| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/10/2008 | US20080083985 Low fabrication cost, fine pitch and high reliability solder bump |
| 04/10/2008 | US20080083984 Wiring board |
| 04/10/2008 | US20080083983 Bump electrode including plating layers and method of fabricating the same |
| 04/10/2008 | US20080083982 Method and system for initiating proximity warning alarm for electronic devices and prohibiting operation thereof |
| 04/10/2008 | US20080083981 Thermally Enhanced BGA Packages and Methods |
| 04/10/2008 | US20080083980 Cmos image sensor chip scale package with die receiving through-hole and method of the same |
| 04/10/2008 | US20080083979 Wafer holder and semiconductor manufacturing apparatus equipped with wafer holder |
| 04/10/2008 | US20080083978 Semiconductor device |
| 04/10/2008 | US20080083977 Edge connect wafer level stacking |
| 04/10/2008 | US20080083976 Edge connect wafer level stacking |
| 04/10/2008 | US20080083975 Stacked structures and methods of fabricating stacked structures |
| 04/10/2008 | US20080083974 Light-emitting device |
| 04/10/2008 | US20080083973 Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these |
| 04/10/2008 | US20080083972 Microelectronic component assemblies and microelectronic component lead frame structures |
| 04/10/2008 | US20080083971 Electronic device and lead frame |
| 04/10/2008 | US20080083937 Semiconductor integrated circuit |
| 04/10/2008 | US20080083923 Semiconductor device |
| 04/10/2008 | US20080083922 Radio frequency test key structure |
| 04/10/2008 | US20080083561 Thin printed circuit board for manufacturing chip scale package |
| 04/10/2008 | US20080083343 Semiconductor Bridge Device and Igniter Including Semiconductor Bridge Circuit Device |
| 04/10/2008 | DE19928570B4 Verfahren zur Herstellung von Halbleitervorrichtungen A process for the manufacture of semiconductor devices |
| 04/10/2008 | DE10360708B4 Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben Semiconductor module with a semiconductor stack, rewiring, and methods of making the same |
| 04/10/2008 | DE102007046349A1 Anordnung zum Kühlen eines Leistungshalbleitermoduls An arrangement for cooling a power semiconductor module |
| 04/10/2008 | DE102007045036A1 Semiconductor component, has protective layer covering transistor, and insulation layer arranged on protective layer and another insulation layer of area, where semiconductor structure is arranged on former insulation layer |
| 04/10/2008 | DE102007030812A1 Metallische Leitung in Halbleitervorrichtung und Verfahren zum Bilden derselben Metallic lead in the semiconductor device and method of forming same |
| 04/10/2008 | DE102007024662A1 Spring clip for electronic components, e.g. field effect and bipolar transistors has an edge having a recess with fitting |
| 04/10/2008 | DE102007003809A1 LED arrangement producing method, involves arranging LED modules such that modules are pairwise adjacent to each other, and establishing stable and electrically conducting connection between carrier bodies of two LED modules using carrier |
| 04/10/2008 | DE102006056988A1 Wärmeübertragungs-Kompositmaterial, zugehörige Vorrichtung und Verfahren Heat transfer composite material, associated apparatus and method |
| 04/10/2008 | DE102006047761A1 Halbleiterbauteil und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 04/10/2008 | DE102006046790A1 Integriertes Bauelement und Verfahren zum Trennen einer elektrisch leitfähigen Verbindung An integrated device and method for separating an electrically conductive connection |
| 04/10/2008 | DE102006045939A1 Leistungshalbleitermodul mit verbesserter Temperaturwechselstabilität Power semiconductor module with improved thermal shock stability |
| 04/10/2008 | DE102005036646B4 Halbleiterchip und Herstellungsverfahren Semiconductor chip and the manufacturing method |
| 04/10/2008 | DE10159444B4 Flüssigkristallanzeige-Bildschirm und Verfahren zum Herstellen desselben Of the same liquid crystal display screen and methods of making |
| 04/10/2008 | CA2665361A1 Plastic surface mount large area power device |
| 04/09/2008 | EP1909546A1 Printed wiring board |
| 04/09/2008 | EP1909327A2 Thin film transistor panel and manufacturing method thereof |
| 04/09/2008 | EP1909326A1 Semiconductor element and electric device |
| 04/09/2008 | EP1909324A1 Heat dissipating wiring board, method for manufacturing same, and electric device using heat dissipating wiring board |
| 04/09/2008 | EP1909323A2 Semiconductor device and method for manufacturing the same |
| 04/09/2008 | EP1909322A1 Stacked electronic component, electronic device and method for manufacturing stacked electronic component |
| 04/09/2008 | EP1909321A1 Metal-ceramic composite substrate and method for manufacturing same |
| 04/09/2008 | EP1909317A1 Gold alloy wire for use as bonding wire exhibiting high initial bonding capability, high bonding reliability, high circularity of press bonded ball, high straight advancing property, high resin flow resistance and low specific resistance |
| 04/09/2008 | EP1909053A2 Heat dissipating system and method |
| 04/09/2008 | EP1908167A1 Compensation for parasitic coupling between rf or microwave transistors in the same package |
| 04/09/2008 | EP1908106A1 Arrangement of an electrical component and a film composite laminated on the component and method for production of the arrangement |
| 04/09/2008 | EP1908105A2 Method and structure for reduction of soft error rates in integrated circuits |
| 04/09/2008 | EP1908104A1 A package for a die |
| 04/09/2008 | EP1907159A2 Semiconductor die attachment for high vacuum tubes |
| 04/09/2008 | EP1563537B1 Integrated circuit with at least one bump |
| 04/09/2008 | EP1556896B1 Anti-reflective compositions comprising triazine compounds |
| 04/09/2008 | EP1166352B1 Micro-relay |
| 04/09/2008 | CN201045736Y Substrate for thin type semiconductor chip encapsulation |
| 04/09/2008 | CN201045487Y Power type LED lamp |
| 04/09/2008 | CN201045486Y LED lighting lamp |
| 04/09/2008 | CN201045474Y LED lighting bulb |
| 04/09/2008 | CN201045461Y High power high brightness LED road lamp |
| 04/09/2008 | CN101160659A 半导体装置及引线框 Semiconductor device and lead frame |
| 04/09/2008 | CN101160658A Refractory metal substrate with improved thermal conductivity |
| 04/09/2008 | CN101160657A Semiconductor device and its manufacturing process |
| 04/09/2008 | CN101160648A Low cost, high volume lead frame production |
| 04/09/2008 | CN101160037A Heat radiator and surface treating method thereof |
| 04/09/2008 | CN101160035A Heat sink and cooling apparatus |
| 04/09/2008 | CN101160034A Hot pipe cooling radiator of high-power drive electronic device |
| 04/09/2008 | CN101160033A Heat transfer composite, associated device and method |
| 04/09/2008 | CN101159311A Nonvolatile memory device and fabrication method thereof |
| 04/09/2008 | CN101159302A Lead frame for an optical semiconductor device, optical semiconductor device using the same, and manufacturing method for these |
| 04/09/2008 | CN101159300A Copper base high power LED packaging |
| 04/09/2008 | CN101159299A LED packaging structure |
| 04/09/2008 | CN101159287A Tunnel transistor having spin-dependent transfer characteristic and nonvolatile memory using same |
| 04/09/2008 | CN101159279A Semiconductor image sensor die and production method thereof, semiconductor image sensor module, image sensor device, optical device element, and optical device module |
| 04/09/2008 | CN101159275A Thin-film transistor array substrates and method of producing the same |
| 04/09/2008 | CN101159274A Thin film transistor substrate having structure for compensating for mask misalignment |
| 04/09/2008 | CN101159273A Display device and method of manufacturing the same |
| 04/09/2008 | CN101159269A Structure and method for creation of a transistor |
| 04/09/2008 | CN101159265A 半导体集成电路 The semiconductor integrated circuit |
| 04/09/2008 | CN101159264A Semiconductor integrated circuit |
| 04/09/2008 | CN101159263A Electrostatic discharge protection of a clamp |
| 04/09/2008 | CN101159261A Semiconductor device and method for manufacturing the same |
| 04/09/2008 | CN101159260A Stacked structures and methods of forming stacked structures |
| 04/09/2008 | CN101159259A Three-dimensional multiple chips packaging module and preparation method |
| 04/09/2008 | CN101159258A Fuse structure including cavity and methods for fabrication thereof |
| 04/09/2008 | CN101159257A High-density 3-dimensional resistors |
| 04/09/2008 | CN101159256A Sub-lithographic local interconnects, and methods for forming same |
| 04/09/2008 | CN101159255A Electronic device and manufacturing method thereof |
| 04/09/2008 | CN101159254A 半导体装置 Semiconductor device |
| 04/09/2008 | CN101159253A Metallic layer structure under projection, crystal round structure and forming method of the same |
| 04/09/2008 | CN101159252A Novel bonding and probing pad structures |
| 04/09/2008 | CN101159251A Sintered metallic thermal interface materials for microelectronic cooling assemblies |
| 04/09/2008 | CN101159250A Indicator element and manufacturing method therefor |
| 04/09/2008 | CN101159247A Manufacturing method for an integrated semiconductor structure and corresponding integrated semiconductor structure |
| 04/09/2008 | CN101159240A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159239A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159238A Electronic device and method of manufacturing the same |
| 04/09/2008 | CN101159226A Method of forming pad patterns using self-align double patterning method, pad pattern layout formed using the same, and method of forming contact holes using self-align double patterning method |
| 04/09/2008 | CN101158992A Layout designing method for semiconductor integrated circuit |
| 04/09/2008 | CN101158790A Active element array substrates and cutting method thereof |
| 04/09/2008 | CN100381027C Printed wiring board and method of producing same |
| 04/09/2008 | CN100381026C Printed wiring board and method of producing same |
| 04/09/2008 | CN100381025C Flexible wiring board with multilayer structure and its making method |
| 04/09/2008 | CN100381024C Method and apparatus for encapsulating semiconductor device |