2008US20080073774 Chip package and chip package array
03/27/2008US20080073773 Electronic device and production method
03/27/2008US20080073772 Stacked semiconductor package and method of manufacturing the same
03/27/2008US20080073771 Semiconductor package and semiconductor system in package using the same
03/27/2008US20080073770 Integrated circuit package system with stacked die
03/27/2008US20080073769 Semiconductor package and semiconductor device
03/27/2008US20080073768 Electronic component device
03/27/2008US20080073767 Pressure-contact semiconductor device
03/27/2008US20080073766 System for manufacturing microelectronic, microoptoelectronic or micromechanical devices
03/27/2008US20080073765 Ic chip package having automated tolerance compensation
03/27/2008US20080073764 Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same
03/27/2008US20080073763 Semiconductor device and method of manufacturing the same
03/27/2008US20080073762 Semiconductor device package
03/27/2008US20080073761 Semiconductor package and stacked semiconductor package
03/27/2008US20080073760 Capacitor assembly with shielded connections and method for forming the same
03/27/2008US20080073759 Semiconductor package
03/27/2008US20080073758 Method and apparatus for directing molding compound flow and resulting semiconductor device packages
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