| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/08/2008 | US7354795 Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates |
| 04/08/2008 | US7354782 Group III nitride based flip-chip integrated circuit and method for fabricating |
| 04/08/2008 | US7354619 Protection of the SiC surface by a GaN layer |
| 04/08/2008 | US7354471 Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom |
| 04/08/2008 | US7353861 Transpiration cooled heat sink and a self contained coolant supply for same |
| 04/08/2008 | US7353860 Heat dissipating device with enhanced boiling/condensation structure |
| 04/08/2008 | US7353712 Integrated circuitry and method for manufacturing the same |
| 04/08/2008 | US7353595 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon |
| 04/08/2008 | US7353590 Method of forming printed circuit card |
| 04/03/2008 | WO2008039842A2 Two-way heat extraction from packaged semiconductor chips |
| 04/03/2008 | WO2008039717A2 Semiconductor dies and methods and apparatus to mold lock a semiconductor die |
| 04/03/2008 | WO2008038997A1 Light emitting diode package employing leadframe with plated layer of high brightness |
| 04/03/2008 | WO2008038922A1 High-power device having thermocouple embedded therein and method for manufacturing the same |
| 04/03/2008 | WO2008038767A1 Piezoelectric device |
| 04/03/2008 | WO2008038681A1 Ceramic substrate component and electronic component using the same |
| 04/03/2008 | WO2008038593A1 Cu-Ni-Si ALLOY |
| 04/03/2008 | WO2008038183A1 Flip-chip interconnection through chip vias |
| 04/03/2008 | WO2008037634A1 Design rules for on-chip inductors |
| 04/03/2008 | WO2008037592A1 Method of connecting an antenna to a transponder chip and corresponding transponder inlay |
| 04/03/2008 | WO2008037579A1 Method of connecting an antenna to a transponder chip and corresponding inlay substrate |
| 04/03/2008 | WO2008037559A1 Use of an adhesive composition for die-attaching high power semiconductors |
| 04/03/2008 | WO2008037134A1 A heat pipe radiator and manufacturing method thereof |
| 04/03/2008 | WO2008018959A3 Overmolded semiconductor package with a wirebond cage for emi shielding |
| 04/03/2008 | WO2008009262A3 Module having a flat structure, and equipment method |
| 04/03/2008 | WO2007146642A3 Semiconductor dual guard ring arrangement |
| 04/03/2008 | WO2007127552A3 Semiconductor die package including multiple dies and a common node structure |
| 04/03/2008 | WO2007122516A3 Apparatus and method for use in mounting electronic elements |
| 04/03/2008 | WO2007112396A3 Semiconductor devices and electrical parts manufacturing using metal coated wires |
| 04/03/2008 | WO2007109265A3 Iii-nitrite power semiconductor device |
| 04/03/2008 | WO2007109133A3 Improved chip-scale package |
| 04/03/2008 | US20080081454 Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance |
| 04/03/2008 | US20080080137 Heat sink and cooling apparatus |
| 04/03/2008 | US20080079176 Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification |
| 04/03/2008 | US20080079175 Layer for chip contact element |
| 04/03/2008 | US20080079174 Substrate slot design for die stack packaging |
| 04/03/2008 | US20080079173 Integrated circuit package system with pad to pad bonding |
| 04/03/2008 | US20080079172 Method for fabricating and beol interconnect structures with simultaneous formation of high-k and low-k dielectric regions |
| 04/03/2008 | US20080079171 Semiconductor device having an epitaxial-grown contact plug |
| 04/03/2008 | US20080079170 Semiconductor device |
| 04/03/2008 | US20080079169 Manufacturing method for semiconductor device, semiconductor device, substrate processing system, program and memory medium |
| 04/03/2008 | US20080079168 Semiconductor element comprising a supporting structure and production method |
| 04/03/2008 | US20080079167 High-density 3-dimensional resistors |
| 04/03/2008 | US20080079166 Managing forces of semiconductor device layers |
| 04/03/2008 | US20080079165 Barrier formation and structure to use in semiconductor devices |
| 04/03/2008 | US20080079164 Electronic device and method of manufacturing the same |
| 04/03/2008 | US20080079163 Electronic device and method of manufacturing the same |
| 04/03/2008 | US20080079162 Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument |
| 04/03/2008 | US20080079161 Metal layer structure of semiconductor device |
| 04/03/2008 | US20080079160 System for separation of an electrically conductive connection |
| 04/03/2008 | US20080079159 Focused stress relief using reinforcing elements |
| 04/03/2008 | US20080079158 metal fill region of a semiconductor chip |
| 04/03/2008 | US20080079157 Electronic device and method of manufacturing the same |
| 04/03/2008 | US20080079156 Metal line in semiconductor device and method for forming the same |
| 04/03/2008 | US20080079155 Hard mask for low-k interlayer dielectric patterning |
| 04/03/2008 | US20080079154 Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof |
| 04/03/2008 | US20080079153 Method for forming semiconductor device |
| 04/03/2008 | US20080079152 Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device |
| 04/03/2008 | US20080079151 Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same |
| 04/03/2008 | US20080079150 Die arrangement and method for producing a die arrangement |
| 04/03/2008 | US20080079149 Circuit board arrangement and method for producing a circuit board arrangement |
| 04/03/2008 | US20080079148 Package for mixed signal mcu with minimal pin count |
| 04/03/2008 | US20080079147 Embedded array capacitor with side terminals |
| 04/03/2008 | US20080079146 Semiconductor-embedded substrate and manufacturing method thereof |
| 04/03/2008 | US20080079145 Power semiconductor arrangement |
| 04/03/2008 | US20080079144 Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same |
| 04/03/2008 | US20080079143 Scalable interchangeable multiband power package mounting apparatus |
| 04/03/2008 | US20080079142 Wafer-level MEMS package and manufacturing method thereof |
| 04/03/2008 | US20080079141 Micro electro-mechanical system module package capable of minimizing interference of noises |
| 04/03/2008 | US20080079140 Electronic system modules and method of fabricaton |
| 04/03/2008 | US20080079139 Micro-via structure design for high performance integrated circuits |
| 04/03/2008 | US20080079138 Semiconductor device |
| 04/03/2008 | US20080079137 Chip packaging overflow proof device |
| 04/03/2008 | US20080079136 Method and apparatus for supplying power to a semiconductor device using a capacitor dc shunt |
| 04/03/2008 | US20080079135 Package assembly pinout with superior crosstalk and timing performance |
| 04/03/2008 | US20080079134 Chip package, chip structure and manufacturing process thereof |
| 04/03/2008 | US20080079133 Stack type semiconductor device package |
| 04/03/2008 | US20080079132 Inverted CSP Stacking System and Method |
| 04/03/2008 | US20080079131 Stack package and method for manufacturing the same |
| 04/03/2008 | US20080079130 Integrated circuit package system employing bump technology |
| 04/03/2008 | US20080079128 Lead frame type stack package and method o fabricating the same |
| 04/03/2008 | US20080079127 Pin Array No Lead Package and Assembly Method Thereof |
| 04/03/2008 | US20080079126 Plastic surface mount large area power device |
| 04/03/2008 | US20080079125 Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same |
| 04/03/2008 | US20080079124 Interdigitated leadfingers |
| 04/03/2008 | US20080079123 Method of fabricating a mixed microtechnology structue and a structure obtained thereby |
| 04/03/2008 | US20080079122 Termination structures for super junction devices |
| 04/03/2008 | US20080079100 Fingerprint Sensor and Interconnect |
| 04/03/2008 | US20080079085 semiconductor device comprising isolation trenches inducing different types of strain |
| 04/03/2008 | US20080079083 Semiconductor device and a method of manufacture therefor |
| 04/03/2008 | US20080079081 Semiconductor apparatus and manufacturing method |
| 04/03/2008 | US20080079026 Semiconductor integrated circuit |
| 04/03/2008 | US20080079010 Thin film transistor panel and manufacturing method thereof |
| 04/03/2008 | US20080079006 Signal line for a display device, etchant, thin film transistor panel, and method for manufacturing the same |
| 04/03/2008 | US20080078996 Semiconductor Device and Method of Manufacturing the Same |
| 04/03/2008 | US20080078995 Chip structure |
| 04/03/2008 | US20080078994 Microelectronic die having electrical connections to allow testing of guard wall for damage and method of testing guard wall for damage |
| 04/03/2008 | DE10335078B4 Verfahren zur Herstellung eines Bauelements mit einem formgebend umhüllten Leadframe und Bauelement mit einem formgebend umhüllten Leadframe A method for producing a component with a shaping coated leadframe and a component with a shaping coated leadframe |
| 04/03/2008 | DE10334761B4 Elektronische Schaltungsvorrichtung An electronic circuit device |
| 04/03/2008 | DE10313712B4 Laterales mittels Feldeffekt steuerbares Halbleiterbauelement für HF-Anwendungen Lateral using field-effect-controllable semiconductor device for RF Applications |
| 04/03/2008 | DE10229182B4 Verfahren zur Herstellung einer gestapelten Chip-Packung A process for producing a stacked chip package |