| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/03/2014 | US20140183718 Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages |
| 07/03/2014 | US20140183717 Semiconductor module package |
| 07/03/2014 | US20140183716 Silver-to-silver bonded ic package having two ceramic substrates exposed on the outside of the package |
| 07/03/2014 | US20140183715 Semiconductor device |
| 07/03/2014 | US20140183714 Die package structure |
| 07/03/2014 | US20140183713 Die package structure |
| 07/03/2014 | US20140183712 Ball grid array package with improved thermal characteristics |
| 07/03/2014 | US20140183711 Semiconductor Device and Method of Making a Semiconductor Device |
| 07/03/2014 | US20140183710 Leadframe package with integrated partial waveguide interface |
| 07/03/2014 | US20140183709 Compartmentalized heat spreader for electromagnetic mitigation |
| 07/03/2014 | US20140183708 Electrostatic discharge protection structure and fabricating method thereof |
| 07/03/2014 | US20140183705 Semiconductor device with through silicon via and alignment mark |
| 07/03/2014 | US20140183704 Semiconductor chip, method for manufacturing semiconductor chip, and semiconductor device |
| 07/03/2014 | US20140183701 Hardmask composition and method of forming patterns and semiconductor integrated circuit device including the patterns |
| 07/03/2014 | US20140183699 Phase changing on-chip thermal heat sink |
| 07/03/2014 | US20140183690 Guard Ring Design for Maintaining Signal Integrity |
| 07/03/2014 | US20140183689 Anti-fuse array of semiconductor device and method for forming the same |
| 07/03/2014 | US20140183688 Modified via bottom for beol via efuse |
| 07/03/2014 | US20140183659 Signal path and method of manufacturing a multiple-patterned semiconductor device |
| 07/03/2014 | US20140183656 Method and System for Split Threshold Voltage Programmable Bitcells |
| 07/03/2014 | US20140183639 Esd protection structure and semiconductor device comprising the same |
| 07/03/2014 | US20140183609 Compound semiconductor esd protection devices |
| 07/03/2014 | US20140183603 Signal path and method of manufacturing a multiple-patterned semiconductor device |
| 07/03/2014 | US20140183574 Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices |
| 07/03/2014 | US20140183555 Electronic component |
| 07/03/2014 | US20140183550 Parasitic inductance reduction for multilayered board layout designs with semiconductor devices |
| 07/03/2014 | US20140183543 Method and system for co-packaging gallium nitride electronics |
| 07/03/2014 | US20140183533 Integrated circuit and method for fabricating an integrated circuit equipped with a temperature probe |
| 07/03/2014 | US20140183443 Engineered substrates having epitaxial formation structures with enhanced shear strength and associated systems and methods |
| 07/03/2014 | US20140183177 Semiconductor device and method for driving the same |
| 07/03/2014 | US20140182824 Heat dissipating component for semiconductor element |
| 07/03/2014 | US20140182763 Polymer matrices for polymer solder hybrid materials |
| 07/03/2014 | DE202014102842U1 Gassensorbauteil Gas sensor component |
| 07/03/2014 | DE112011105220T5 Elektronische Einrichtung Electronic device |
| 07/03/2014 | DE112011105205T5 Kühlen einer Sekundärkomponente durch Umleiten einer Luftströmung unter Verwendung eines Luftkanals, der mit einer Wärmeabführungsvorrichtung verknüpft ist, die eine Primärkomponente kühlt Cooling a secondary component by diverting an air flow using an air channel which is associated with a heat-dissipating device which cools a primary component |
| 07/03/2014 | DE102013207829A1 Chip-Antenne, Elektronisches Bauelement und Herstellungsverfahren dafür Chip antenna, electronic component, and manufacturing method thereof |
| 07/03/2014 | DE102013114938A1 Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device |
| 07/03/2014 | DE102013113469A1 Flip-chip-wafer-level-baueinheit und diesbezügliche verfahren Flip-chip wafer-level assembly and related methods |
| 07/03/2014 | DE102013109531A1 Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device |
| 07/03/2014 | DE102013104721A1 System und Verfahren für einen verbesserten Anschluss mit geringem Mittenabstand System and method for an improved connection with low pitch |
| 07/03/2014 | DE102013100016A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial A process for producing an electrically conductive pattern on a non-conductive carrier material, and for this purpose a particular additive and support material |
| 07/03/2014 | DE102011006445B4 Halbleitermodul und Verfahren zum Herstellen desselben The same semiconductor module and method of producing |
| 07/03/2014 | DE102009059304B4 Siliziumchip mit einem daran befestigten Kabel und Verfahen zur Befestigung des Kabels Silicon chip with a cable and attached thereto Procedure for attachment of the cable |
| 07/03/2014 | DE102009044368B4 Kühlanordnung Cooling arrangement |
| 07/03/2014 | DE102008050010B4 Herstellungsverfahren für eine Halbleitervorrichtung Manufacturing method of a semiconductor device |
| 07/03/2014 | DE102007050868B4 Leistungshalbleitervorrichtung Power semiconductor device |
| 07/03/2014 | DE102007001130B4 Verfahren zum Herstellen einer Durchkontaktierung in einer Schicht und Anordnung mit einer Schicht mit Durchkontaktierung A method of manufacturing a via in a layer and with a layer arrangement with through-hole plating |
| 07/03/2014 | DE102006032490B4 Halbleitervorrichtung Semiconductor device |
| 07/03/2014 | DE102005060641B4 Halbleiterdrucksensor Semiconductor pressure sensor |
| 07/03/2014 | DE102004048529B4 Elektronisches Gerät mit Halbleiterchip, der über eine Lötmittelschicht mit einem metallischen Leiterteil flächig verbunden ist An electronic device having the semiconductor chip, which is connected via a solder layer surface with a metallic conductor portion |
| 07/02/2014 | EP2750493A2 Cooling heat-generating electronics |
| 07/02/2014 | EP2750291A2 Semiconductor device and adjustment method of filter circuit |
| 07/02/2014 | EP2750187A1 Semiconductor device and semiconductor device manufacturing method |
| 07/02/2014 | EP2750186A2 Package structure and package method |
| 07/02/2014 | EP2750185A1 Improved method for manufacturing a contact structure |
| 07/02/2014 | EP2750184A1 Semiconductor module |
| 07/02/2014 | EP2750183A1 Integrated circuit and method for manufacturing an integrated circuit provided with a temperature probe |
| 07/02/2014 | EP2750182A1 Electronic device sealing for a downhole tool |
| 07/02/2014 | EP2750181A1 Optical semiconductor device |
| 07/02/2014 | EP2750177A2 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane |
| 07/02/2014 | EP2750176A2 Formation of through-wafer electrical interconnections and other structures using an etch stop layer |
| 07/02/2014 | EP2750173A2 Power semiconductor element bonded to a substrate by a Sn-Sb-Cu solder and manufacturing method therefor |
| 07/02/2014 | EP2750145A1 Coil for cordless charging and cordless charging apparatus using the same |
| 07/02/2014 | EP2749156A1 Sensor with a single electrical carrier means |
| 07/02/2014 | EP2748850A1 Packaging dram and soc in an ic package |
| 07/02/2014 | CN203691835U 智能机顶盒 Smart set-top boxes |
| 07/02/2014 | CN203691259U 一种应用于直流屏的新型硅链 Applied to the new DC panel of silicon chain |
| 07/02/2014 | CN203690294U 电子元件组件 Electronic component module |
| 07/02/2014 | CN203690293U 覆晶封装结构 Flip chip package structure |
| 07/02/2014 | CN203690292U 半导体封装元件及其导线架结构 Semiconductor packages and leadframe structure |
| 07/02/2014 | CN203690291U 散热铜片焊接支架 Copper heat welding brackets |
| 07/02/2014 | CN203690290U 无引线平面表贴式厚膜混合集成电路 Flat leadless surface mount thick film hybrid integrated circuits |
| 07/02/2014 | CN203690289U 芯片构件与芯片封装体 Chip and chip package member |
| 07/02/2014 | CN203690288U 一种叠层芯片的晶圆级铜凸块封装结构 Copper bump wafer-level package structure of a stacked chip |
| 07/02/2014 | CN203690287U 一种基于框架采用镀银技术的封装件 A framework for using silver-based technology package |
| 07/02/2014 | CN203690286U 具有电流体动力微泵的硅基微通道换热器 Has electrohydrodynamic micropump silicon microchannel heat exchanger |
| 07/02/2014 | CN203690285U 一种大功率模块的散热结构 Cooling structure for a high-power module |
| 07/02/2014 | CN203690284U 半导体装置 Semiconductor device |
| 07/02/2014 | CN203690283U 一种新型散热单元及堆叠式散热器 A new radiator cooling unit and stackable |
| 07/02/2014 | CN203690282U 一种新型的绝缘拉带式晶闸管装置 A new insulated drawstring thyristor device |
| 07/02/2014 | CN203690281U 组合式电脑散热铜片安装支架 Modular computer cooling copper mounting bracket |
| 07/02/2014 | CN203690280U 芯片封装用高导热金属陶瓷复合层状散热模块 Chip package with high thermal conductivity of metal-ceramic composite laminar cooling module |
| 07/02/2014 | CN203690279U 功率晶体吸热装置 Power transistor heat sink |
| 07/02/2014 | CN203683082U 具有孔的半导体装置 The semiconductor device having a bore |
| 07/02/2014 | CN103907409A 热沉附着模块 Heat sink attachment module |
| 07/02/2014 | CN103907405A 用于在织物中组装微电子芯片器件的方法、芯片器件和加入卷边的芯片器件的织物 Method for assembling a microelectronic chip fabric in the fabric of the device, the chip devices and chip devices join bead |
| 07/02/2014 | CN103907185A 具有多材料印刷形成的包装部件的引线载体 Having multiple wire carrier material formed by printing packaging member |
| 07/02/2014 | CN103907184A 电力转换装置 Power conversion means |
| 07/02/2014 | CN103907176A 制造半导体器件的方法 The method of manufacturing a semiconductor device |
| 07/02/2014 | CN103906413A 散热模块 Thermal Module |
| 07/02/2014 | CN103906412A 散热装置 Cooling devices |
| 07/02/2014 | CN103906411A 一种散热装置及压件 A heat sink device and pressing member |
| 07/02/2014 | CN103906370A 芯片封装结构、具有内埋元件的电路板及其制作方法 Chip package structure with embedded components and circuit board production methods |
| 07/02/2014 | CN103904448A Led模块基板用连接器 Led module board connector |
| 07/02/2014 | CN103904087A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof |
| 07/02/2014 | CN103904084A 三维叠层集成电路装置 Three-dimensional stacked integrated circuit device |
| 07/02/2014 | CN103904080A 三维存储器结构及其操作方法 Three-dimensional memory structure and method of operation |
| 07/02/2014 | CN103904074A 电路和用于制造电路的方法 Circuit and a method for manufacturing the circuit |
| 07/02/2014 | CN103904066A 一种倒装芯片堆叠封装结构及封装方法 A flip-chip stacked package structure and packaging method |
| 07/02/2014 | CN103904065A 电阻器、显示设备和电子设备 Resistors, display device and electronic equipment |