| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/15/2008 | US7358619 Tape carrier for TAB |
| 04/15/2008 | US7358618 Semiconductor device and manufacturing method thereof |
| 04/15/2008 | US7358617 Bond pad for ball grid array package |
| 04/15/2008 | US7358616 Semiconductor stacked die/wafer configuration and packaging and method thereof |
| 04/15/2008 | US7358614 Antisymmetric nanowire crossbars |
| 04/15/2008 | US7358612 Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance |
| 04/15/2008 | US7358611 System and method for adjusting the ratio of deposition times to optimize via density and via fill in aluminum multilayer metallization |
| 04/15/2008 | US7358610 Top layers of metal for high performance IC's |
| 04/15/2008 | US7358609 Semiconductor device |
| 04/15/2008 | US7358608 Semiconductor device having chip size package with improved strength |
| 04/15/2008 | US7358607 Substrates and systems to minimize signal path discontinuities |
| 04/15/2008 | US7358606 Apparatus to compensate for stress between heat spreader and thermal interface material |
| 04/15/2008 | US7358605 Heat dissipation structure for electronic device |
| 04/15/2008 | US7358604 Multichip circuit module and method for the production thereof |
| 04/15/2008 | US7358603 High density electronic packages |
| 04/15/2008 | US7358602 Semiconductor chip, and semiconductor wafer including a variable thickness insulating layer |
| 04/15/2008 | US7358601 Architecture for face-to-face bonding between substrate and multiple daughter chips |
| 04/15/2008 | US7358600 Interposer for interconnecting components in a memory card |
| 04/15/2008 | US7358598 Process for fabricating a semiconductor package and semiconductor package with leadframe |
| 04/15/2008 | US7358596 Device isolation for semiconductor devices |
| 04/15/2008 | US7358595 Method for manufacturing MOS transistor |
| 04/15/2008 | US7358594 Method of forming a low k polymer E-beam printable mechanical support |
| 04/15/2008 | US7358593 Microfabricated miniature grids |
| 04/15/2008 | US7358592 Semiconductor device |
| 04/15/2008 | US7358591 Capacitor device and semiconductor device having the same, and capacitor device manufacturing method |
| 04/15/2008 | US7358589 Amorphous carbon metal-to-metal antifuse with adhesion promoting layers |
| 04/15/2008 | US7358572 Radiation tolerant electrostatic discharge protection networks |
| 04/15/2008 | US7358570 Liquid crystal display panel |
| 04/15/2008 | US7358554 Semiconductor manufacturing apparatus for modifying-in-film stress of thin films, and product formed thereby |
| 04/15/2008 | US7358549 Multi-layered metal routing technique |
| 04/15/2008 | US7358539 Flip-chip light emitting diode with indium-tin-oxide based reflecting contacts |
| 04/15/2008 | US7358527 Systems and methods for testing germanium devices |
| 04/15/2008 | US7358445 Circuit substrate and apparatus including the circuit substrate |
| 04/15/2008 | US7358300 Comprising polysiloxane obtained by hydrolytic condensation; alcoholic solvent alcohol capable of dissolving siloxane resin, ammonium salt, and thermal decomposing/volatile compound; curing; bonding and high strength; mechanical properties |
| 04/15/2008 | US7358299 insulating film having a lower dielectric constant than those of conventional insulating films; chemical resistance; obtained by adding a silicon compound having a silicon-carbon bond(s) in the skeletal chain (main chain) to a siloxane resin |
| 04/15/2008 | US7358201 Methods of forming channels on an integrated circuit die and die cooling systems including such channels |
| 04/15/2008 | US7358200 Gas-assisted rapid thermal processing |
| 04/15/2008 | US7358180 Method of forming wiring structure and semiconductor device |
| 04/15/2008 | US7358178 Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same |
| 04/15/2008 | US7358176 Screen printing method of forming conductive bumps |
| 04/15/2008 | US7358174 Methods of forming solder bumps on exposed metal pads |
| 04/15/2008 | US7358170 Methods of forming conductive interconnects, and methods of depositing nickel |
| 04/15/2008 | US7358154 Method for fabricating packaged die |
| 04/15/2008 | US7358153 Method for cutting junction board, and chip |
| 04/15/2008 | US7358152 Wafer bonding of thinned electronic materials and circuits to high performance substrate |
| 04/15/2008 | US7358148 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 04/15/2008 | US7358123 Thin film transistor array panel and manufacturing method thereof |
| 04/15/2008 | US7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device |
| 04/15/2008 | US7358117 Stacked die in die BGA package |
| 04/15/2008 | US7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides |
| 04/15/2008 | US7358114 Semiconductor device substrate, semiconductor device, and manufacturing method thereof |
| 04/15/2008 | US7357977 Electronic devices; back-end-of-the-line (BEOL) interconnect interlevel, a BEOL interconnect intralevel, a cap layer, a hardmask, CMP-stop layer and an etch-stop layer |
| 04/15/2008 | US7357294 Method for mounting a semiconductor package onto PCB |
| 04/15/2008 | US7357174 Supporting seat for supporting weight of heat dissipating fins to avoid deformation of heat dissipating tubes extending through the heat dissipating fins |
| 04/15/2008 | US7357173 Cooling device for a chip and method for its production |
| 04/12/2008 | CA2606079A1 Transponder embedded in a flexible multi-layer support |
| 04/10/2008 | WO2008043010A2 Gold-tin solder joints having reduced embrittlement |
| 04/10/2008 | WO2008042932A2 Interdigitated leadfingers |
| 04/10/2008 | WO2008042930A2 Pin array no lead package and assembly method thereof |
| 04/10/2008 | WO2008042657A2 Methods of formimg a single layer substrate for high capacity memory cards |
| 04/10/2008 | WO2008042549A2 Scalable interchangeable multiband power package mounting apparatus |
| 04/10/2008 | WO2008042492A2 Termination structures for super junction devices |
| 04/10/2008 | WO2008042193A2 Cold plate and mating manifold plate for ic device cooling system enabling the shipment of cooling system pre-charged with liquid coolant |
| 04/10/2008 | WO2008042180A1 Shape memory based mechanical enabling mechanism |
| 04/10/2008 | WO2008042129A2 Liquid immersion cooled multichip module |
| 04/10/2008 | WO2008041813A1 Ceramic package and method of manufacturing the same |
| 04/10/2008 | WO2008041737A1 Cooling apparatus |
| 04/10/2008 | WO2008041670A1 Apparatus for manufacturing semiconductor, method for manufacturing semiconductor device, storage medium, and computer program |
| 04/10/2008 | WO2008041555A1 Epoxy resin molding material for sealing and electronic component device |
| 04/10/2008 | WO2008041535A1 Cu-Mn ALLOY SPUTTERING TARGET AND SEMICONDUCTOR WIRING |
| 04/10/2008 | WO2008041507A1 Semiconductor package, and display |
| 04/10/2008 | WO2008041484A1 Elastic contact and method for bonding between metal terminals using the same |
| 04/10/2008 | WO2008041069A2 3d chip arrangement including memory manager |
| 04/10/2008 | WO2008040596A2 Heat sink for cooling an electrical component |
| 04/10/2008 | WO2008040255A1 Electronic device |
| 04/10/2008 | WO2008040200A1 Stacked multi-chip package with emi shielding |
| 04/10/2008 | WO2008024322A9 Shielding floating gate tunneling element structure |
| 04/10/2008 | WO2008007258A3 Power amplifier assembly |
| 04/10/2008 | WO2007145925A3 Method of making thermally enhanced substrate-based array package |
| 04/10/2008 | WO2007144539A3 Holder for electrical component and electrical device including the holder and component |
| 04/10/2008 | WO2007136941A3 Flip chip mlp with folded heat sink |
| 04/10/2008 | WO2007120322A3 Ground shields for semiconductors |
| 04/10/2008 | WO2007109492A3 Low profile semiconductor package-on-package |
| 04/10/2008 | WO2007098402A3 Customizable power and ground pins |
| 04/10/2008 | WO2007087620A3 Low profile semiconductor system having a partial-cavity substrate |
| 04/10/2008 | US20080085597 Post passivation interconnection schemes on top of IC chips |
| 04/10/2008 | US20080085596 Post passivation interconnection schemes on top of IC chips |
| 04/10/2008 | US20080085409 Heat-resistant dicing tape or sheet |
| 04/10/2008 | US20080084726 Semiconductor integrated circuit device and method for designing the same |
| 04/10/2008 | US20080083996 Semiconductor device and an information management system therefor |
| 04/10/2008 | US20080083995 Epoxy resin composition for encapsulating semiconductor device and thin semiconductor device |
| 04/10/2008 | US20080083994 Method for producing a semiconductor component and substrate for carrying out the method |
| 04/10/2008 | US20080083993 Gold-Tin Solder Joints Having Reduced Embrittlement |
| 04/10/2008 | US20080083992 Novel bonding and probing pad structures |
| 04/10/2008 | US20080083991 Sub-lithographic local interconnects, and methods for forming same |
| 04/10/2008 | US20080083990 Semiconductor device and method of manufacturing the same |
| 04/10/2008 | US20080083989 Semiconductor Device and Method for Fabricating the Same |
| 04/10/2008 | US20080083988 Top layers of metal for high performance IC's |
| 04/10/2008 | US20080083987 Top layers of metal for high performance IC's |
| 04/10/2008 | US20080083986 Wafer-level interconnect for high mechanical reliability applications |