| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/02/2008 | CN101154646A Metal line in semiconductor device and method for forming the same |
| 04/02/2008 | CN101154645A Circuit substrate for preventing warpage and package using the same |
| 04/02/2008 | CN101154644A Electrically optimized and structurally protected via structure for high speed signals |
| 04/02/2008 | CN101154643A Substrate structure and its manufacturing method |
| 04/02/2008 | CN101154642A Semiconductor apparatus and fabrication method thereof |
| 04/02/2008 | CN101154641A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/02/2008 | CN101154640A 半导体装置 Semiconductor device |
| 04/02/2008 | CN101154639A Die arrangement and method for producing a die arrangement |
| 04/02/2008 | CN101154638A Semiconductor module, portable equipment and method for manufacturing semiconductor module |
| 04/02/2008 | CN101154637A Embedded metal cooling seat of semiconductor component and method of producing the same |
| 04/02/2008 | CN101154636A Semiconductor power component radiating by annular heat pipe |
| 04/02/2008 | CN101154634A Method of forming a semiconductor memory device and semiconductor memory device |
| 04/02/2008 | CN101154629A Semiconductor device and method of fabricating the same |
| 04/02/2008 | CN101154626A Method of identifying and/or programming an integrated circuit |
| 04/02/2008 | CN101154607A Unmolded package for a semiconductor device |
| 04/02/2008 | CN101154601A Semiconductor device and manufacturing method thereof |
| 04/02/2008 | CN101154577A Semiconductor device and method of manufacturing the same |
| 04/02/2008 | CN101154343A Display device |
| 04/02/2008 | CN101154342A 显示装置和电子装置 Display device and electronic apparatus |
| 04/02/2008 | CN101153212A Set of resin compositions for preparing system-in-package type semiconductor device |
| 04/02/2008 | CN101152772A Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 04/02/2008 | CN100379323C Circuit board and process for producing the same |
| 04/02/2008 | CN100379322C Circuit assembly and method of manufacturing the circuit assembly |
| 04/02/2008 | CN100379148C Surface-mount base for electronic element |
| 04/02/2008 | CN100379039C 发光二极管 Led |
| 04/02/2008 | CN100379038C Water-cooled LED heat sink |
| 04/02/2008 | CN100379034C LED module with high-efficient radiation |
| 04/02/2008 | CN100379005C Integrated component |
| 04/02/2008 | CN100379003C Semiconductor circuit |
| 04/02/2008 | CN100379000C Semiconductor device and method of manufacturing same |
| 04/02/2008 | CN100378999C Semiconductor device and method of manufacturing same |
| 04/02/2008 | CN100378995C Electronic circuit with transmission line type noise filter |
| 04/02/2008 | CN100378993C Stereo-stacking packaging structure |
| 04/02/2008 | CN100378992C Semiconductor package and manufacturing method thereof |
| 04/02/2008 | CN100378991C Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identify of the semiconductor device |
| 04/02/2008 | CN100378990C Low k and ultra low k SiCOH dielectric films and methods to form the same |
| 04/02/2008 | CN100378989C Semiconductor integrated circuit device having diagonal direction wiring and layout method therefor |
| 04/02/2008 | CN100378988C Semiconductor device and method for fabricating the same |
| 04/02/2008 | CN100378987C Multi-layer metal semiconductor and its manufacturing method |
| 04/02/2008 | CN100378986C Memory array and manufacturing method thereof |
| 04/02/2008 | CN100378985C Semiconductor structure of wafer and method for forming same |
| 04/02/2008 | CN100378984C Constant temperature electromigration test structure and its fillet optical adjacent correction method |
| 04/02/2008 | CN100378983C Semiconductor unit |
| 04/02/2008 | CN100378982C Semiconductor device which prevents peeling of low-permittivity film by using multilevel interconnection |
| 04/02/2008 | CN100378981C Structure for integrated circuit wafer |
| 04/02/2008 | CN100378980C 半导体装置 Semiconductor device |
| 04/02/2008 | CN100378979C 半导体器件 Semiconductor devices |
| 04/02/2008 | CN100378978C 半导体装置 Semiconductor device |
| 04/02/2008 | CN100378977C Semiconductor device without chip carrier and its preparing process |
| 04/02/2008 | CN100378976C Water cooling method and device of electric transmission power electron power inverter |
| 04/02/2008 | CN100378975C Cooling part, substrate and electronic equipment |
| 04/02/2008 | CN100378974C Radiator and semiconductor element using such radiator and semiconductor packing body |
| 04/02/2008 | CN100378973C Housing structure of electronic device and heat radiation method therefor |
| 04/02/2008 | CN100378972C Heat spreader and package structure utilizing the same |
| 04/02/2008 | CN100378971C Flip chip ball grid array package assemblies and electronic devices with heat dissipation capability |
| 04/02/2008 | CN100378970C Multipurpose load plate |
| 04/02/2008 | CN100378969C Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate |
| 04/02/2008 | CN100378968C 电子装置 Electronic devices |
| 04/02/2008 | CN100378967C Ceramic package and fabrication method thereof |
| 04/02/2008 | CN100378966C Semiconductor device and method of manufacturing the same |
| 04/02/2008 | CN100378953C Method of forming low resistance and reliable via in inter-level dielectric interconnect |
| 04/02/2008 | CN100378950C Method of manufacturing semiconductor integrated circuit |
| 04/02/2008 | CN100378949C Stable metal structure with tungsten plug |
| 04/02/2008 | CN100378945C Three dimensional IC device and alignment methods of ic device substrates |
| 04/02/2008 | CN100378939C Semiconductor device, method for producing the same, circuit board, and electronic apparatus |
| 04/02/2008 | CN100378938C Device package and methods for the fabrication and testing thereof |
| 04/02/2008 | CN100378935C Semiconductor device and method of manufacturing the same |
| 04/02/2008 | CN100378934C Flipchip QFN package method |
| 04/02/2008 | CN100378932C Wafer contact window of soft sheet bearing device and joint pad open and driving hole process |
| 04/02/2008 | CN100378921C Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip |
| 04/02/2008 | CN100378908C Semiconductor device |
| 04/02/2008 | CN100378172C Curable organopolysiloxane composition and semiconductor device |
| 04/02/2008 | CN100378165C Epoxy composition for light semiconductor packing |
| 04/01/2008 | US7353476 System, method and computer program product for designing connecting terminals of semiconductor device |
| 04/01/2008 | US7352586 Auxiliary supporting structure of circuit board and assembling method for the same |
| 04/01/2008 | US7352585 Flip chip heat sink package and method |
| 04/01/2008 | US7352548 Composite integrated semiconductor device |
| 04/01/2008 | US7352208 Integrated circuit having a plurality of output drivers |
| 04/01/2008 | US7352201 System and method for testing devices utilizing capacitively coupled signaling |
| 04/01/2008 | US7352196 Probe card assembly and kit |
| 04/01/2008 | US7352071 Method of fabricating anti-warp package |
| 04/01/2008 | US7352070 Polymer encapsulated electrical devices |
| 04/01/2008 | US7352069 Electronic component unit |
| 04/01/2008 | US7352068 Multi-chip module |
| 04/01/2008 | US7352066 Silicon based optical vias |
| 04/01/2008 | US7352065 Semiconductor devices having amorphous silicon-carbon dielectric and conducting layers |
| 04/01/2008 | US7352064 Multiple layer resist scheme implementing etch recipe particular to each layer |
| 04/01/2008 | US7352063 Semiconductor structure that includes a cooling structure formed on a semiconductor surface and method of manufacturing the same |
| 04/01/2008 | US7352062 Integrated circuit package design |
| 04/01/2008 | US7352061 Flexible core for enhancement of package interconnect reliability |
| 04/01/2008 | US7352060 Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate |
| 04/01/2008 | US7352059 Low loss interconnect structure for use in microelectronic circuits |
| 04/01/2008 | US7352058 Methods for a multiple die integrated circuit package |
| 04/01/2008 | US7352057 Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module |
| 04/01/2008 | US7352055 Semiconductor package with controlled solder bump wetting |
| 04/01/2008 | US7352054 Semiconductor device having conducting portion of upper and lower conductive layers |
| 04/01/2008 | US7352053 Insulating layer having decreased dielectric constant and increased hardness |
| 04/01/2008 | US7352052 Semiconductor device and manufacturing method therefor |
| 04/01/2008 | US7352050 Fuse region of a semiconductor region |
| 04/01/2008 | US7352048 Integration of barrier layer and seed layer |