Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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05/07/2008 | CN101174622A Electrostatic discharge protecting equipment of connection pad and its method and structure |
05/07/2008 | CN101174619A Power semiconductor device |
05/07/2008 | CN101174618A Semiconductor apparatus using back-side high-withstand-voltage integrated circuit |
05/07/2008 | CN101174617A Manufacturing method for semiconductor device, semiconductor device, and electronic equipment |
05/07/2008 | CN101174616A Circuit device |
05/07/2008 | CN101174614A Multi-chip stack packaging structure with asymmetric conductive wire rack |
05/07/2008 | CN101174613A Circuit device and its manufacturing method |
05/07/2008 | CN101174611A Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
05/07/2008 | CN101174610A Wafer and method for recognizing error manufacture process using the same |
05/07/2008 | CN101174609A Semiconductor integrated circuit and method of manufacturing the same |
05/07/2008 | CN101174608A Reduced leakage interconnect structure |
05/07/2008 | CN101174607A Fuse structures and integrated circuit devices |
05/07/2008 | CN101174606A Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device |
05/07/2008 | CN101174605A Stacked chip packaging construction of bus bar with switch-over soldering pad in conducting wire rack |
05/07/2008 | CN101174604A Electronic component and wire bonding method |
05/07/2008 | CN101174603A Semiconductor device and manufacturing method of the same |
05/07/2008 | CN101174602A Small shape ic package for high-current semiconductor power device |
05/07/2008 | CN101174601A Semiconductor structure and method of manufacturing same |
05/07/2008 | CN101174600A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
05/07/2008 | CN101174599A Semiconductor device and method of manufacturing the same |
05/07/2008 | CN101174598A Electronic device and method of manufacturing the same |
05/07/2008 | CN101174597A GaN single crystal substrate and method for processing surface of GaN single crystal substrate |
05/07/2008 | CN101174585A Method for manufacturing semiconductor device having damascene MIM type capacitor |
05/07/2008 | CN101174572A Semiconductor device and its production method |
05/07/2008 | CN101174571A A semiconductor package manufacturing method and semiconductor apparatus |
05/07/2008 | CN101174570A Substrate for mounting flip chip and the manufacturing method thereof |
05/07/2008 | CN101174062A Display substrate and display panel with the same |
05/07/2008 | CN101173843A Flexible heat pipe |
05/07/2008 | CN101173759A Integral cooling system and LED illumination device with the same |
05/07/2008 | CN101173159A Epoxy resin encapsulating material composition |
05/07/2008 | CN101172319A On-the-fly laser beam path error correction for specimen target location processing |
05/07/2008 | CN100387106C Electrical tranducing device and heat conduction pipe therefor |
05/07/2008 | CN100386931C 半导体激光器件 The semiconductor laser device |
05/07/2008 | CN100386920C Electric connector assembly |
05/07/2008 | CN100386897C Support of light emitting diode and preparation method |
05/07/2008 | CN100386893C 发光二极管 Led |
05/07/2008 | CN100386892C Light emitting device assembly |
05/07/2008 | CN100386891C High anti-static high efficiency light-emitting diode and producing method |
05/07/2008 | CN100386878C Semiconductor device and its producing method |
05/07/2008 | CN100386876C Multilayer substrate stack packaging structure |
05/07/2008 | CN100386875C 半导体器件 Semiconductor devices |
05/07/2008 | CN100386874C Mounting base-board and electronic equipment |
05/07/2008 | CN100386873C Wire bonding packaging body |
05/07/2008 | CN100386872C Electronic apparatus |
05/07/2008 | CN100386871C Device and combination method of radiator |
05/07/2008 | CN100386870C 半导体装置 Semiconductor device |
05/07/2008 | CN100386869C Ball grid array substrate having window and method of fabricating same |
05/07/2008 | CN100386868C Method of self-assembling electronic circuitry and circuits formed thereby |
05/07/2008 | CN100386867C Device package and methods for the fabrication and testing thereof |
05/07/2008 | CN100386858C Wafer collective reliability evaluation device and wafer collective reliability evaluation method |
05/07/2008 | CN100386857C Method for manufacturing conductive seat used for electric connection and formed conductive seat therefor |
05/07/2008 | CN100386856C Semiconductor device and manufacturing method thereof, and liquid crystal module and semiconductor module having the same |
05/07/2008 | CN100386854C Wiring forming system and wiring forning method for wiring on wiring board |
05/07/2008 | CN100386472C Ultralow dielectric constant material as intralevel or interlevel dielectric in semiconductor device, method for fabricating the same, and electronic device containing the same |
05/07/2008 | CN100386375C Resin composition for thermally conductive material and thermally conductive material |
05/06/2008 | US7370257 Test vehicle data analysis |
05/06/2008 | US7369817 Semiconductor integrated circuit |
05/06/2008 | US7369811 System and method for sensitivity optimization of RF receiver using adaptive nulling |
05/06/2008 | US7369726 Optical communication between face-to-face semiconductor chips |
05/06/2008 | US7369718 Package substrate pattern to accommodate optical waveguide |
05/06/2008 | US7369411 Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
05/06/2008 | US7369409 Apparatus, method, and control program for cooling electronic devices |
05/06/2008 | US7369408 Screwless mini fan holder |
05/06/2008 | US7369377 Snubbers for low temperature power electronics |
05/06/2008 | US7368998 Inductor element containing circuit board and power amplifier module |
05/06/2008 | US7368825 Power semiconductor device |
05/06/2008 | US7368823 Semiconductor device and method of manufacturing the same |
05/06/2008 | US7368822 Copper metalized ohmic contact electrode of compound device |
05/06/2008 | US7368821 BGA semiconductor chip package and mounting structure thereof |
05/06/2008 | US7368819 Multilayer printed wiring board and multilayer printed circuit board |
05/06/2008 | US7368818 Methods of making microelectronic assemblies including compliant interfaces |
05/06/2008 | US7368817 Bump-on-lead flip chip interconnection |
05/06/2008 | US7368816 Micro-electro-mechanical system (MEMS) package having metal sealing member |
05/06/2008 | US7368815 Semiconductor device which prevents light from entering therein |
05/06/2008 | US7368814 Surface mount adapter apparatus and methods regarding same |
05/06/2008 | US7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof |
05/06/2008 | US7368812 Interposers for chip-scale packages and intermediates thereof |
05/06/2008 | US7368811 Multi-chip package and method for manufacturing the same |
05/06/2008 | US7368810 Invertible microfeature device packages |
05/06/2008 | US7368809 Pillar grid array package |
05/06/2008 | US7368808 MEMS packaging using a non-silicon substrate for encapsulation and interconnection |
05/06/2008 | US7368807 Low cost method to produce high volume lead frames |
05/06/2008 | US7368806 Flip chip package with anti-floating structure |
05/06/2008 | US7368805 Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device |
05/06/2008 | US7368804 Method and apparatus of stress relief in semiconductor structures |
05/06/2008 | US7368801 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same |
05/06/2008 | US7368795 Image sensor module with passive component |
05/06/2008 | US7368786 Process insensitive ESD protection device |
05/06/2008 | US7368749 Method of detecting misalignment of ion implantation area |
05/06/2008 | US7368748 Test pixel and test pixel array for evaluating pixel quality in CMOS image sensor |
05/06/2008 | US7368665 Circuit board and a power module employing the same |
05/06/2008 | US7368391 Methods for designing carrier substrates with raised terminals |
05/06/2008 | US7368380 Method of manufacturing semiconductor device |
05/06/2008 | US7368376 Top layers of metal for high performance IC's |
05/06/2008 | US7368375 Electronic component with compliant elevations having electrical contact areas and method for producing it |
05/06/2008 | US7368374 Super high density module with integrated wafer level packages |
05/06/2008 | US7368330 Semiconductor device having fuse circuit on cell region and method of fabricating the same |
05/06/2008 | US7368326 Methods and apparatus to reduce growth formations on plated conductive leads |
05/06/2008 | US7368324 Method of manufacturing self-supporting contacting structures |
05/06/2008 | US7368323 Semiconductor device and manufacturing method thereof |