Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/06/2008US7368320 Method of fabricating a two die semiconductor assembly
05/06/2008US7368319 Stacked integrated circuit package-in-package system
05/06/2008US7368304 Fabricating die with separate test pads selectively coupled to cores
05/06/2008US7368208 Measuring phase errors on phase shift masks
05/06/2008US7368206 Forming first separated features on a surface, forming second separated features on surface interleaved between first separated features, and illuminating first and second separated features and detecting an interference pattern
05/06/2008US7367381 Fan motor
05/06/2008US7367195 Application and removal of thermal interface material
05/06/2008US7367120 Method for producing a solid-state imaging device
05/06/2008CA2447282C Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
05/06/2008CA2389822C Electronic power module and power component intended for use with such a module
05/02/2008WO2008052045A2 Ceramic header method and system
05/02/2008WO2008051853A2 High density ic module
05/02/2008WO2008051415A1 Method of manufacturing stacked chip packages
05/02/2008WO2008051184A2 Enhancement of thermal interface conductivities with carbon nanotube arrays
05/02/2008WO2008050906A1 Composite material and method for producing the same
05/02/2008WO2008050868A1 Power module substrate, method for manufacturing power module substrate, and power module
05/02/2008WO2008050710A1 Al-BASE ALLOY WIRING MATERIAL AND ELEMENT STRUCTURE USING THE SAME
05/02/2008WO2008050690A1 Thermally conductive resin composition
05/02/2008WO2008050635A1 Semiconductor element mounting structure and semiconductor element mounting method
05/02/2008WO2008050582A1 Semiconductor device, display device and electronic device
05/02/2008WO2008050251A1 Backside wafer contact structure and method of forming the same
05/02/2008WO2008049861A1 Semiconductor body and method for the design of a semiconductor body with a connecting line
05/02/2008WO2008049707A1 Damage propagation barrier and method of forming
05/02/2008WO2008027708A3 Semiconductor die package including stacked dice and heat sink structures
05/02/2008WO2008025919A3 Process for marking a semi-conductor plate for its identification and the semi-conductor plate marked by this process
05/02/2008WO2008024452A3 Led devices and associated methods
05/02/2008WO2008003912A3 Process for producing moulding powder
05/02/2008WO2007139852A3 Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
05/02/2008WO2007136928A3 Low profile managed memory component
05/02/2008WO2007132683A3 Power semiconductor module
05/02/2008WO2007130643A3 Die-on-leadframe (dol) with high voltage isolation
05/02/2008WO2007092759A3 Aluminum leadframes for semiconductor qfn/son devices
05/01/2008US20080104568 Systematic yield in semiconductor manufacture
05/01/2008US20080104420 Protected storage of a datum in an integrated circuit
05/01/2008US20080102604 Electrical die contact structure and fabrication method
05/01/2008US20080102584 Structure and Method for Improved Heat Conduction for Semiconductor Devices
05/01/2008US20080102563 Non-Pull Back Pad Package with an Additional Solder Standoff
05/01/2008US20080102554 Solid state image pickup device and method of producing solid state image pickup device
05/01/2008US20080102409 Inductor for a system-on-a-chip and a method for manufacturing the same
05/01/2008US20080102304 Refractory Metal Substrate with Improved Thermal Conductivity
05/01/2008US20080102251 Electrodeposition of electroconductive metals on wafers, panels, magnetic heads or substrates having cavities, by applying power and electrolyte solutions to the surfaces; integrated circuits; chemical mechanical polishing
05/01/2008US20080102198 Bonding structure and fabrication thereof
05/01/2008US20080100334 Impedance matching circuit and semiconductor memory device with the same
05/01/2008US20080100319 Intra-chip power and test signal generation for use with test structures on wafers
05/01/2008US20080099932 Resilient carrier assembly for an integrated circuit
05/01/2008US20080099931 Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
05/01/2008US20080099930 Semiconductor device
05/01/2008US20080099929 Mixed-scale electronic interfaces
05/01/2008US20080099928 Low fabrication cost, high performance, high reliability chip scale package
05/01/2008US20080099927 semiconductor package manufacturing method and semiconductor apparatus
05/01/2008US20080099926 Semiconductor device
05/01/2008US20080099925 Solder pillar bumping and a method of making the same
05/01/2008US20080099924 Silicon Wafer Having Through-Wafer Vias With A Predetermined Geometric Shape
05/01/2008US20080099923 Dual damascene integration of ultra low dielectric constant porous materials
05/01/2008US20080099922 Circuit device and manufacturing method thereof
05/01/2008US20080099921 Semiconductor device and method of fabricating the same
05/01/2008US20080099920 Multi-stage curing of low k nano-porous films
05/01/2008US20080099919 Semiconductor device including copper interconnect and method for manufacturing the same
05/01/2008US20080099918 Semiconductor device including a porous low-k material layer stack with reduced uv sensitivity
05/01/2008US20080099917 Packaged microelectronic devices and methods for packaging microelectronic devices
05/01/2008US20080099916 Bonding structure and method of fabricating the same
05/01/2008US20080099915 Semiconductor device and a method of manufacturing the same
05/01/2008US20080099914 Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure
05/01/2008US20080099913 Metallization layer stack without a terminal aluminum metal layer
05/01/2008US20080099912 Packaging with base layers comprising alloy 42
05/01/2008US20080099911 Multilayer wiring substrate mounted with electronic component and method for manufacturing the same
05/01/2008US20080099910 Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip
05/01/2008US20080099909 Wafer stacked package having vertical heat emission path and method of fabricating the same
05/01/2008US20080099908 Systems, devices, components and methods for hermetically sealing electronic modules and packages
05/01/2008US20080099907 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
05/01/2008US20080099906 Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
05/01/2008US20080099905 Method and apparatus of power ring positioning to minimize crosstalk
05/01/2008US20080099904 Structure of package on package and method for fabricating the same
05/01/2008US20080099903 Stacked chip package, embedded chip package and fabricating method thereof
05/01/2008US20080099902 Insertion-type semiconductor device and fabrication method thereof
05/01/2008US20080099901 Package substrate with inserted discrete capacitors
05/01/2008US20080099900 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
05/01/2008US20080099899 Methods and apparatus for a Quad Flat No-Lead (QFN) package
05/01/2008US20080099898 Die-up integrated circuit package with grounded stiffener
05/01/2008US20080099897 Bondwire utilized for coulomb counting and safety circuits
05/01/2008US20080099896 Stacked chip package structure with leadframe having inner leads with transfer pad
05/01/2008US20080099895 Semiconductor package and method of forming wire loop of semiconductor package
05/01/2008US20080099894 Semiconductor device and a method of manufacturing the same
05/01/2008US20080099893 Connecting a plurality of bond pads and/or inner leads with a single bond wire
05/01/2008US20080099892 Stacked chip packaging with heat sink structure
05/01/2008US20080099891 Semiconductor device and method of manufacturing the same
05/01/2008US20080099890 Ball grid array package structure
05/01/2008US20080099889 Semiconductor device and method for manufacturing same
05/01/2008US20080099888 Semiconductor device, method of manufacturing the same
05/01/2008US20080099886 Semiconductor element, semiconductor device and mounting board
05/01/2008US20080099885 Semiconductor package and methods of manufacturing the same
05/01/2008US20080099884 Staggered guard ring structure
05/01/2008US20080099883 Semiconductor storage device, semiconductor device, and manufacturing method therefor
05/01/2008US20080099877 Damage propagation barrier and method of forming
05/01/2008US20080099876 Manufacturing method of semiconductor device and semiconductor device
05/01/2008US20080099864 Chip package, method of making same and digital camera module using the package
05/01/2008US20080099848 Method and apparatus for electrostatic discharge protection having a stable breakdown voltage and low snapback voltage
05/01/2008US20080099800 Integrated matching network and method for manufacturing integrated matching networks
05/01/2008US20080099783 Semiconductor integrated circuit and method for manufacturing the same
05/01/2008US20080099762 Differential voltage defectivity monitoring circuit
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