| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/16/2008 | CN201048130Y Packing method capable of preventing component delamination in semiconductor plastic package |
| 04/16/2008 | CN201048129Y Effective packing method for improving component delamination in semiconductor plastic package |
| 04/16/2008 | CN201048128Y Compound cycle hot pipe type computer CPU cooling unit |
| 04/16/2008 | CN201047581Y High power LED sign lamp |
| 04/16/2008 | CN201047580Y Radiating apparatus |
| 04/16/2008 | CN201047555Y High power LED light source ophicephalous bulb holder |
| 04/16/2008 | CN201047532Y Combined section bar LED sending light |
| 04/16/2008 | CN201047529Y High power water proof LED road lamp |
| 04/16/2008 | CN101164165A Circuit member, circuit member manufacturing method, semiconductor device and multilayer structure on circuit member surface |
| 04/16/2008 | CN101164164A Heat radiator, circuit board, electronic equipment |
| 04/16/2008 | CN101164163A Heat sink, laser apparatus provided with such heat sink, and laser stack apparatus |
| 04/16/2008 | CN101164162A Semiconductor device, substrate and semiconductor device manufacturing method |
| 04/16/2008 | CN101164161A Low-temperature chemical vapor deposition of low-resistivity ruthenium layers |
| 04/16/2008 | CN101164151A Package and method of producing the same |
| 04/16/2008 | CN101163388A Heat radiating capillary structure, heat conducting component and method for making the heat radiating capillary structure |
| 04/16/2008 | CN101163386A Heat radiating method and heat radiator using the method and electronic device thereof |
| 04/16/2008 | CN101163384A Fastener and heat radiating device using the same |
| 04/16/2008 | CN101162754A Method for forming luminous device wiring and apparatus for fixing luminous device |
| 04/16/2008 | CN101162749A Semi-conductor high power luminous module having heat insulating effect |
| 04/16/2008 | CN101162728A Magnetic transistor circuit representing the data '1' and '0' of the binary system |
| 04/16/2008 | CN101162723A Minisize photography module and substrates thereof |
| 04/16/2008 | CN101162721A NAND flash memory devices having 3-dimensionally arranged memory cells and methods of fabricating the same |
| 04/16/2008 | CN101162719A Transistor capable of boosting electro-static discharge tolerance |
| 04/16/2008 | CN101162718A Semiconductor device and manufacturing method of the same |
| 04/16/2008 | CN101162716A Substrate with built-in electronic component and method for manufacturing the same |
| 04/16/2008 | CN101162715A Substrates bar, substrate structure and manufacturing method thereof |
| 04/16/2008 | CN101162714A Substrate structure and manufacturing method thereof |
| 04/16/2008 | CN101162713A Packaging structure and conducting wire rack thereof |
| 04/16/2008 | CN101162712A Semiconductor device and manufacturing method of the same |
| 04/16/2008 | CN101162711A Packaging cover board, chip packaging structure and manufacturing method thereof |
| 04/16/2008 | CN101162708A Nonvolatile semiconductor memory device to realize multi-bit cell and method for manufacturing the same |
| 04/16/2008 | CN101162704A Chip packaging body, chip structure and manufacturing method thereof |
| 04/16/2008 | CN101162699A Semiconductor device and manufacturing method of the same |
| 04/16/2008 | CN101162698A Sensing type packaging member and its manufacturing method |
| 04/16/2008 | CN101162484A Method for preventing from active-attacking |
| 04/16/2008 | CN101162481A Semiconductor integrated circuit layout designing apparatus |
| 04/16/2008 | CN101162340A Pixel structure |
| 04/16/2008 | CN101162338A Liquid crystal display board and method for manufacturing facing direction substrates thereof |
| 04/16/2008 | CN101162133A Heat pipe and its manufacturing method |
| 04/16/2008 | CN101162081A High-power LED street light fitting main casing |
| 04/16/2008 | CN101161396A Method of joining metallic members and radiation member |
| 04/16/2008 | CN101161395A Method of joining metallic members and process for manufacturing radiation member |
| 04/16/2008 | CN100382666C A heating system |
| 04/16/2008 | CN100382342C Light-emitting diode support and producing method thereof |
| 04/16/2008 | CN100382334C LSI package, interposer, interface module and signal processing LSI monitoring circuit |
| 04/16/2008 | CN100382315C Semiconductor device |
| 04/16/2008 | CN100382314C Semiconductor wafer |
| 04/16/2008 | CN100382313C Electrostatic discharge protective circuit and relevant techniques |
| 04/16/2008 | CN100382312C Semiconductor device and method of manufacturing semiconductor device |
| 04/16/2008 | CN100382311C Stack type double-chip packaging structure |
| 04/16/2008 | CN100382310C Electronic packed element containing photoelectric element and integrated circuit |
| 04/16/2008 | CN100382309C Molecule component |
| 04/16/2008 | CN100382308C Protector for electrostatic discharging |
| 04/16/2008 | CN100382307C Semiconductor device, card, methods of initializing, checking the authenticity and the identity thereof |
| 04/16/2008 | CN100382306C Economical high-frequency package |
| 04/16/2008 | CN100382305C Metal interconnecting structure and manufacture method thereof |
| 04/16/2008 | CN100382304C Semiconductor device and manufacturing method thereof |
| 04/16/2008 | CN100382303C Semiconductor device |
| 04/16/2008 | CN100382302C Dual inlay interconnection structure and its making method |
| 04/16/2008 | CN100382301C Method to generate porous organic dielectric |
| 04/16/2008 | CN100382300C IC element with pin position correcting function |
| 04/16/2008 | CN100382299C Hybrid integrated circuit device and method of manufacturing the same |
| 04/16/2008 | CN100382298C Electronic device and method of manufacturing same |
| 04/16/2008 | CN100382297C Method for cutting lead terminal of package type electronic component |
| 04/16/2008 | CN100382296C Lead frame, resin sealed semiconductor device and its manufacturing method |
| 04/16/2008 | CN100382295C Semiconductor package capable of improving earthing quality and lead rack thereof |
| 04/16/2008 | CN100382294C Encapsulation body of semiconductor chip and encapsulation method |
| 04/16/2008 | CN100382293C Integrated circuit with at least one bump |
| 04/16/2008 | CN100382292C Welding pad structure for electronic device |
| 04/16/2008 | CN100382291C Semiconductor device and making method thereof |
| 04/16/2008 | CN100382290C Semiconductor package having optimized wire bond positioning |
| 04/16/2008 | CN100382289C Electric circuit module |
| 04/16/2008 | CN100382288C Semiconductor unit with cooling system |
| 04/16/2008 | CN100382287C Structure for encapsulating semiconductor |
| 04/16/2008 | CN100382286C Optical semiconductor device, optical communication device, and electronic equipment |
| 04/16/2008 | CN100382285C Printing circuit board and production method and electronic parts |
| 04/16/2008 | CN100382284C Semiconductor device |
| 04/16/2008 | CN100382283C Integrated circuit chip and manufacturing method thereof |
| 04/16/2008 | CN100382279C Semiconductor device and method for manufacturing the same |
| 04/16/2008 | CN100382270C Short detection circuit and short detection method |
| 04/16/2008 | CN100382264C Semiconductor device and electronic equipment using the same |
| 04/16/2008 | CN100382263C Semiconductor wafer device having multilayer wiring structure and packaging method thereof |
| 04/16/2008 | CN100382262C Semiconductor device and its producing method |
| 04/16/2008 | CN100382260C Method of manufacturing semiconductor packaging device |
| 04/16/2008 | CN100382259C Radiating fin and heat pipe jointing method and apparatus |
| 04/16/2008 | CN100382258C 高阻抗射频功率塑料封装 High impedance RF power plastic package |
| 04/16/2008 | CN100382257C Self-healing polymer compositions |
| 04/16/2008 | CN100382208C Inductor element |
| 04/16/2008 | CN100381974C Semiconductor integrated circuit device and method for designing the same |
| 04/16/2008 | CN100381920C A wire for a display device, a method for manufacturing the same, a thin film transistor array panel including the wire, and a method for manufacturing the same |
| 04/16/2008 | CN100381497C Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same |
| 04/15/2008 | US7359201 Heat-generating electronic part cover and cover mounting method |
| 04/15/2008 | US7359198 System and method for inducing turbulence in fluid for dissipating thermal energy of electronic circuitry |
| 04/15/2008 | US7359195 Heatsink |
| 04/15/2008 | US7359192 Cooling device for heat-generating electronic component |
| 04/15/2008 | US7359170 RF circuit electrostatic discharge protection |
| 04/15/2008 | US7359054 Overlay target and measurement method using reference and sub-grids |
| 04/15/2008 | US7358755 Ring oscillator system |
| 04/15/2008 | US7358751 Contact pin assembly and contactor card |
| 04/15/2008 | US7358665 Organic electronic device provided with a metallic heat sink structure |