| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/01/2008 | US20080099761 Test structure for opc-related shorts between lines in a semiconductor device |
| 05/01/2008 | US20080099453 Energy-efficient, laser-based method and system for processing target material |
| 05/01/2008 | US20080099240 Ceramic header method and system |
| 05/01/2008 | US20080099234 Electronic module with dual connectivity |
| 04/30/2008 | EP1916884A1 Circuit board unit and method for production thereof |
| 04/30/2008 | EP1916713A2 Semiconductor package and stacked layer type semiconductor package formed with it |
| 04/30/2008 | EP1916712A2 Method for mounting electronic component on substrate and method for forming solder surface |
| 04/30/2008 | EP1916711A2 Electronic device and method of manufacturing the same |
| 04/30/2008 | EP1916709A1 Method of bonding |
| 04/30/2008 | EP1916707A2 Methods for depositing metal films by CVD or ALD processes onto diffusion barrier layers |
| 04/30/2008 | EP1916467A1 Led illumination device with high power and high heat dissipation rate |
| 04/30/2008 | EP1915783A2 Ldmos transistor |
| 04/30/2008 | EP1915780A2 Thickness tapered substrate launch |
| 04/30/2008 | EP1915779A1 A novel approach for high temperature wafer processing |
| 04/30/2008 | EP1915778A1 Single crystal based through the wafer connections |
| 04/30/2008 | EP1915777A1 Semiconductor substrate and methods for the production thereof |
| 04/30/2008 | EP1915776A2 Technique for efficiently patterning an underbump metallization layer using a dry etch process |
| 04/30/2008 | EP1573810B1 Method for forming patterns aligned on either side of a thin film |
| 04/30/2008 | EP1495154B1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 04/30/2008 | DE4337675B4 Verfahren zur Herstellung von stapelbaren Halbleitergehäusen A process for the production of stackable semiconductor packages |
| 04/30/2008 | DE19650331B4 Verfahren zur Herstellung eines Halbleiterbauelementes mit einer Schichtfolge aus zwei metallischen Schichten mit Siliciumanteilen sowie zugehöriges Halbleiterbauelement A process for producing a semiconductor component with a layer sequence of two metallic layers with silicon contents and associated semiconductor device |
| 04/30/2008 | DE112006001634T5 Oberflächenmontierbare elektrische Lichtemissionsvorrichtung mit einem Kühlkörper A surface-mountable electrical light-emitting device with a heat sink |
| 04/30/2008 | DE112006001602T5 Wärmesenke, Laservorrichtung mit einer Wärmesenke und Laserstapelvorrichtung Heat sink, the laser device to a heat sink and laser stack apparatus |
| 04/30/2008 | DE112006001536T5 Hochleistungsfestkörperleuchte High power solid state light |
| 04/30/2008 | DE112006001048T5 Schaltungsteil, Herstellungsverfahren für Schaltungsteile, Halbleiterbauelement, und Oberflächenlaminatanordnung für ein Schaltungsteil Circuit part manufacturing method of circuit parts, semiconductor device, and surface lamination assembly for a circuit part |
| 04/30/2008 | DE10308448B4 Hochfrequenzmodul RF module |
| 04/30/2008 | DE10255848B4 Halbleiterbauelement und Verfahren zu seiner Herstellung sowie Hauptplatine mit diesem Halbleiterbauelement A semiconductor device and method for its preparation and motherboard with this semiconductor component |
| 04/30/2008 | DE10219361B4 Ein Halbleiterelement mit einer verbesserten lokalen Verbindungsstruktur und ein Verfahren zur Herstellung eines derartigen Elements A semiconductor element with improved local interconnect structure and a method for manufacturing such element |
| 04/30/2008 | DE102007050391A1 Control method for controlling temperature of heat source, e.g. microprocessor, involves channeling two temperature fluids to and from heat exchange surface, respectively, wherein fluid is channeled to minimize temperature differences along |
| 04/30/2008 | DE102007048007A1 Warpage preventing circuit substrate for semiconductor package, has warpage preventing region comprising warpage pattern formed in adjacent corners of substrate and warpage elements provided in diagonal direction of corners |
| 04/30/2008 | DE102007044976A1 Device for receiving a fluid using capillary forces used in a heat tube or a cooling device for cooling an electronic component comprises an element with a capillary structure and having a sheet metal or metal foil molded part with folds |
| 04/30/2008 | DE102006050087A1 Semiconductor body for use in diode and transistor such as FET and bi-polar transistor, has connecting line for contacting semiconductor region, where conductivity per unit of length of connecting line changes from value to another value |
| 04/30/2008 | DE102006049791A1 Teststruktur für hochbeschleunigte Elektromigrationstests für dicke Metallisierungssysteme von Festkörperschaltkreisen Test structure for highly accelerated electromigration tests for thick metallization of solid-state circuits |
| 04/30/2008 | DE102006049257A1 Electrical component i.e. micromechanical sensor, has non-conductive coating provided in part of one side of contact unit, where coating has recess in area of contact unit such that contact unit is electrically contactable from outside |
| 04/30/2008 | DE102006009696B4 Bauteil für die Nano- und Molekularelektronik Component for the nano and molecular electronics |
| 04/30/2008 | CN201054860Y Heat radiation capillary structure and heat conduction component |
| 04/30/2008 | CN201054362Y Focusing LED electronic cooling device |
| 04/30/2008 | CN201054354Y Optical sensing chip encapsulation structure |
| 04/30/2008 | CN201054353Y Multi-chip stacking assembly based on conversion layer |
| 04/30/2008 | CN201054352Y Encapsulation structure for radio communication module |
| 04/30/2008 | CN201054351Y A chip encapsulation carrier board for back side etching technology |
| 04/30/2008 | CN201054350Y CPU heat radiation structure |
| 04/30/2008 | CN201054349Y A thermal tube electronic chip heat radiator |
| 04/30/2008 | CN201054348Y A chip framework encapsulated chip carrying table |
| 04/30/2008 | CN201053660Y Large power LED lamp panel |
| 04/30/2008 | CN201053659Y Multi-layer heat-conductive board heat radiation device of LED |
| 04/30/2008 | CN201053658Y Heat irradiation structure of LED module |
| 04/30/2008 | CN201053638Y Light-emitting diode |
| 04/30/2008 | CN201053637Y RGB white light LED device for illumination |
| 04/30/2008 | CN201053630Y LED array parallel light condensation device |
| 04/30/2008 | CN201053628Y Neb LED |
| 04/30/2008 | CN201053609Y Road lamp structure |
| 04/30/2008 | CN201053608Y Large power LED streamer lamp |
| 04/30/2008 | CN201053604Y LED road lamp |
| 04/30/2008 | CN101171896A Oscillation apparatus, jet stream generator and electronic equipment and vibration device manufacture method |
| 04/30/2008 | CN101171687A 电子器件及其使用 Electronic devices and their use |
| 04/30/2008 | CN101171686A Semiconductor package having socket function, semiconductor module, electronic circuit module, and circuit board with socket |
| 04/30/2008 | CN101171684A One time programmable memory cell |
| 04/30/2008 | CN101171677A Flip-attached and underfilled semiconductor device and method |
| 04/30/2008 | CN101171672A Leadframe, coining tool, and method |
| 04/30/2008 | CN101171665A Method of fabrication of AI/GE bonding in a wafer packaging environment and a product produced therefrom |
| 04/30/2008 | CN101170889A Heat radiator |
| 04/30/2008 | CN101170888A Heat radiator |
| 04/30/2008 | CN101170887A Radiator combination |
| 04/30/2008 | CN101170886A Heat radiation module |
| 04/30/2008 | CN101170162A Organize EL lighting source part |
| 04/30/2008 | CN101170152A Heat radiation method for LED high-power tube wafer |
| 04/30/2008 | CN101170123A Display apparatus |
| 04/30/2008 | CN101170122A Non-volatile multi-bit memory device, its manufacture method and operation method |
| 04/30/2008 | CN101170120A Phase change memory cells with dual access devices |
| 04/30/2008 | CN101170118A Image sensor encapsulation, image sensor module and their making method |
| 04/30/2008 | CN101170116A A programmable non volatile memory unit, array and its making method |
| 04/30/2008 | CN101170114A Nonvolatile semiconductor memory device and method of producing the same |
| 04/30/2008 | CN101170113A Non volatile memory with insulation structure and its making method |
| 04/30/2008 | CN101170111A Semiconductor device |
| 04/30/2008 | CN101170108A Light receiving module |
| 04/30/2008 | CN101170106A Laminate chip packages and its manufacture method and system |
| 04/30/2008 | CN101170104A Stacking chip encapsulation structure with multi-section bus bar in lead rack |
| 04/30/2008 | CN101170103A Stacking wafer encapsulation structure with bus rack in lead rack |
| 04/30/2008 | CN101170100A Static discharging protection circuit |
| 04/30/2008 | CN101170099A Multicrystalline silicon compounds electric fuse silk part |
| 04/30/2008 | CN101170098A 布局结构 Layout structure |
| 04/30/2008 | CN101170097A Semiconductor device and method for manufacturing same |
| 04/30/2008 | CN101170096A Electronic assembly and its base plate |
| 04/30/2008 | CN101170095A Semiconductor package and stacked layer type semiconductor package |
| 04/30/2008 | CN101170094A Making method based on semiconductor film and improved high-frequency transmission construction |
| 04/30/2008 | CN101170093A Structure for improving chip horse encapsulation high-frequency transmission |
| 04/30/2008 | CN101170092A Method of producing semiconductor device, mounting structure body, electro-optical device and electronic apparatus |
| 04/30/2008 | CN101170091A Semiconductor device, wiring of semiconductor device, and method of forming wiring |
| 04/30/2008 | CN101170090A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 04/30/2008 | CN101170089A A contact structure with flexible protruding block and testing area and its making method |
| 04/30/2008 | CN101170088A Semiconductor package structure and its forming method |
| 04/30/2008 | CN101170087A Power module having self-contained cooling system |
| 04/30/2008 | CN101170072A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 04/30/2008 | CN101170071A Semiconductor package and method of forming wire loop of semiconductor package |
| 04/30/2008 | CN100385729C Coplanar filter |
| 04/30/2008 | CN100385666C Integrated circuit device with built-in single temperature sensor |
| 04/30/2008 | CN100385665C Chip and multi-chip semiconductor device using thereof and method for manufacturing same |
| 04/30/2008 | CN100385664C Active package for integrated circuit |
| 04/30/2008 | CN100385663C Programmable resistance element and programming and forming method thereof |