| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/17/2008 | US20080090094 Interlayer dielectric film |
| 04/17/2008 | US20080090085 Adhesive layer of caprolactone-modified epoxy resin and a melamine/isocyanuric acid adduct and a stretchable backing layer; dicing of a semiconductor and die-bonding of the diced semiconductor chip |
| 04/17/2008 | US20080089151 Methods of determining laser alignment and related structures, devices, and circuits |
| 04/17/2008 | US20080088996 Active Protection Device for Protecting Circuit Against Mechanical and Electromagnetic Attack |
| 04/17/2008 | US20080088993 Gated thyristor and related system and method |
| 04/17/2008 | US20080088040 Method for fabricating conformal electrodes using non-wettable surface and liquid metal |
| 04/17/2008 | US20080088039 Substrate with heat-dissipating dummy pattern for semiconductor packages |
| 04/17/2008 | US20080088038 Bond pad structures and integrated circuit chip having the same |
| 04/17/2008 | US20080088037 Semiconductor package and method for manufacturing the same |
| 04/17/2008 | US20080088036 Dicing die-bonding film |
| 04/17/2008 | US20080088035 Circuit board assembly |
| 04/17/2008 | US20080088034 Semiconductor device and method for manufacturing the same |
| 04/17/2008 | US20080088033 Microelectronic packages and methods therefor |
| 04/17/2008 | US20080088032 Stacked Modules and Method |
| 04/17/2008 | US20080088031 Semiconductor package structure and method of fabricating the same |
| 04/17/2008 | US20080088030 Attaching and interconnecting dies to a substrate |
| 04/17/2008 | US20080088029 Semiconductor device having contact barrier and method of manufacturing the same |
| 04/17/2008 | US20080088028 Substrate and manufacturing method of package structure |
| 04/17/2008 | US20080088027 Dry etchback of interconnect contacts |
| 04/17/2008 | US20080088026 Enhanced interconnect structure |
| 04/17/2008 | US20080088025 Semiconductor devices having elongated contact plugs |
| 04/17/2008 | US20080088024 Semiconductor device |
| 04/17/2008 | US20080088023 Semiconductor device with bonding pad support structure |
| 04/17/2008 | US20080088022 Implementation of a metal barrier in an integrated electronic circuit |
| 04/17/2008 | US20080088021 Semiconductor device and manufacturing method of semiconductor device |
| 04/17/2008 | US20080088020 Semiconductor device and manufacturing method of the same |
| 04/17/2008 | US20080088019 Structure and manufacturing method of a chip scale package |
| 04/17/2008 | US20080088018 Semiconductor package accomplishing fan-out structure through wire bonding |
| 04/17/2008 | US20080088017 Semiconductor integrated circuit device |
| 04/17/2008 | US20080088016 Chip with bump structure |
| 04/17/2008 | US20080088015 Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device |
| 04/17/2008 | US20080088014 Stacked imager package |
| 04/17/2008 | US20080088013 Chip and manufacturing method thereof |
| 04/17/2008 | US20080088012 Semiconductor device and wire bonding method therefor |
| 04/17/2008 | US20080088011 Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof |
| 04/17/2008 | US20080088010 Electronic device with integrated micromechanical contacts and cooling system |
| 04/17/2008 | US20080088009 I/o architecture for integrated circuit package |
| 04/17/2008 | US20080088008 Semiconductor package having pad arrangement |
| 04/17/2008 | US20080088007 System, device and method for reducing cross-talk in differential signal conductor pairs |
| 04/17/2008 | US20080088005 SIP package with small dimension |
| 04/17/2008 | US20080088004 Wafer level package structure with build up layers |
| 04/17/2008 | US20080088003 Stacked Modules and Method |
| 04/17/2008 | US20080088002 Chip package structure |
| 04/17/2008 | US20080088001 Package on package and method thereof |
| 04/17/2008 | US20080088000 Semiconductor integrated circuit device having reduced terminals and I/O area |
| 04/17/2008 | US20080087999 Micro BGA package having multi-chip stack |
| 04/17/2008 | US20080087998 Interconnection between different circuit types |
| 04/17/2008 | US20080087997 Semiconductor package substrate and method, in particular for MEMS devices |
| 04/17/2008 | US20080087996 Semiconductor device and manufacturing method of the same |
| 04/17/2008 | US20080087995 Flexible film semiconductor package and method for manufacturing the same |
| 04/17/2008 | US20080087994 Semiconductor apparatus |
| 04/17/2008 | US20080087993 Semiconductor device and method of manufacturing the same |
| 04/17/2008 | US20080087992 Semiconductor package having a bridged plate interconnection |
| 04/17/2008 | US20080087991 Vertical light source package |
| 04/17/2008 | US20080087989 Semiconductor device package of stacked semiconductor chips with spacers provided therein |
| 04/17/2008 | US20080087988 Semiconductor package preventing generation of static electricity therein |
| 04/17/2008 | US20080087987 Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same |
| 04/17/2008 | US20080087986 Materials, structures and methods for microelectronic packaging |
| 04/17/2008 | US20080087985 Forming high-K dielectric layers on smooth substrates |
| 04/17/2008 | US20080087962 Electrostatic discharge protection devices and methods for protecting semiconductor devices against electrostatic discharge events |
| 04/17/2008 | US20080087913 Semiconductor Device and Method for Producing the Same |
| 04/17/2008 | US20080087898 High-heat-resistant semiconductor device |
| 04/17/2008 | US20080087891 Semiconductor-on-diamond devices and methods of forming |
| 04/17/2008 | US20080087412 Heat Transport Device |
| 04/17/2008 | DE19962702B4 Prüfsockel einer BGA-Vorrichtung A test socket BGA device |
| 04/17/2008 | DE19709934B4 Kühlgerät zum Sieden und Kondensieren eines Kältemittels Cooling device for boiling and condensing a refrigerant |
| 04/17/2008 | DE112006000465T5 Barriereschichten für leitende Strukturmerkmale Barrier layers for conductive features |
| 04/17/2008 | DE112006000307T5 Halbleitereinrichtung und Verfahren und Vorrichtung zu deren Herstellung A semiconductor device and method and apparatus for the preparation thereof |
| 04/17/2008 | DE112005003273T5 Eingebetteter Wärmeverteiler Embedded heat spreader |
| 04/17/2008 | DE102007049481A1 Semiconductor component, has electrical connection established in inner side of semiconductor component by conductor boards, which are arranged in three-dimensional manner such that respective welding positions are provided at boards |
| 04/17/2008 | DE102007043876A1 Halbleiterbauteil und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same |
| 04/17/2008 | DE102007038418A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 04/17/2008 | DE102007021983A1 Verfahren zur Herstellung eines integrierten metallischen Kühlkörpers für eine Halbleitereinrichtung A method for manufacturing an integrated metallic heat sink for a semiconductor device |
| 04/17/2008 | DE102006049476A1 Semiconductor chip for use in semiconductor chip stack, has solder material applied on front side in form of solder balls on plugs and intermediate spaces between balls are filled with concrete joint sealing compound on semiconductor wafer |
| 04/17/2008 | DE102006048592A1 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls An opto-electronic module and method for producing an optoelectronic module |
| 04/17/2008 | DE102006048230A1 Leuchtdiodensystem, Verfahren zur Herstellung eines solchen und Hinterleuchtungseinrichtung Light-emitting system, and method for producing such a backlighting |
| 04/17/2008 | DE102006045905A1 Semiconductor device i.e. smart card-controller, has multiple modules, where two of modules respectively include alarm recognition device for recognizing attack e.g. differential fault attack and reengineering attack |
| 04/17/2008 | DE102006042764B3 Base or cover wafer for producing cavity for multiplicate component, has getter test array arranged such that getter test array comes to lie in cavity, where array exhibits small getter material surface than gas absorption array surface |
| 04/17/2008 | DE102006017059B4 Halbleiter-Bauelement-System, sowie Verfahren zum Modifizieren eines Halbleiterbauelements Semiconductor component system, as well as methods for modifying a semiconductor device |
| 04/17/2008 | DE102005014929B4 Integrierte Spule und integrierter Transformator Integrated coil and integrated transformer |
| 04/17/2008 | DE102004016705B4 Verfahren zur Ausbildung einer Öffnung für einen Kontakt in einem Halbleiterbauelement sowie zugehörige Halbleiterbauelementstruktur A method of forming an opening for a contact in a semiconductor device and associated semiconductor device structure |
| 04/17/2008 | DE10126296B4 Verfahren zur Herstellung eines elektronischen Bauelements A method of manufacturing an electronic component |
| 04/17/2008 | CA2666286A1 Semiconductor high-power light-emitting module with heat isolation |
| 04/16/2008 | EP1912257A2 Method, an alignment mark and use of a hard mask material |
| 04/16/2008 | EP1912251A2 Resistor in a wiring layer and manufacturing method of the same |
| 04/16/2008 | EP1912030A1 Improved efficiency thermoelectrics utilizing thermal isolation |
| 04/16/2008 | EP1911784A1 Silica nanoparticles thermoset resin compositions |
| 04/16/2008 | EP1911579A1 Epoxy resin composition for encapsulating semiconductor device and thin semicondutor device |
| 04/16/2008 | EP1911096A2 Method and structure for forming slot via bitline for mram devices |
| 04/16/2008 | EP1911092A1 Integrated circuit packaging |
| 04/16/2008 | EP1911091A2 Die package with asymmetric leadframe connection |
| 04/16/2008 | EP1911090A2 Dual function composite system and method of making same |
| 04/16/2008 | EP1911089A1 Electronic component |
| 04/16/2008 | EP1911080A2 Flip-chip package with air cavity |
| 04/16/2008 | EP1910852A2 Electromechanical structure and method of making same |
| 04/16/2008 | EP1518451B1 Magnetic shielding for electronic circuits which include magnetic materials |
| 04/16/2008 | EP1477516B1 Antistatic, adhesive sheet and process for its preparation |
| 04/16/2008 | EP1151476B1 Semiconductor device having a field effect transistor and a method of manufacturing such a device |
| 04/16/2008 | EP1118117B1 Methods and apparatus for hermetically sealing electronic packages |
| 04/16/2008 | CN201048349Y Water nozzle of electrolysis DC heavy current commutating device pure water cooling system |