| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/24/2008 | WO2008013673A3 High speed, high density, low power die interconnect system |
| 04/24/2008 | WO2008005161A3 Semiconductor assemblies and manufacturing methods thereof |
| 04/24/2008 | WO2007146775A3 Stacked chips with underpinning |
| 04/24/2008 | WO2007136927A3 High density memory card system and method |
| 04/24/2008 | WO2007133806A3 Wafer level semiconductor chip packages and methods of making the same |
| 04/24/2008 | WO2007087502A3 Flip-attached and underfilled stacked semiconductor devices |
| 04/24/2008 | WO2007086937A3 Land grid array semiconductor device packages, assemblies including same, and methods of fabrication |
| 04/24/2008 | WO2007057918A8 A hand-held thumb touch typable ascii/unicode keypad for a remote, mobile telephone or a pda |
| 04/24/2008 | US20080097641 Interconnect structure of semiconductor integrated circuit, and design method and device therefor |
| 04/24/2008 | US20080096383 Method of manufacturing a semiconductor device with multiple dielectrics |
| 04/24/2008 | US20080096325 Chip packaging process |
| 04/24/2008 | US20080096323 Integrated circuit die/package interconnect |
| 04/24/2008 | US20080096316 Stacked Die in Die BGA Package |
| 04/24/2008 | US20080096314 Ball grid array package and method thereof |
| 04/24/2008 | US20080096313 Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates |
| 04/24/2008 | US20080096310 Embedded capacitors for reducing package cracking |
| 04/24/2008 | US20080096294 Integrated circuit structure, display module, and inspection method thereof |
| 04/24/2008 | US20080096137 to prevent the wafer form being damaged during double side process due to pressure differences; coating a photosensitive sacrificial layer on the front surface of the wafer; performing a photolithography to remove a portion of the photosensitive sacrificial layer to form the flow channel |
| 04/24/2008 | US20080096135 Methods for forming patterns of a filled dielectric material on substrates |
| 04/24/2008 | US20080095951 to reduce the number of thermal process steps as well as the peak process temperature used in the required process steps; the dielectric constant of the CVD deposited materials may be reduced by the electron beam process to a value below that attainable by conventional thermal processing |
| 04/24/2008 | US20080094805 Electronics Module and Method for Manufacturing the Same |
| 04/24/2008 | US20080094640 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structure |
| 04/24/2008 | US20080094086 Stack-type semiconductor package sockets and stack-type semiconductor package test systems |
| 04/24/2008 | US20080093749 Partial Solder Mask Defined Pad Design |
| 04/24/2008 | US20080093748 a chip, a substrate, an encapsulant, a plurality of movable external terminals and a stress release layer; prevent generating thermal stress, overcomes the problem of terminal crack |
| 04/24/2008 | US20080093747 Three dimensional device integration method and integrated device |
| 04/24/2008 | US20080093746 Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface |
| 04/24/2008 | US20080093745 High performance system-on-chip using post passivation process |
| 04/24/2008 | US20080093744 Anodization |
| 04/24/2008 | US20080093743 Sub-lithographic nano interconnect structures, and method for forming same |
| 04/24/2008 | US20080093742 System For Shielding Integrated Circuits |
| 04/24/2008 | US20080093741 Semiconductor device and method of fabricating the same |
| 04/24/2008 | US20080093739 Semiconductor mounting substrate and method for manufacturing the same |
| 04/24/2008 | US20080093738 Chip structure and wafer structure |
| 04/24/2008 | US20080093737 Integrated circuit with a reduced pad bump area and the manufacturing method thereof |
| 04/24/2008 | US20080093736 Semiconductor device |
| 04/24/2008 | US20080093735 Potted integrated circuit device with aluminum case |
| 04/24/2008 | US20080093734 High Density IC Module |
| 04/24/2008 | US20080093733 Chip package and manufacturing method thereof |
| 04/24/2008 | US20080093732 Packaging For High Power Integrated Circuits Using Supercritical Fluid |
| 04/24/2008 | US20080093731 Cooled Integrated Circuit |
| 04/24/2008 | US20080093730 Semiconductor Module And Semiconductor Device |
| 04/24/2008 | US20080093729 Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
| 04/24/2008 | US20080093728 Integrated circuit component with passivation layer and methods for making the same |
| 04/24/2008 | US20080093727 Metallised Film For Sheet Contacting |
| 04/24/2008 | US20080093726 Continuously Referencing Signals over Multiple Layers in Laminate Packages |
| 04/24/2008 | US20080093725 Semiconductor package preventing warping and wire severing defects, and method of manufacturing the semiconductor package |
| 04/24/2008 | US20080093724 Stackable Micropackages and Stacked Modules |
| 04/24/2008 | US20080093723 Passive placement in wire-bonded microelectronics |
| 04/24/2008 | US20080093722 Encapsulation type semiconductor device and manufacturing method thereof |
| 04/24/2008 | US20080093721 Chip package for image sensor and method of manufacturing the same |
| 04/24/2008 | US20080093720 Single Chip USB Packages With Contact-Pins Cover |
| 04/24/2008 | US20080093719 Chip package structure |
| 04/24/2008 | US20080093718 Semiconductor component and method of manufacture |
| 04/24/2008 | US20080093717 Leadframe of a leadless flip-chip package and method for manufacturing the same |
| 04/24/2008 | US20080093716 Semiconductor device and method of manufacturing semiconductor device |
| 04/24/2008 | US20080093715 Leadframe and mold compound interlock in packaged semiconductor device |
| 04/24/2008 | US20080093714 Semiconductor device and method of fabricating the same |
| 04/24/2008 | US20080093713 Metal Clad Fiber Optics for Enhanced Heat Dissipation |
| 04/24/2008 | US20080093712 Chip with Light Protection Layer |
| 04/24/2008 | US20080093711 Dielectric layers and methods of forming the same |
| 04/24/2008 | US20080093710 Hard mask arrangement, contact arrangement and methods of patterning a substrate and manufacturing a contact arrangement |
| 04/24/2008 | US20080093709 Manufacturing method of semiconductor device and semiconductor device |
| 04/24/2008 | US20080093708 Semiconductor device and manufacturing method thereof |
| 04/24/2008 | US20080093697 Semiconductor device and manufacturing method thereof |
| 04/24/2008 | US20080093672 String contact structure for high voltage ESD |
| 04/24/2008 | US20080093671 Semi-Conductor Element Comprising An Integrated Zener Diode And Method For The Production Thereof |
| 04/24/2008 | US20080093632 Size-reduced layout of cell-based integrated circuit with power switch |
| 04/24/2008 | US20080093617 Multiple reflection layer electrode, compound semiconductor light emitting device having the same and methods of fabricating the same |
| 04/24/2008 | US20080093603 Lower substrate, display apparatus having the same and method of manufacturing the same |
| 04/24/2008 | US20080093602 Image display unit and method for manufacutre the same |
| 04/24/2008 | US20080093600 Thin film transistor array panel and manufacturing method thereof |
| 04/24/2008 | US20080093598 Substrate for display device, manufacturing method for same and display device |
| 04/24/2008 | US20080093597 Semiconductor device |
| 04/24/2008 | US20080093596 Semiconductor Device and Method of Fabricating the Same |
| 04/24/2008 | US20080092991 Solder bumps formation using solder paste with shape retaining attribute |
| 04/24/2008 | US20080092938 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 04/24/2008 | US20080092812 Methods and Apparatuses for Depositing Uniform Layers |
| 04/24/2008 | US20080092353 Angled Elongated Features for Improved Alignment Process Integration |
| 04/24/2008 | DE202008002041U1 Wärmesenke Heat sink |
| 04/24/2008 | DE10314151B4 Halbleiterbauelementeanordnung und Verfahren zur Kompensation parasitärer Ströme Semiconductor device assembly and method for compensating for parasitic currents |
| 04/24/2008 | DE10226363B4 Halbleiterbauelement Semiconductor device |
| 04/24/2008 | DE10217698B4 Elektrische Schaltanordnung mit einem spritzgegossenen Schaltungsträger Electrical switching device with an injection molded circuit carrier |
| 04/24/2008 | DE102007043185A1 Einschaltschaltung Turn-on |
| 04/24/2008 | DE102007038322A1 MOS-Anordnung mit Diode-basierter Gate-Kopplung für verbesserte ESD-Eigenschaften und Layout-Technik hierfür MOS device with diode-based gate coupling for improved ESD properties and layout of this technique |
| 04/24/2008 | DE102006049740A1 Halbleiterbauelement Semiconductor device |
| 04/24/2008 | DE102006049562A1 Substrate e.g. germanium substrate, manufacturing method for use in semiconductor module, involves sealing channel with material e.g. gold, and filling channel with electrically conductive material e.g. copper |
| 04/24/2008 | DE102006049081A1 Semiconductor-illuminant has semiconductor-diode which is illuminated by tension admission, and substrate which is permeable for light produced by semiconductor-diode |
| 04/24/2008 | DE10047897B4 Elektronische Baueinheit mit einer als Leadframe ausgebildeten Montageplatte und darauf befestigten SMD-Bauteilen Electronic unit with a designed as a lead frame mounting plate and secured thereto SMD components |
| 04/24/2008 | CA2660191A1 Semiconductor structure and process for forming ohmic connections to a semiconductor structure |
| 04/23/2008 | EP1915042A2 Hermetically sealed circuit |
| 04/23/2008 | EP1915041A1 Printed wiring board and printed wiring board manufacturing method |
| 04/23/2008 | EP1915040A2 Printed wiring board and printed wiring board manufacturing method |
| 04/23/2008 | EP1915038A1 Multilayer Wiring Substrate Mounted With Electronic Component And Method For Manufacturing The Same |
| 04/23/2008 | EP1914811A1 Light-emitting device, method for manufacturing same, molded body and sealing member |
| 04/23/2008 | EP1914804A2 Single footprint family of integrated power modules |
| 04/23/2008 | EP1914803A1 Low profile ball grid array (BGA) package witth exposed die and method of making same |
| 04/23/2008 | EP1914262A1 Heat stable aryl polysiloxane compositions |
| 04/23/2008 | EP1914213A1 Silicon nitride substrate, silicon nitride circuit substrate using the same, and its use |
| 04/23/2008 | EP1913641A1 A package and manufacturing method for a microelectronic component |