Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/02/2014CN103904064A 硅穿孔修补电路 Silicon perforation repair circuit
07/02/2014CN103904063A 具有带阻滤波器的封装基板和包括带阻滤波器的半导体封装 Having a band stop filter comprises a package substrate and a semiconductor package band rejection filter
07/02/2014CN103904062A 内埋式电子元件封装结构 Buried electronic component packaging structure
07/02/2014CN103904061A 内埋式电子元件封装结构 Buried electronic component packaging structure
07/02/2014CN103904060A Tft lcd阵列对位标记设计及制造方法 Tft lcd array alignment mark design and method of manufacture
07/02/2014CN103904059A 晶圆后段电容电性测试结构 Wafer-stage capacitive test structure
07/02/2014CN103904058A 一种栅氧介质测试结构 One kind of gate oxide dielectric test structure
07/02/2014CN103904057A PoP封装结构及制造工艺 PoP package structure and manufacturing process
07/02/2014CN103904056A 一种PoP封装结构及制造工艺 One kind PoP package structure and manufacturing process
07/02/2014CN103904055A 一种接触孔刻蚀阻挡层结构及其制备方法 A via etch barrier layer structure and preparation method thereof contacting
07/02/2014CN103904054A 基于玻璃基板的互连结构及方法 Interconnect structure and method based on a glass substrate
07/02/2014CN103904053A 芯片堆叠结构 Chip stack structure
07/02/2014CN103904052A 后钝化结构中的电容器及其形成方法 After the passivation structure and method of forming a capacitor
07/02/2014CN103904051A 用于经减小串扰的两层差分对布局及其制造方法 Reduce crosstalk through two differential pairs and a manufacturing method for layout
07/02/2014CN103904050A 封装基板、封装基板制作方法及封装结构 Package substrate, the package substrate fabrication method and package structure
07/02/2014CN103904049A 一种igbt模块辅助电极结构及该结构的固定方法 A fixed-electrode structure and method of the structure igbt module auxiliary
07/02/2014CN103904048A 内置式芯片封装结构 Built-in chip package structure
07/02/2014CN103904047A 多功能半导体封装结构及其制作方法 Multifunctional semiconductor package structure and production methods
07/02/2014CN103904046A 作为热电容和散热装置的无源组件 As passive components and heat sink thermal capacitance
07/02/2014CN103904045A 一种侧壁绝缘的圆片级csp封装结构及其封装方法 One kind of sidewall insulation csp package and wafer level packaging method
07/02/2014CN103904044A 一种扇出型晶圆级封装结构及制造工艺 One kind of fan-out wafer level package structure and manufacturing process
07/02/2014CN103904043A 电子部件 Electronic components
07/02/2014CN103904042A 封装片 Encapsulation sheet
07/02/2014CN103904041A 真空密封封装 Hermetically sealed
07/02/2014CN103904040A 影像感测器模组及取像模组 Image sensor module and take like modules
07/02/2014CN103904039A 超薄凹式玻璃基板的封装结构及方法 Package structure and method of thin glass substrates concave
07/02/2014CN103904038A 基于低温共烧陶瓷技术的毫米波表贴型封装外壳 LTCC technology based on millimeter shell surface mount type packages
07/02/2014CN103904024A 形成半导体器件的双镶嵌结构的方法以及由其制造的半导体器件 Dual damascene method of forming a semiconductor device structures and semiconductor devices fabricated therefrom
07/02/2014CN103903995A 半导体装置的制造方法及半导体装置 The method of manufacturing a semiconductor device and semiconductor device
07/02/2014CN103901977A 散热装置 Cooling devices
07/02/2014CN103900951A 一种半导体器件中粘附力检测结构及其制备方法 A semiconductor device in adhesion detection structure and preparation method
07/02/2014CN103897344A 用于封装半导体器件的环氧树脂组合物以及使用其封装的半导体器件 The epoxy resin composition for encapsulating a semiconductor device and a semiconductor device using encapsulates
07/02/2014CN103897342A 用于封装半导体器件的环氧树脂组合物和使用其封装的半导体器件 The epoxy resin composition for encapsulating a semiconductor device and a semiconductor device using encapsulates
07/02/2014CN103897143A 环氧树脂、环氧树脂的制造方法及其使用 Method for producing an epoxy resin, an epoxy resin and its use
07/02/2014CN103896983A 季鏻盐、包含季鏻盐用于封装半导体器件的环氧树脂组合物和用该组合物封装的半导体器件 Quaternary phosphonium salts, comprising an epoxy resin composition for encapsulating a quaternary phosphonium salt and a semiconductor device encapsulated with the composition of the semiconductor device
07/02/2014CN103895286A 新型多层热沉材料及其制备方法 The new multi-layer heat sink material and method
07/02/2014CN103168356B 半导体模块 Semiconductor Modules
07/02/2014CN102683318B 硅电容器内部多层电极连接结构及连接方法 Connection structure and connection method silicon multilayer electrode inside a capacitor
07/02/2014CN102569251B 三维封装用金属间化合物填充的垂直通孔互连结构及制备方法 Three-dimensional package with vertical through-hole interconnection structure and preparation of intermetallic compounds filled
07/02/2014CN102471137B 半导体器件用密封玻璃、密封材料、密封材料糊料以及半导体器件及其制造方法 A semiconductor device with a sealing glass, the sealing material, a sealing material paste, and a semiconductor device and its manufacturing method
07/02/2014CN102468218B 形成双镶嵌结构的方法、半导体器件 The method of forming a dual damascene structure, a semiconductor device
07/02/2014CN102420213B 具有低k材料的三维集成电路结构 A three-dimensional integrated circuit structure having a low k material
07/02/2014CN102420149B 树脂密封型半导体装置的制造方法、树脂密封型半导体装置及该半导体装置用的引线框架 The method of manufacturing a resin sealing type semiconductor device, lead frame and the resin sealing type semiconductor device of the semiconductor device in accordance with
07/02/2014CN102404935B 多层导通孔叠层结构 Vias multilayer laminate structure
07/02/2014CN102403302B 在基板上形成SiC结晶以实现GAN和Si电子器件集成的机理 Mechanism of the formation of crystalline SiC on Si substrates in order to achieve GAN and electronics integration
07/02/2014CN102347367B 一种基于部分耗尽型soi工艺的抗辐射mos器件结构 A part of the anti-radiation mos depletion mode device structures based on soi technology
07/02/2014CN102347306B 具有凹洞板互连的半导体封装 With a pit board interconnect semiconductor package
07/02/2014CN102347265B 防止存储器穿通电压降低的方法及存储器 The method for preventing punch-through voltage is decreased memory and a memory
07/02/2014CN102324420B 半导体装置 Semiconductor device
07/02/2014CN102293072B 线路板及其制造方法 Circuit board and its manufacturing method
07/02/2014CN102270611B 半导体装置 Semiconductor device
07/02/2014CN102237332B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
07/02/2014CN102222660B 双引线框架多芯片共同封装体及其制造方法 Common package and method for manufacturing a multi-chip dual leadframe
07/02/2014CN102150258B 堆叠式装置中的信号传递 Signal transmission in a stacked device
07/02/2014CN102144290B 倒装芯片过模封装件 Overmolded flip chip package
07/02/2014CN102118024B 静电防护电路、液晶显示面板的静电防护电路及其阵列 ESD protection circuit, LCD panel, ESD protection circuits and arrays
07/02/2014CN102034827B 非易失性存储单元及非易失性存储器的布局 Layout nonvolatile memory cell and non-volatile memory
07/02/2014CN102024755B Cmos图像传感器及其形成方法 Cmos image sensor and method of forming
07/02/2014CN101930966B 电路布局结构及缩小集成电路布局的方法 Circuit layout structure and reduce the IC layout methods
07/02/2014CN101847618B 半导体装置 Semiconductor device
07/02/2014CN101792572B 热固性环氧树脂组合物和半导体器件 The thermosetting epoxy resin composition and a semiconductor device
07/01/2014US8767434 E-fuse array circuit
07/01/2014US8766734 Through silicon via-based oscillator wafer-level-package structure and method for fabricating the same
07/01/2014US8766463 Package carrier
07/01/2014US8766462 Dicing tape-integrated wafer back surface protective film
07/01/2014US8766461 Substrate with bond fingers
07/01/2014US8766460 Package with interposer frame and method of making the same
07/01/2014US8766459 CMUT devices and fabrication methods
07/01/2014US8766458 Surface depressions for die-to-die interconnects and associated systems and methods
07/01/2014US8766456 Method of fabricating a semiconductor package
07/01/2014US8766455 Stacked semiconductor devices and fabrication methods thereof
07/01/2014US8766454 Integrated circuit with self-aligned line and via
07/01/2014US8766453 Packaged integrated circuit having large solder pads and method for forming
07/01/2014US8766452 Semiconductor device including conductive lines and pads
07/01/2014US8766451 Chip packaging structure
07/01/2014US8766450 Lead pin for package substrate
07/01/2014US8766449 Variable interconnect geometry for electronic packages and fabrication methods
07/01/2014US8766448 Chromium/Titanium/Aluminum-based semiconductor device contact
07/01/2014US8766446 Semiconductor memory device
07/01/2014US8766445 Semiconductor device
07/01/2014US8766444 Integrated circuit including interconnect levels
07/01/2014US8766443 Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the same
07/01/2014US8766441 Methods and apparatus for solder on slot connections in package on package structures
07/01/2014US8766440 Wiring board with built-in semiconductor element
07/01/2014US8766439 Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
07/01/2014US8766438 Package structure
07/01/2014US8766437 Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same
07/01/2014US8766436 Moisture barrier for a wire bond
07/01/2014US8766435 Integrated circuit package including embedded thin-film battery
07/01/2014US8766434 Semiconductor module with micro-buffers
07/01/2014US8766433 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip
07/01/2014US8766432 Device with semiconductor die attached to a leadframe
07/01/2014US8766431 Power MOSFET package
07/01/2014US8766430 Semiconductor modules and methods of formation thereof
07/01/2014US8766429 Semiconductor packages
07/01/2014US8766428 Integrated circuit packaging system with flip chip and method of manufacture thereof
07/01/2014US8766427 RF-power device
07/01/2014US8766426 Integrated circuit packaging system with warpage control and method of manufacture thereof
07/01/2014US8766425 Semiconductor device
07/01/2014US8766424 Thin substrate PoP structure
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