Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2008
04/23/2008EP1913633A2 Packaged integrated circuit with enhanced thermal dissipation
04/23/2008EP1913631A2 3d ic method and device
04/23/2008EP1696481B1 Method of integrating an electronic component into a substrate cavity
04/23/2008EP1421837A4 Electrically isolated module
04/23/2008EP1366513A4 Method for multilevel copper interconnects for ultra large scale integration
04/23/2008EP1350269B1 Self-passivating cu laser fuse
04/23/2008EP1142017B1 Method for producing a semiconductor component with wiring partly extending in the substrate
04/23/2008EP1135794B1 A method and apparatus for the transport and tracking of an electronic component
04/23/2008EP1051750B1 An integrated circuit device
04/23/2008EP1048071B1 Integrated circuit rewiring using gas-assisted focused ion beam (fib) etching
04/23/2008EP1041633B1 Semiconductor device, method of manufacture thereof, circuit board, and electronic device
04/23/2008CN201051500Y Display encapsulation semiconductor surge protection part
04/23/2008CN201051498Y Integrated circuit out lead framework
04/23/2008CN201051497Y Welding line rack structure before encapsulation and its semiconductor power crystal encapsulation structure
04/23/2008CN201051496Y Semiconductor separation part shell encapsulation structure
04/23/2008CN201051495Y Alternation encapsulation structure for communication module
04/23/2008CN201051238Y CPU no noise liquid heat radiation device
04/23/2008CN201050766Y Support structure of light-emitting diode
04/23/2008CN201050765Y Water-proof LED light-emitting module
04/23/2008CN201050764Y Light-emitting diode
04/23/2008CN201050748Y Light-emitting diode
04/23/2008CN201050722Y Vehicular LED lamp set heat dissipation structure
04/23/2008CN101167251A Integrated smart power switch
04/23/2008CN101167194A A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
04/23/2008CN101167185A Molded lead frame connector with one or more passive components
04/23/2008CN101167184A Liquid-cooled jacket
04/23/2008CN101167183A Cooler, heat sink and electronic apparatus
04/23/2008CN101167182A Selectively grooved cold plate for electronics cooling
04/23/2008CN101167181A Electronic component mounting board and electronic device using same
04/23/2008CN101167170A Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
04/23/2008CN101166792A Curable silicone composition and electronic components
04/23/2008CN101166409A Liquid-cooling heat radiator
04/23/2008CN101166408A Heat radiation module
04/23/2008CN101166407A Heat pipe heat radiation device and its making method
04/23/2008CN101166406A Fin group and heat radiation device with fin group
04/23/2008CN101166023A Impulse output circuit, shift register and displaying device
04/23/2008CN101165929A Light semiconductor device and method for manufacturing the same
04/23/2008CN101165926A Optical coupling type semiconductor device, method for producing optical coupling type semiconductor device, and electronic device
04/23/2008CN101165922A Stack type metal-oxide-metal capacitor structure
04/23/2008CN101165913A Organic light emitting diode display and method of manufacture
04/23/2008CN101165909A Nonvolatile semiconductor storage apparatus and method for manufacturing the same
04/23/2008CN101165908A TFT substrate, manufacturing method thereof, and displaying device with the TFT substrate
04/23/2008CN101165907A Image display unit and method for manufacutre the same
04/23/2008CN101165906A Thin film transistor array substrate and electronic ink display device
04/23/2008CN101165904A Pixel structure
04/23/2008CN101165902A Nonvolatile memory devices and methods for forming same
04/23/2008CN101165899A Power metal oxide silicon field effect transistor
04/23/2008CN101165896A Semiconductor device and method for fabricating the same
04/23/2008CN101165894A Chip package for image sensor and method of manufacturing the same
04/23/2008CN101165893A Semiconductor light receiver module
04/23/2008CN101165891A Package structure coated with asymmetric single-side pin lower wafer
04/23/2008CN101165890A Semiconductor package structure and manufacture method thereof
04/23/2008CN101165889A Radio-frequency test key structure
04/23/2008CN101165888A Electrically programmable fuse sense circuit and method for sensing electrically programmable fuse state
04/23/2008CN101165887A Direct power delivery into an electronic package
04/23/2008CN101165886A Semiconductor packaging member for semiconductor device stacking and its manufacture method
04/23/2008CN101165885A Chip and its making method
04/23/2008CN101165884A Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
04/23/2008CN101165883A Transparent carbon nanotube electrode using conductive dispersant and production method thereof
04/23/2008CN101165879A Nonvolatile memory devices and methods of forming the same
04/23/2008CN101165878A Image sensor and its manufacture method
04/23/2008CN101165876A Method for manufacturing semiconductor device, substrate processing device and substrate processing method
04/23/2008CN101165875A Semiconductor device and method for forming thereof
04/23/2008CN101165874A Sub-lithographic nano interconnect structures, and method for forming same
04/23/2008CN101165866A Integrated circuit package and method of making same
04/23/2008CN101165860A Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
04/23/2008CN101165581A In-plane switching mode liquid crystal display device and method of fabricating the same
04/23/2008CN101165551A 显示面板 Display panel
04/23/2008CN101165099A Heat stable aryl polysiloxane compositions
04/23/2008CN101165076A Anti-flaming phosphorus-containing epoxy resin, preparation method thereof and composition containing the same
04/23/2008CN100384309C Welding method, component connection welded by such welding method and connection structure
04/23/2008CN100383968C Stacked semiconductor memory device
04/23/2008CN100383967C Optical semiconductor element and electronic device using the optical semiconductor element
04/23/2008CN100383966C Semiconductor device and design method thereof
04/23/2008CN100383965C Semiconductor device and method of fabricating the same
04/23/2008CN100383964C Semiconductor package and its producing method
04/23/2008CN100383963C Thin loop type radiating apparatus
04/23/2008CN100383962C Hot pipe and production method thereof
04/23/2008CN100383961C Radiator and its production method
04/23/2008CN100383960C Heat pipe
04/23/2008CN100383959C Electronic component, and method of manufacturing semiconductor device using the component
04/23/2008CN100383958C Semiconductor device
04/23/2008CN100383957C Cooling module
04/23/2008CN100383956C Radiator and producing method thereof
04/23/2008CN100383954C Storage element and array, method for making contact structure and produced device and element
04/23/2008CN100383953C Layer arrange forming method and layer arrange
04/23/2008CN100383942C Semiconductor device and radiation detector employing it
04/23/2008CN100383941C Coating for enhancing adhesion of molding compound to semiconductor devices
04/23/2008CN100383938C 半导体装置及其制造方法 Semiconductor device and manufacturing method
04/23/2008CN100383937C Method for manfacturing semiconductor chip, semiconductor device manufacturing method, semiconductor chip and semiconductor device
04/23/2008CN100383936C Three-dimensional device fabrication method
04/23/2008CN100383920C Chip stage silicon perforating radiating method and structure thereof
04/23/2008CN100383608C Matrix substrate, electronic apparatus, electro-optic apparatus, and electronic unit
04/23/2008CN100383213C Thermal interface material and its manufacturing method
04/22/2008US7363598 Dummy fill for integrated circuits
04/22/2008US7363017 High frequency module and manufacturing method thereof
04/22/2008US7362583 Thermal management device for multiple heat producing devices
04/22/2008US7362580 Electronic assembly having an indium wetting layer on a thermally conductive body
04/22/2008US7362578 Heat sink fastening system
04/22/2008US7362577 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member