| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/22/2008 | US7362576 Radio frequency module |
| 04/22/2008 | US7362574 Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
| 04/22/2008 | US7362568 Heat spreader with filtering function and electrical apparatus |
| 04/22/2008 | US7362560 Multilayer electronic component and method for producing the same |
| 04/22/2008 | US7362120 Method and apparatus for die testing on wafer |
| 04/22/2008 | US7362113 Universal wafer carrier for wafer level die burn-in |
| 04/22/2008 | US7361997 Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths |
| 04/22/2008 | US7361996 Semiconductor device having tin-based solder layer and method for manufacturing the same |
| 04/22/2008 | US7361995 Molded high density electronic packaging structure for high performance applications |
| 04/22/2008 | US7361994 System to control signal line capacitance |
| 04/22/2008 | US7361992 Semiconductor device including interconnects formed by damascene process and manufacturing method thereof |
| 04/22/2008 | US7361991 Closed air gap interconnect structure |
| 04/22/2008 | US7361990 Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads |
| 04/22/2008 | US7361989 Stacked imager package |
| 04/22/2008 | US7361988 Apparatuses and methods to route line to line |
| 04/22/2008 | US7361987 Circuit device with at least partial packaging and method for forming |
| 04/22/2008 | US7361986 Heat stud for stacked chip package |
| 04/22/2008 | US7361985 Thermally enhanced molded package for semiconductors |
| 04/22/2008 | US7361984 Chip package structure |
| 04/22/2008 | US7361983 Semiconductor device and semiconductor assembly module with a gap-controlling lead structure |
| 04/22/2008 | US7361982 Bumpless chip package |
| 04/22/2008 | US7361981 Pad layout |
| 04/22/2008 | US7361980 Semiconductor device |
| 04/22/2008 | US7361979 Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates |
| 04/22/2008 | US7361978 Laser diode packaging |
| 04/22/2008 | US7361977 Semiconductor assembly and packaging for high current and low inductance |
| 04/22/2008 | US7361976 Data carrier with a module with a reinforcement strip |
| 04/22/2008 | US7361975 Semiconductor integrated circuit having reduced cross-talk noise |
| 04/22/2008 | US7361973 Embedded stressed nitride liners for CMOS performance improvement |
| 04/22/2008 | US7361971 Semiconductor wafer protection structure and laminated protective sheet for use therein |
| 04/22/2008 | US7361967 Semiconductor device with fuse wires and connection wires |
| 04/22/2008 | US7361965 Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design |
| 04/22/2008 | US7361964 Surface acoustic wave device with electro-static discharge protection |
| 04/22/2008 | US7361957 Device for electrostatic discharge protection and method of manufacturing the same |
| 04/22/2008 | US7361946 Semiconductor device-based sensors |
| 04/22/2008 | US7361944 Electrical device with a plurality of thin-film device layers |
| 04/22/2008 | US7361898 Scanning electron microscope and CD measurement calibration standard specimen |
| 04/22/2008 | US7361880 Digital camera module for detachably mounting with flex printed circuit board |
| 04/22/2008 | US7361846 High electrical performance semiconductor package |
| 04/22/2008 | US7361845 Wiring line for high frequency |
| 04/22/2008 | US7361844 Power converter package and thermal management |
| 04/22/2008 | US7361593 Methods of forming vias in multilayer substrates |
| 04/22/2008 | US7361589 Copper interconnect systems which use conductive, metal-based cap layers |
| 04/22/2008 | US7361568 Embedded capacitors and methods for their fabrication and connection |
| 04/22/2008 | US7361552 Semiconductor integrated circuit including a DRAM and an analog circuit |
| 04/22/2008 | US7361533 Stacked embedded leadframe |
| 04/22/2008 | US7361531 Methods and apparatus for Flip-Chip-On-Lead semiconductor package |
| 04/22/2008 | US7361525 Semiconductor integrated device having solid-state image sensor packaged within and production method for same |
| 04/22/2008 | US7361454 Exposing a resist film formed on semiconductor substrate to a light using photomask in which patterns are arranged two-dimensionally at a predetermined altitude; development; reducing an opening size; setting a reflow start temperature, heating; coating with water soluble resin; crosslinking; etching |
| 04/22/2008 | US7361029 IC package, IC socket, and IC socket assembly |
| 04/22/2008 | US7360903 Light source device, method for manufacturing light source device, and projection type display apparatus |
| 04/22/2008 | US7360586 Wrap around heat sink apparatus and method |
| 04/22/2008 | US7360582 Flow distributing unit and cooling unit having bypass flow |
| 04/22/2008 | US7360463 Process condition sensing wafer and data analysis system |
| 04/22/2008 | US7360309 Method of manufacturing microchannel heat exchangers |
| 04/22/2008 | CA2412030C Perimeter anchored thick film pad |
| 04/22/2008 | CA2321879C Cooling element for electronic power device and power electronic device comprising same |
| 04/17/2008 | WO2008045989A2 Enhanced interconnect structure |
| 04/17/2008 | WO2008045800A1 Electronic device with integrated micromechanical contacts and cooling system |
| 04/17/2008 | WO2008045707A1 Integrated circuit with back side conductive paths |
| 04/17/2008 | WO2008045416A1 High temperature, high voltage sic void-less electronic package |
| 04/17/2008 | WO2008045177A2 Electronic device and lead frame |
| 04/17/2008 | WO2008044757A1 Conductive film forming method, thin film transistor, panel with thin film transistor and thin film transistor manufacturing method |
| 04/17/2008 | WO2008044717A2 Cooling apparatus and electronic device comprising same |
| 04/17/2008 | WO2008044602A1 Method for forming thin film and multilayer structure of thin film |
| 04/17/2008 | WO2008044580A1 Solid-state image sensor |
| 04/17/2008 | WO2008044579A1 Epoxy resin composition for sealing of semiconductor and semiconductor device |
| 04/17/2008 | WO2008044552A1 Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device |
| 04/17/2008 | WO2008044537A1 Semiconductor package and method for producing semiconductor package |
| 04/17/2008 | WO2008044496A1 Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same |
| 04/17/2008 | WO2008044485A1 Mounting structure for power module and motor control device having the same |
| 04/17/2008 | WO2008043264A1 Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| 04/17/2008 | WO2008043206A1 A semiconductor light-emitting module |
| 04/17/2008 | WO2008027856A3 Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same |
| 04/17/2008 | WO2008027709A3 Microelectronic device having interconnects and conductive backplanes |
| 04/17/2008 | WO2008014370A3 Microcontroller with low noise peripheral |
| 04/17/2008 | WO2008008948A3 System and method of attenuating electromagnetic interference with a grounded top film |
| 04/17/2008 | WO2008008085A3 Ic coolant microchannel assembly with integrated attachment hardware |
| 04/17/2008 | WO2008003051A3 Stress mitigation in packaged microchips |
| 04/17/2008 | WO2008000551A3 Cooling member |
| 04/17/2008 | WO2007143730A3 Semiconductor device with high current performance packaging |
| 04/17/2008 | WO2007131256A3 Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component |
| 04/17/2008 | WO2007130517A3 Extended probe tips |
| 04/17/2008 | WO2007124410A3 Thermally enhanced bga package with ground ring |
| 04/17/2008 | WO2007118050A3 Method and circuits for sensing on-chip voltage in powerup mode |
| 04/17/2008 | WO2007117931A3 Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices |
| 04/17/2008 | WO2007117844A3 Semiconductor die packages using thin dies and metal substrates |
| 04/17/2008 | WO2007089341A3 Integrated circuits with antennas formed from package lead wires |
| 04/17/2008 | WO2007079123A3 Test pads on flash memory cards |
| 04/17/2008 | US20080091096 Analyte Monitoring Device and Methods of Use |
| 04/17/2008 | US20080090406 Via attached to a bond pad utilizing a tapered interconnect |
| 04/17/2008 | US20080090404 Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
| 04/17/2008 | US20080090371 Semiconductor apparatus including a thin-metal-film resistor element and a method of manufacturing the same |
| 04/17/2008 | US20080090358 Method of fabricating semiconductor integrated circuit device |
| 04/17/2008 | US20080090335 Circuit module and manufacturing method thereof |
| 04/17/2008 | US20080090332 Process For Fabricating Electronic Components Using Liquid Injection Molding |
| 04/17/2008 | US20080090331 Semiconductor device manufacturing method and manufacturing apparatus |
| 04/17/2008 | US20080090330 Semiconductor device including a plurality of circuit element chips and a manufacturing method thereof |
| 04/17/2008 | US20080090314 Semiconductor device and manufacturing method of the same |
| 04/17/2008 | US20080090313 Manufacturing device of semiconductor package and manufacturing method of semiconductor package |