| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/03/2008 | DE102007043709A1 Power-Via-Struktur zur Integration in Advanced-Logic/Smart-Power-Technologien Power-via structure for integration in Advanced Logic / smart power technologies |
| 04/03/2008 | DE102007032775A1 Leistungsverstärker Power amplifier |
| 04/03/2008 | DE102007019576A1 Module support for an electronic module, has electrically insulating support body with upper side and lower side, and cooling channel runs in support body |
| 04/03/2008 | DE102007015534A1 Power semiconductor module has heat sink and circuit substrate with conductive pattern is mounted on heat sink |
| 04/03/2008 | DE102006046851A1 Chip comprises contact element for electrical contact of chip, where contact element is covered with organic layer |
| 04/03/2008 | DE102006046789A1 Electronic component e.g. isolated gate bipolar transistor, has layer region that is electrically conductively arranged at thinned wafers, where layer thickness of layer region is larger than specific micrometers |
| 04/03/2008 | DE102006046770A1 Module for producing assembly from module and other compound component, has multiple markers with code reading by read device for co-ordinate axis of co-ordinate system assigned to marker |
| 04/03/2008 | DE102006046678A1 Housing for use with semiconductor body of e.g. LED unit, has plastic-base body with plastic components, where one plastic component is made of material differing from that of other component in optical characteristic |
| 04/03/2008 | DE102006046194A1 Heat sink for cooling e.g. power semiconductor of current converter, has contact surface delivering heat energy to cooling device, and heat conductive channel conducting heat to cooling device, contact surface and another cooling device |
| 04/03/2008 | DE102006046182A1 Semiconductor element for integrated circuits, has supporting structure, which is arranged in series of layers, which comprises number of dielectric layers |
| 04/03/2008 | DE102006045902A1 Integrated semiconductor component has function block, and power control unit which produce supply voltage from input voltage, and frequency spectrum is adjusted in dependence of actual operating condition |
| 04/03/2008 | DE102006045896A1 Electronic housing for accommodating e.g. electronic device, has cover flexibly formed such that inner area is moved within preset operating temperature range with respect to compression strength of base, cover or sealing coupling |
| 04/03/2008 | DE102006045701A1 Cooling device for cooling heat source of arrangement i.e. headlight part, of motor vehicle, has heat conductive pipes coupled together thermally, where heat from heat source is conducted to cooling body by one or both pipes |
| 04/03/2008 | DE102006045415A1 Component e.g. integrated circuit, assembly, has molding material completely surrounding carrier e.g. printed circuit board, and component and partially surrounding electrical contact strip, and holes formed beneath component |
| 04/03/2008 | DE102006044836A1 Shielding unit and heat dissipation unit combined module, has shielding unit provided on principal surface of high frequency chip, by bond and comprising welding contact, where shielding unit is arranged in vicinity of chip |
| 04/03/2008 | DE102006044758A1 Semiconductor chip has contact surface arranged on surface as active side for electrical contacting of bond pads, where bond pad is arranged between external chip edge and central bond pad rows |
| 04/03/2008 | DE102006044690A1 Elektronisches Bauteil und Verfahren zum Herstellen Electronic component and methods for making |
| 04/03/2008 | DE102006044016A1 Stapelbare Funktionsschicht für ein modulares mikroelektronisches System Stackable functional layer for a modular microelectronic system |
| 04/03/2008 | DE102006043484A1 Fuse-Struktur und Verfahren zum Herstellen derselben Fuse structure and method of manufacturing the same |
| 04/03/2008 | DE102006037500B3 ESD-Schutzschaltung mit geringem Leckstrom und Verfahren zum ESD-Schutz ESD protection circuit having low leakage and method for ESD protection |
| 04/03/2008 | DE102006029142B4 Verfahren und Schutzschaltung gegen Überspannung Method and circuit protection against overvoltage |
| 04/03/2008 | DE102004037191B4 Halbleiterbautelement mit einer Passivierungsschicht und Verfahren zu seiner Herstellung Halbleiterbautelement with a passivation layer and process for its preparation |
| 04/03/2008 | DE10123758B4 Multi-Chip-Modul mit mehreren integrierten Halbleiterschaltungen Multi-chip module having a plurality of semiconductor integrated circuits |
| 04/03/2008 | DE10084995B4 Verfahren und Vorrichtung zum Bilden einer Struktur unterhalb einer Bondmetallisierung Method and apparatus for forming a structure beneath a Bondmetallisierung |
| 04/03/2008 | DE10033013B4 Flüssigkeits-Spritzpresssystem zum Vergießen von integrierten Halbleiterschaltungen und Verfahren zum Vergießen von integrierten Halbleiterschaltungen Liquid molding system for encapsulating semiconductor integrated circuits and methods for encapsulating semiconductor integrated circuits |
| 04/02/2008 | EP1906452A1 Semiconductor device and method for manufacturing same |
| 04/02/2008 | EP1906448A1 Protected field effect transistor device |
| 04/02/2008 | EP1906447A2 Cooling of the power components of a frequency converter |
| 04/02/2008 | EP1906446A2 Semiconductor device and manufacturing method thereof |
| 04/02/2008 | EP1906445A2 Manufacturing method of semiconductor device |
| 04/02/2008 | EP1906444A2 Gettering device for ion capture |
| 04/02/2008 | EP1906443A2 Pressure-contact semiconductor device |
| 04/02/2008 | EP1906441A1 Wafer with semiconductor devices and method of manufacturing the same |
| 04/02/2008 | EP1906436A2 Semiconductor-embedded substrate and manufacturing method thereof |
| 04/02/2008 | EP1906415A2 Hybrid on-chip-off-chip transformer |
| 04/02/2008 | EP1905083A2 Electronic device |
| 04/02/2008 | EP1905082A1 Power interconnect structure for balanced bitline capacitance in a memory array |
| 04/02/2008 | EP1905081A2 Multi-level interconnections for an integrated circuit chip |
| 04/02/2008 | EP1905080A1 Method of reducing warpage in an over-molded ic package |
| 04/02/2008 | EP1905079A2 Package, method of manufacturing the same and use thereof |
| 04/02/2008 | EP1905078A2 Microchip assembly produced by transfer molding |
| 04/02/2008 | EP1905077A2 Semiconductor device |
| 04/02/2008 | EP1905076A1 Arrangement of an electric component and a two-phase cooling device and method for manufacturing the arrangement |
| 04/02/2008 | EP1904669A1 Tin electrodeposits having properties or characteristics that minimize tin whisker growth |
| 04/02/2008 | EP1797591B1 3d interconnect with protruding contacts |
| 04/02/2008 | EP1358676B1 Screening device for integrated circuits |
| 04/02/2008 | CN201044562Y Holders |
| 04/02/2008 | CN201044560Y Joining structure of radiating rib |
| 04/02/2008 | CN201044558Y Radiator fan |
| 04/02/2008 | CN201044557Y Heat radiating device |
| 04/02/2008 | CN201044552Y Liquid condition cooling unit water disk structure |
| 04/02/2008 | CN201044550Y Improvement on structure of radiator |
| 04/02/2008 | CN201044245Y Led |
| 04/02/2008 | CN201044243Y LED heat radiator |
| 04/02/2008 | CN201044242Y High-capacity light emitting diode |
| 04/02/2008 | CN201044238Y Rapid recovery great current rectifier diode module |
| 04/02/2008 | CN201044237Y Light emitting diode |
| 04/02/2008 | CN201044236Y LED heat radiation model set |
| 04/02/2008 | CN201043739Y High power LED lamp |
| 04/02/2008 | CN201043737Y High power semiconductor lighting lamp |
| 04/02/2008 | CN201043736Y LED Lamp |
| 04/02/2008 | CN201043702Y High-power LED road lamp |
| 04/02/2008 | CN101156241A Heat sink device |
| 04/02/2008 | CN101156240A Heat sink and method of manufacturing the same |
| 04/02/2008 | CN101156238A Protruding electrode for connecting electronic component, electronic component mounted body using such electrode and methods for manufacturing such electrode and electronic component mounted body |
| 04/02/2008 | CN101156235A Method for establishing an electrical and mechanical connection between chip contact surfaces and antenna contact surfaces and transponder |
| 04/02/2008 | CN101155854A Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic compo |
| 04/02/2008 | CN101155502A Thermal cooling of industrial electronic module by conductive structure |
| 04/02/2008 | CN101155501A Heat radiator |
| 04/02/2008 | CN101155499A Radiator and its manufacturing method |
| 04/02/2008 | CN101155498A Combination structure of electronic component and heat radiating device |
| 04/02/2008 | CN101155497A Phase-change heat radiating device and method |
| 04/02/2008 | CN101155494A Heat radiating device |
| 04/02/2008 | CN101155493A Heat radiating device |
| 04/02/2008 | CN101155472A Mounting structure, electro-optical device, electronic apparatus, and method of manufacturing mounting structure |
| 04/02/2008 | CN101155469A Circuit board and method for manufacturing semiconductor modules and circuit boards |
| 04/02/2008 | CN101154711A Organic anti-fuse and method for preparing the same |
| 04/02/2008 | CN101154703A Housing for a radiation-emitting component, radiation emitting component and method for producing the same |
| 04/02/2008 | CN101154701A Light emitting diode and its plug-in method |
| 04/02/2008 | CN101154698A Method for forming reflection cover and its structure and bearing device using the same |
| 04/02/2008 | CN101154690A Semiconductor device |
| 04/02/2008 | CN101154689A Semiconductor device |
| 04/02/2008 | CN101154687A Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device |
| 04/02/2008 | CN101154679A Display device |
| 04/02/2008 | CN101154672A Semiconductor device |
| 04/02/2008 | CN101154671A Pixel structure and its manufacturing method |
| 04/02/2008 | CN101154670A Pixel structure and its manufacturing method |
| 04/02/2008 | CN101154669A Thin-film semiconductor device, display, and method for manufacturing thin film semiconductor device |
| 04/02/2008 | CN101154668A Substrate for display device, its manufacturing method and display device |
| 04/02/2008 | CN101154658A Power line layout techniques for integrated circuits having modular cells |
| 04/02/2008 | CN101154657A Layout structure of electrostatic discharge protecting circuit and its manufacturing method |
| 04/02/2008 | CN101154655A Circuit board arrangement and method for producing a circuit board arrangement |
| 04/02/2008 | CN101154654A Semiconductor device, semiconductor integrated circuit and bump resistance measurement method |
| 04/02/2008 | CN101154653A Leistungshalbleitermodul |
| 04/02/2008 | CN101154652A Stack package and method for manufacturing the same |
| 04/02/2008 | CN101154651A Plane structure of LED illuminating device |
| 04/02/2008 | CN101154650A Semi-conductor packaging structure and producing method thereof |
| 04/02/2008 | CN101154649A Substrate of thin-film transistor |
| 04/02/2008 | CN101154648A Metal layer structure of semiconductor device |
| 04/02/2008 | CN101154647A Semiconductor apparatus |