Patents
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/07/2008CN101174622A Electrostatic discharge protecting equipment of connection pad and its method and structure
05/07/2008CN101174619A Power semiconductor device
05/07/2008CN101174618A Semiconductor apparatus using back-side high-withstand-voltage integrated circuit
05/07/2008CN101174617A Manufacturing method for semiconductor device, semiconductor device, and electronic equipment
05/07/2008CN101174616A Circuit device
05/07/2008CN101174614A Multi-chip stack packaging structure with asymmetric conductive wire rack
05/07/2008CN101174613A Circuit device and its manufacturing method
05/07/2008CN101174611A Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding
05/07/2008CN101174610A Wafer and method for recognizing error manufacture process using the same
05/07/2008CN101174609A Semiconductor integrated circuit and method of manufacturing the same
05/07/2008CN101174608A Reduced leakage interconnect structure
05/07/2008CN101174607A Fuse structures and integrated circuit devices
05/07/2008CN101174606A Tape carrier, tape carrier for liquid crystal display device, and liquid crystal display device
05/07/2008CN101174605A Stacked chip packaging construction of bus bar with switch-over soldering pad in conducting wire rack
05/07/2008CN101174604A Electronic component and wire bonding method
05/07/2008CN101174603A Semiconductor device and manufacturing method of the same
05/07/2008CN101174602A Small shape ic package for high-current semiconductor power device
05/07/2008CN101174601A Semiconductor structure and method of manufacturing same
05/07/2008CN101174600A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2008CN101174599A Semiconductor device and method of manufacturing the same
05/07/2008CN101174598A Electronic device and method of manufacturing the same
05/07/2008CN101174597A GaN single crystal substrate and method for processing surface of GaN single crystal substrate
05/07/2008CN101174585A Method for manufacturing semiconductor device having damascene MIM type capacitor
05/07/2008CN101174572A Semiconductor device and its production method
05/07/2008CN101174571A A semiconductor package manufacturing method and semiconductor apparatus
05/07/2008CN101174570A Substrate for mounting flip chip and the manufacturing method thereof
05/07/2008CN101174062A Display substrate and display panel with the same
05/07/2008CN101173843A Flexible heat pipe
05/07/2008CN101173759A Integral cooling system and LED illumination device with the same
05/07/2008CN101173159A Epoxy resin encapsulating material composition
05/07/2008CN101172319A On-the-fly laser beam path error correction for specimen target location processing
05/07/2008CN100387106C Electrical tranducing device and heat conduction pipe therefor
05/07/2008CN100386931C 半导体激光器件 The semiconductor laser device
05/07/2008CN100386920C Electric connector assembly
05/07/2008CN100386897C Support of light emitting diode and preparation method
05/07/2008CN100386893C 发光二极管 Led
05/07/2008CN100386892C Light emitting device assembly
05/07/2008CN100386891C High anti-static high efficiency light-emitting diode and producing method
05/07/2008CN100386878C Semiconductor device and its producing method
05/07/2008CN100386876C Multilayer substrate stack packaging structure
05/07/2008CN100386875C 半导体器件 Semiconductor devices
05/07/2008CN100386874C Mounting base-board and electronic equipment
05/07/2008CN100386873C Wire bonding packaging body
05/07/2008CN100386872C Electronic apparatus
05/07/2008CN100386871C Device and combination method of radiator
05/07/2008CN100386870C 半导体装置 Semiconductor device
05/07/2008CN100386869C Ball grid array substrate having window and method of fabricating same
05/07/2008CN100386868C Method of self-assembling electronic circuitry and circuits formed thereby
05/07/2008CN100386867C Device package and methods for the fabrication and testing thereof
05/07/2008CN100386858C Wafer collective reliability evaluation device and wafer collective reliability evaluation method
05/07/2008CN100386857C Method for manufacturing conductive seat used for electric connection and formed conductive seat therefor
05/07/2008CN100386856C Semiconductor device and manufacturing method thereof, and liquid crystal module and semiconductor module having the same
05/07/2008CN100386854C Wiring forming system and wiring forning method for wiring on wiring board
05/07/2008CN100386472C Ultralow dielectric constant material as intralevel or interlevel dielectric in semiconductor device, method for fabricating the same, and electronic device containing the same
05/07/2008CN100386375C Resin composition for thermally conductive material and thermally conductive material
05/06/2008US7370257 Test vehicle data analysis
05/06/2008US7369817 Semiconductor integrated circuit
05/06/2008US7369811 System and method for sensitivity optimization of RF receiver using adaptive nulling
05/06/2008US7369726 Optical communication between face-to-face semiconductor chips
05/06/2008US7369718 Package substrate pattern to accommodate optical waveguide
05/06/2008US7369411 Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
05/06/2008US7369409 Apparatus, method, and control program for cooling electronic devices
05/06/2008US7369408 Screwless mini fan holder
05/06/2008US7369377 Snubbers for low temperature power electronics
05/06/2008US7368998 Inductor element containing circuit board and power amplifier module
05/06/2008US7368825 Power semiconductor device
05/06/2008US7368823 Semiconductor device and method of manufacturing the same
05/06/2008US7368822 Copper metalized ohmic contact electrode of compound device
05/06/2008US7368821 BGA semiconductor chip package and mounting structure thereof
05/06/2008US7368819 Multilayer printed wiring board and multilayer printed circuit board
05/06/2008US7368818 Methods of making microelectronic assemblies including compliant interfaces
05/06/2008US7368817 Bump-on-lead flip chip interconnection
05/06/2008US7368816 Micro-electro-mechanical system (MEMS) package having metal sealing member
05/06/2008US7368815 Semiconductor device which prevents light from entering therein
05/06/2008US7368814 Surface mount adapter apparatus and methods regarding same
05/06/2008US7368813 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
05/06/2008US7368812 Interposers for chip-scale packages and intermediates thereof
05/06/2008US7368811 Multi-chip package and method for manufacturing the same
05/06/2008US7368810 Invertible microfeature device packages
05/06/2008US7368809 Pillar grid array package
05/06/2008US7368808 MEMS packaging using a non-silicon substrate for encapsulation and interconnection
05/06/2008US7368807 Low cost method to produce high volume lead frames
05/06/2008US7368806 Flip chip package with anti-floating structure
05/06/2008US7368805 Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
05/06/2008US7368804 Method and apparatus of stress relief in semiconductor structures
05/06/2008US7368801 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same
05/06/2008US7368795 Image sensor module with passive component
05/06/2008US7368786 Process insensitive ESD protection device
05/06/2008US7368749 Method of detecting misalignment of ion implantation area
05/06/2008US7368748 Test pixel and test pixel array for evaluating pixel quality in CMOS image sensor
05/06/2008US7368665 Circuit board and a power module employing the same
05/06/2008US7368391 Methods for designing carrier substrates with raised terminals
05/06/2008US7368380 Method of manufacturing semiconductor device
05/06/2008US7368376 Top layers of metal for high performance IC's
05/06/2008US7368375 Electronic component with compliant elevations having electrical contact areas and method for producing it
05/06/2008US7368374 Super high density module with integrated wafer level packages
05/06/2008US7368330 Semiconductor device having fuse circuit on cell region and method of fabricating the same
05/06/2008US7368326 Methods and apparatus to reduce growth formations on plated conductive leads
05/06/2008US7368324 Method of manufacturing self-supporting contacting structures
05/06/2008US7368323 Semiconductor device and manufacturing method thereof