| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/09/2008 | CN100380705C 显示装置及其制造方法 Display device and method of manufacturing |
| 04/09/2008 | CN100380700C Composite electrode having low heat consumption and small contact area for memory device of phase-changing medium |
| 04/09/2008 | CN100380679C Chip-scale schottky device |
| 04/09/2008 | CN100380661C Split-gate power module and method for suppressing oscillation therein |
| 04/09/2008 | CN100380660C Semiconductor device and producing method, semiconductor package, electronic device and producing method, electronic instrment |
| 04/09/2008 | CN100380659C Semiconductor device and method of manufacturing the same |
| 04/09/2008 | CN100380658C Semiconductor packaging piece and its producing method |
| 04/09/2008 | CN100380657C Multi-configuration processor-memory substrate device |
| 04/09/2008 | CN100380656C Fuse regions of a semiconductor memory device and methods of fabricating the same |
| 04/09/2008 | CN100380655C Semiconductor device and method of manufacturing the same |
| 04/09/2008 | CN100380654C Interconnection structure and methods |
| 04/09/2008 | CN100380653C Semiconductor device and method of manufacturing semiconductor device |
| 04/09/2008 | CN100380652C Electric power semiconductor device |
| 04/09/2008 | CN100380651C Semiconductor device and electronic device |
| 04/09/2008 | CN100380650C 半导体集成电路器件及其制造方法 The semiconductor integrated circuit device and its manufacturing method |
| 04/09/2008 | CN100380649C Substrate for electric component and method for production thereof |
| 04/09/2008 | CN100380648C Method for producing a stepped edge profile comprised of a layered construction |
| 04/09/2008 | CN100380647C Wirebond structure and method to connect to a microelectronic die |
| 04/09/2008 | CN100380646C Semiconductor device and manufacturing method of the same |
| 04/09/2008 | CN100380645C Nano-microparticle radiating apparatus |
| 04/09/2008 | CN100380644C Radiator, electronic assemblies, its manufacturing method and electrinic system |
| 04/09/2008 | CN100380643C Cooling system and projection-type image display apparatus using the same |
| 04/09/2008 | CN100380642C Dual-sided heat removal device and method |
| 04/09/2008 | CN100380641C Arrangements to increase structural rigidity of semiconductor package |
| 04/09/2008 | CN100380640C Combined structure of electronic assembly with radiating apparatus |
| 04/09/2008 | CN100380639C Thin multiple semiconductor die package |
| 04/09/2008 | CN100380638C Chip module |
| 04/09/2008 | CN100380637C Wiring board and semiconductor package using the same |
| 04/09/2008 | CN100380636C Thermal enhanced package for block mold assembly and its manufacturing method |
| 04/09/2008 | CN100380635C Semiconductor device its manufacturing method, electronic device and its manufacturing method |
| 04/09/2008 | CN100380627C Semiconductor device and manufacturing method thereof |
| 04/09/2008 | CN100380617C Optical semiconductor device, manufacturing method of package mould, and package mould |
| 04/09/2008 | CN100380616C Electronic device with empty chamby and its producing method |
| 04/09/2008 | CN100380615C Barrier layer, heater chip, ink-jet printhead and method for reducing peak |
| 04/09/2008 | CN100380614C Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| 04/09/2008 | CN100380612C Semiconductor device and method for manufacturing the same |
| 04/09/2008 | CN100380417C Electronic module, its manufacturing method, and electronic apparatus |
| 04/09/2008 | CN100380234C Method of measuring critical dimension and overlay in single step |
| 04/09/2008 | CN100380087C Heat dissipating component using high conducting inserts |
| 04/09/2008 | CN100380075C Heating sensing system for electric refrigerator via internet and its working method |
| 04/09/2008 | CN100380070C High power density thermoelectric systems |
| 04/09/2008 | CN100379832C Adhesive for circuit components connection circuit board and producing method thereof |
| 04/09/2008 | CN100379794C Oxosilane polymer and composition thereof, light emitting device, and method for using the oxosilane polymer as LED |
| 04/09/2008 | CN100379706C High thermal conductivite element, method for manufacturing same, and heat radiating system |
| 04/09/2008 | CN100379541C Sealing material tablet, method of manufacturing the tablet, and electronic component device |
| 04/08/2008 | US7356800 System and method for product yield prediction |
| 04/08/2008 | US7356795 Semiconductor integrated circuit device and method for designing the same |
| 04/08/2008 | US7356783 Dummy fill for integrated circuits |
| 04/08/2008 | US7356782 Voltage reference signal circuit layout inside multi-layered substrate |
| 04/08/2008 | US7356296 Endless belt type transferring apparatus and image forming apparatus |
| 04/08/2008 | US7355874 Computer memory cards using flash EEprom integrated circuit chips and memory-controller systems |
| 04/08/2008 | US7355863 High frequency multilayer integrated circuit |
| 04/08/2008 | US7355862 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 04/08/2008 | US7355856 Method and apparatus for increasing natural convection efficiency in long heat sinks |
| 04/08/2008 | US7355853 Module structure and module comprising it |
| 04/08/2008 | US7355670 Liquid crystal display device and method of fabricating the same |
| 04/08/2008 | US7355547 Vehicle-mounted millimeter wave radar device, millimeter wave radar module, and manufacturing method thereof |
| 04/08/2008 | US7355491 Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package |
| 04/08/2008 | US7355435 On-chip detection of power supply vulnerabilities |
| 04/08/2008 | US7355291 Overlay marks, methods of overlay mark design and methods of overlay measurements |
| 04/08/2008 | US7355290 Interposer and method for fabricating the same |
| 04/08/2008 | US7355289 Packaged integrated circuit with enhanced thermal dissipation |
| 04/08/2008 | US7355288 Low fabrication cost, high performance, high reliability chip scale package |
| 04/08/2008 | US7355287 Semiconductor chip package and method for fabricating the same |
| 04/08/2008 | US7355286 Flip chip bonded package applicable to fine pitch technology |
| 04/08/2008 | US7355285 Structure of mounting electronic component |
| 04/08/2008 | US7355283 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
| 04/08/2008 | US7355280 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
| 04/08/2008 | US7355279 Semiconductor device and fabrication method thereof |
| 04/08/2008 | US7355278 Mold die for a semiconductor device |
| 04/08/2008 | US7355277 Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
| 04/08/2008 | US7355276 Thermally-enhanced circuit assembly |
| 04/08/2008 | US7355275 Chip package and fabricating method thereof |
| 04/08/2008 | US7355274 Semiconductor package, manufacturing method thereof and IC chip |
| 04/08/2008 | US7355273 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
| 04/08/2008 | US7355272 Semiconductor device with stacked semiconductor chips of the same type |
| 04/08/2008 | US7355271 Flexible assembly of stacked chips |
| 04/08/2008 | US7355270 Semiconductor chip with coil antenna and communication system |
| 04/08/2008 | US7355269 IC on non-semiconductor substrate |
| 04/08/2008 | US7355268 High reflector tunable stress coating, such as for a MEMS mirror |
| 04/08/2008 | US7355265 Semiconductor integrated circuit |
| 04/08/2008 | US7355264 Integrated passive devices with high Q inductors |
| 04/08/2008 | US7355261 Thin film device, thin film device module, and method of forming thin film device module |
| 04/08/2008 | US7355257 Semiconductor superjunction device |
| 04/08/2008 | US7355253 Strained-channel Fin field effect transistor (FET) with a uniform channel thickness and separate gates |
| 04/08/2008 | US7355252 Electrostatic discharge protection device and method of fabricating the same |
| 04/08/2008 | US7355251 Light emitting device |
| 04/08/2008 | US7355250 Electrostatic discharge device with controllable holding current |
| 04/08/2008 | US7355206 Thin film transistor array panel and manufacturing method thereof |
| 04/08/2008 | US7355201 Test structure for measuring electrical and dimensional characteristics |
| 04/08/2008 | US7355200 Ion-sensitive field effect transistor and method for producing an ion-sensitive field effect transistor |
| 04/08/2008 | US7355127 Printed wiring board and electronic device using the same |
| 04/08/2008 | US7355113 Thermoelectric conversion device and method of manufacturing the same |
| 04/08/2008 | US7354978 Soldering resistance; mixture with phenolic resin, hardener promoter, filler and triazole compound; encapsulating semiconductors |
| 04/08/2008 | US7354817 Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device |
| 04/08/2008 | US7354813 Method for electrostatic discharge protection in integrated circuits |
| 04/08/2008 | US7354804 Method for fabricating lead frame and method of fabricating semiconductor device using the same |
| 04/08/2008 | US7354800 Method of fabricating a stacked integrated circuit package system |
| 04/08/2008 | US7354797 Method for producing a plurality of electronic devices |
| 04/08/2008 | US7354796 Method for fabricating semiconductor package free of substrate |