| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 04/30/2008 | CN100385662C Semiconductor structure, and quality control method of manufacturing semiconductor structure |
| 04/30/2008 | CN100385661C Method and apparatus for encoding information in IC package |
| 04/30/2008 | CN100385660C Semiconductor element of improved electronic migration and method for forming semiconductor element |
| 04/30/2008 | CN100385659C Integrated circuit apparatus and semiconductor device including metal isolator-metal capacitor |
| 04/30/2008 | CN100385658C Lead frame and semiconductor device using the same |
| 04/30/2008 | CN100385657C Electronic device and method of manufacturing the same |
| 04/30/2008 | CN100385656C Arrangement of vias in a substrate to support a ball grid array |
| 04/30/2008 | CN100385655C 集成电路封装 IC packaging |
| 04/30/2008 | CN100385654C Wire rack packaging structure and manufacturing method thereof |
| 04/30/2008 | CN100385653C Liquid cooling jacket |
| 04/30/2008 | CN100385652C Semiconductor device |
| 04/30/2008 | CN100385651C Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body |
| 04/30/2008 | CN100385650C Heat radiation structure |
| 04/30/2008 | CN100385649C 半导体器件 Semiconductor devices |
| 04/30/2008 | CN100385648C Semiconductor device and electronic apparatus |
| 04/30/2008 | CN100385645C Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 04/30/2008 | CN100385642C Pad redistribution layer and method for fabricating pad redistribution layer |
| 04/30/2008 | CN100385641C Semiconductor packaging with partially patterned lead frames and its making methods |
| 04/30/2008 | CN100385638C Test sample for bridging and continuous testing |
| 04/30/2008 | CN100385637C Fabricating method for lead frame of integrated circuit |
| 04/30/2008 | CN100385628C Semiconductor wafer and manufacturing process for semiconductor device |
| 04/30/2008 | CN100385627C Semiconductor device producing method, semiconductor wafer and semiconductor device |
| 04/30/2008 | CN100385621C Semiconductor device and manufacturing method of the same |
| 04/30/2008 | CN100385370C Heat-receiving apparatus and electronic equipment |
| 04/30/2008 | CN100384903C Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board |
| 04/29/2008 | US7366629 High frequency module board device |
| 04/29/2008 | US7366486 System and method for coarse/fine PLL adjustment |
| 04/29/2008 | US7365987 Structure for heat dissipation of integrated circuit chip and display module including the same |
| 04/29/2008 | US7365986 Semiconductor cooling device and stack of semiconductor cooling devices |
| 04/29/2008 | US7365983 Grease protecting apparatus for heat sink |
| 04/29/2008 | US7365981 Fluid-cooled electronic system |
| 04/29/2008 | US7365980 Micropin heat exchanger |
| 04/29/2008 | US7365612 Low noise, hybrid tuned wideband voltage controlled oscillator |
| 04/29/2008 | US7365442 Encapsulation of thin-film electronic devices |
| 04/29/2008 | US7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method |
| 04/29/2008 | US7365440 Semiconductor device and fabrication method thereof |
| 04/29/2008 | US7365439 Semiconductor device, semiconductor package for use therein, and manufacturing method thereof |
| 04/29/2008 | US7365438 Semiconductor device with semiconductor components connected to one another |
| 04/29/2008 | US7365436 Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same |
| 04/29/2008 | US7365435 Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid |
| 04/29/2008 | US7365433 High-frequency semiconductor device and method of manufacturing the same |
| 04/29/2008 | US7365431 Semiconductor device having multilayer structure and method for manufacturing thereof |
| 04/29/2008 | US7365430 Semiconductor device and method of manufacturing the same |
| 04/29/2008 | US7365429 Semiconductor device and method for manufacturing the same |
| 04/29/2008 | US7365428 Array capacitor with resistive structure |
| 04/29/2008 | US7365427 Stackable semiconductor package |
| 04/29/2008 | US7365426 Semiconductor device |
| 04/29/2008 | US7365425 Heat radiation structure of semiconductor element and heat sink |
| 04/29/2008 | US7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same |
| 04/29/2008 | US7365423 Redistributed solder pads using etched lead frame |
| 04/29/2008 | US7365422 Package of leadframe with heatsinks |
| 04/29/2008 | US7365421 IC chip package with isolated vias |
| 04/29/2008 | US7365420 Semiconductor packages and methods for making and using same |
| 04/29/2008 | US7365419 Surface-mount packaging for chip |
| 04/29/2008 | US7365418 Multi-chip structure |
| 04/29/2008 | US7365417 Overhang integrated circuit package system |
| 04/29/2008 | US7365416 Multi-level semiconductor module and method for fabricating the same |
| 04/29/2008 | US7365415 High frequency semiconductor device |
| 04/29/2008 | US7365414 Component packaging apparatus, systems, and methods |
| 04/29/2008 | US7365407 Light emitting diode package with direct leadframe heat dissipation |
| 04/29/2008 | US7365405 Metrology structure and methods |
| 04/29/2008 | US7365400 Semiconductor device and method for manufacturing the same |
| 04/29/2008 | US7365397 Semiconductor device |
| 04/29/2008 | US7365376 Semiconductor integrated circuit |
| 04/29/2008 | US7365371 Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
| 04/29/2008 | US7365026 CxHy sacrificial layer for cu/low-k interconnects |
| 04/29/2008 | US7365001 Interconnect structures and methods of making thereof |
| 04/29/2008 | US7364998 Method for forming high reliability bump structure |
| 04/29/2008 | US7364994 Method for manufacturing a superjunction device with wide mesas |
| 04/29/2008 | US7364987 Method for manufacturing semiconductor device |
| 04/29/2008 | US7364985 Method for creating electrical pathways for semiconductor device structures using laser machining processes |
| 04/29/2008 | US7364983 Method and apparatus for creating RFID devices |
| 04/29/2008 | US7364950 Semiconductor device and method of manufacturing the same |
| 04/29/2008 | US7364949 Semiconductor device package |
| 04/29/2008 | US7364947 Method for cutting lead terminal of package type electronic component |
| 04/29/2008 | US7364945 Method of mounting an integrated circuit package in an encapsulant cavity |
| 04/29/2008 | US7364944 Method for fabricating thermally enhanced semiconductor package |
| 04/29/2008 | US7364943 Method of bonding a microelectronic die to a substrate and arrangement to carry out method |
| 04/29/2008 | US7364941 Circuit device manufacturing method |
| 04/29/2008 | US7364784 Thin semiconductor package having stackable lead frame and method of manufacturing the same |
| 04/29/2008 | US7364778 Container for an electronic component |
| 04/29/2008 | US7364632 Radiator member for electronic appliances and processes for producing the same |
| 04/29/2008 | US7363971 Method and apparatus for maintaining a multi-chip module at a temperature above downhole temperature |
| 04/29/2008 | CA2181591C Electrostatic discharge protection of isfet sensors |
| 04/24/2008 | WO2008049006A2 Materials for use with interconnects of electrical devices and related methods |
| 04/24/2008 | WO2008048666A2 Microelectronic packages and methods therefor |
| 04/24/2008 | WO2008048643A1 Microelectronic packages fabricated at the wafer level and method therefor |
| 04/24/2008 | WO2008048384A2 Potted integrated circuit device with aluminum case |
| 04/24/2008 | WO2008047918A1 Electronic device package structure and package manufacturing method |
| 04/24/2008 | WO2008047866A1 Resin composition and coating-film-forming material comprising the same |
| 04/24/2008 | WO2008047780A1 Heat sink, and its manufacturing method |
| 04/24/2008 | WO2008047687A1 Semiconductor device and semiconductor device manufacturing method |
| 04/24/2008 | WO2008047667A1 Multilayer film for wiring and wiring circuit |
| 04/24/2008 | WO2008047635A1 Method for manufacturing semiconductor device and semiconductor device |
| 04/24/2008 | WO2008047585A1 Semiconductor device external circuit connection unit structure and its formation method |
| 04/24/2008 | WO2008046925A1 Test structure for highly accelerated electromigration tests for thick metallization systems of solid integrated circuits |
| 04/24/2008 | WO2008046867A1 Encapsulated metal resistor |
| 04/24/2008 | WO2008046658A1 Semiconductor component |
| 04/24/2008 | WO2008046201A1 Semiconductor structure and process for forming ohmic connections to a semiconductor structure |
| 04/24/2008 | WO2008028827A3 Base material for photostructureable resists and dielectrics |