| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/08/2008 | US20080105982 Semiconductor device and method of manufacturing the same |
| 05/08/2008 | US20080105981 Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
| 05/08/2008 | US20080105980 Method for manufacturing semiconductor device having damascene mim type capacitor |
| 05/08/2008 | US20080105979 Method for selective deposition of a thin self-assembled monolayer |
| 05/08/2008 | US20080105978 Method for forming an ultra low dielectric film by forming an organosilicon matrix and large porogens as a template for increased porosity |
| 05/08/2008 | US20080105977 Interconnect layers without electromigration |
| 05/08/2008 | US20080105976 Metal filled through via structure for providing vertical wafer-to-wafer interconnection |
| 05/08/2008 | US20080105975 Gold Wire for Connecting Semiconductor Chip |
| 05/08/2008 | US20080105974 Package structure and package substrate thereof |
| 05/08/2008 | US20080105973 Semiconductor assembly with one metal layer after base metal removal |
| 05/08/2008 | US20080105972 Method for making a circuit plate |
| 05/08/2008 | US20080105971 Semiconductor device and manufacturing method of the same |
| 05/08/2008 | US20080105970 Vertical Integration of Passive Component in Semiconductor Device Package for High Electrical Performance |
| 05/08/2008 | US20080105969 Semiconductor constructions and semiconductor device fabrication methods |
| 05/08/2008 | US20080105968 Integrated circuit interconnect lines having reduced line resistance |
| 05/08/2008 | US20080105967 Fan out type wafer level package structure and method of the same |
| 05/08/2008 | US20080105966 Semiconductor Module Including Components in Plastic Casing |
| 05/08/2008 | US20080105965 Stacked integrated circuit package-in-package system |
| 05/08/2008 | US20080105964 Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device |
| 05/08/2008 | US20080105963 Stackable electronic device assembly |
| 05/08/2008 | US20080105962 Chip package |
| 05/08/2008 | US20080105961 Ligands of the Molecule Fit (Agt-121) and their Pharmaceutical Use |
| 05/08/2008 | US20080105960 Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package |
| 05/08/2008 | US20080105959 Semiconductor device and manufacturing method of the same |
| 05/08/2008 | US20080105958 High temperature, high voltage SiC Void-led electronic package |
| 05/08/2008 | US20080105957 Thin, thermally enhanced flip chip in a leaded molded package |
| 05/08/2008 | US20080105956 Semiconductor element and process of manufacturing semiconductor element |
| 05/08/2008 | US20080105952 Manufacturing method of semiconductor chips and semiconductor device having the semiconductor chips |
| 05/08/2008 | US20080105947 Semiconductor device, wiring of semiconductor device, and method of forming wiring |
| 05/08/2008 | US20080105928 Low ohmic layout technique for MOS transistors |
| 05/08/2008 | US20080105893 Light-emitting diode chip package body and packaging method thereof |
| 05/08/2008 | US20080105892 Light-emitting diode chip package body and packaging method thereof |
| 05/08/2008 | US20080105883 Method and system for electrically coupling a chip to chip package |
| 05/08/2008 | US20080105869 Printed circuit board for mounting semiconductor device package, and method of testing and fabricating semiconductor device package using the same |
| 05/08/2008 | US20080105664 Energy-efficient, laser-based method and system for processing target material |
| 05/08/2008 | US20080104970 Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure, and Applied Technology Field Thereof |
| 05/08/2008 | DE202007017890U1 Variabler (beweglicher) Kühler für Prozessoren/CPU's und andere zu kühlende Objekte Variable (movable) cooler for processors / CPU's and other objects to be cooled |
| 05/08/2008 | DE112006001638T5 Struktur und Verfahren zum Bilden einer sich lateral erstreckenden Dielektrikumschicht in einem Trench-Gate-Fet Structure and method for forming a laterally extending dielectric layer in a trench gate FET |
| 05/08/2008 | DE112006001397T5 Kohlenstoff-Nanoröhren-Verdrahtungskontakte Carbon nanotube interconnect contacts |
| 05/08/2008 | DE102007050868A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 05/08/2008 | DE102007050610A1 Halbleitervorrichtung, Verdrahtung einer Halbleitervorrichtung und Verfahren zum Bilden einer Verdrahtung A semiconductor device, wiring of a semiconductor device and method of forming a wiring |
| 05/08/2008 | DE102007046329A1 Substrat zum Befestigen eines Flip-Chips und Herstellungsverfahren desselben Of the same substrate for mounting a flip chip and manufacturing processes |
| 05/08/2008 | DE102007043832A1 Elektronische Pakete mit Feinpartikel-Wetting- und Non-Wetting-Zonen Electronic Packages fine particle Wetting- and non-wetting zones |
| 05/08/2008 | DE102006051607A1 Verfahren und Vorrichtung zum serienmäßigen Aufbringen und Befestigen von elektronischen Bauteilen auf Substraten Method and device for standard application and mounting electronic components on substrates |
| 05/08/2008 | DE102006051489A1 Teststruktur für durch OPC-hervorgerufene Kurzschlüsse zwischen Leitungen in einem Halbleiterbauelement Test structure for OPC caused by short-circuiting between lines in a semiconductor device |
| 05/08/2008 | DE102006051199A1 Elektrisches Bauelement mit äußerer Kontaktierung Electrical component with external contact |
| 05/08/2008 | DE102006028719B4 Halbleiterbauteil mit Halbleiterchipstapel und Verbindungselementen sowie Verfahren zur Herstellung des Halbleiterbauteils A semiconductor device comprising semiconductor chip stack, and connecting elements and processes for producing the semiconductor device |
| 05/08/2008 | DE102006020503B4 Anordnung von Wärmetauscherelementen Of heat exchange elements |
| 05/08/2008 | DE102006020502B4 Kühlgerät Cooling device |
| 05/08/2008 | DE102006020499B4 Kühlgerät Cooling device |
| 05/08/2008 | DE102005010926B4 Deckel für optoelektronische Wafermaßstabsgehäuse und Verfahren zu dessen Herstellung Lid for optoelectronic wafer-scale housing and method for its production |
| 05/08/2008 | DE102004061876B4 FCBGA-Packungsstruktur FCBGA package structure |
| 05/07/2008 | EP1918992A1 Electrical conductor system of a semiconductor device and manufacturing method thereof |
| 05/07/2008 | EP1918991A2 Semiconductor device provided with low melting point metal bumps and process for producing same |
| 05/07/2008 | EP1918988A2 A semiconductor package manufacturing method and semiconductor apparatus |
| 05/07/2008 | EP1918987A1 Method for manufacturing semiconductor device |
| 05/07/2008 | EP1918801A1 Integrated circuit electronic device comprising an improved cooling system |
| 05/07/2008 | EP1918668A1 Device for absorbing a fluid via capillary forces and method for manufacturing the device |
| 05/07/2008 | EP1918415A1 Low dielectric constant material and method of processing by CVD |
| 05/07/2008 | EP1918391A2 Metallic material, electroinic component, electronic device and electronic optical component manufactured by using the metallic material and working method of the metallic material |
| 05/07/2008 | EP1917680A1 Metal-ceramic substrate |
| 05/07/2008 | EP1839334B1 Strip conductor structure for minimizing thermomechanical loads |
| 05/07/2008 | EP1665377B1 Thermal conductive material utilizing electrically conductive nanoparticles |
| 05/07/2008 | EP1568070A4 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 05/07/2008 | EP1528602B1 Semiconductor device using semiconductor chip |
| 05/07/2008 | EP1354358B1 Design of lithography alignment and overlay measurement marks on damascene surface |
| 05/07/2008 | EP1145312B1 Methods for forming co-axial interconnect lines in a cmos process |
| 05/07/2008 | CN201057683Y Radiator with radiator fans of different shape |
| 05/07/2008 | CN201057603Y Improved structure of luminous dipolar body module group |
| 05/07/2008 | CN201057602Y CPU radiator with nano fluid working medium |
| 05/07/2008 | CN201057441Y LED illuminating device |
| 05/07/2008 | CN201057439Y Side illuminating LED |
| 05/07/2008 | CN201057438Y Three primary color sheets type light emitting diode |
| 05/07/2008 | CN201057401Y Lamp cap of road lamp |
| 05/07/2008 | CN201057395Y LED industrial desk lamp |
| 05/07/2008 | CN201057389Y Line lamp |
| 05/07/2008 | CN101176205A Method and system for output matching of RF transistors |
| 05/07/2008 | CN101176204A Semiconductor device having directly attached heat spreader |
| 05/07/2008 | CN101176203A Materials and method to seal vias in silicon substrates |
| 05/07/2008 | CN101175392A Hybrid heat exchanger |
| 05/07/2008 | CN101175391A Buckling device of radiator and its combination |
| 05/07/2008 | CN101175389A Cooling substrate of micro heat pipe |
| 05/07/2008 | CN101175387A Buckling device of radiator |
| 05/07/2008 | CN101175369A Circuit underlay and its manufacturing method, underlay structure and information processing system |
| 05/07/2008 | CN101175368A Circuit board and display device having the same |
| 05/07/2008 | CN101174823A Oscillator circuit and semiconductor device including the same |
| 05/07/2008 | CN101174667A Oxide films and process for preparing same |
| 05/07/2008 | CN101174648A Transistor and memory cell array |
| 05/07/2008 | CN101174646A Semiconductor memory device and layout structure of word line contacts |
| 05/07/2008 | CN101174644A Image sensor |
| 05/07/2008 | CN101174643A Image sensor encapsulation and image sensor module group using the same |
| 05/07/2008 | CN101174641A Display device and a method of manufacturing the same |
| 05/07/2008 | CN101174639A Electric ink display equipment and mending method thereof |
| 05/07/2008 | CN101174638A Electric ink display equipment and mending method thereof |
| 05/07/2008 | CN101174636A Non-volatile memory devices including local control gates on multiple isolated well regions and related methods and systems |
| 05/07/2008 | CN101174635A Flash memory device and method of manufacturing the same |
| 05/07/2008 | CN101174630A 半导体器件 Semiconductor devices |
| 05/07/2008 | CN101174629A Controlled silicon structure used for CMOS electrostatic discharge protection |
| 05/07/2008 | CN101174626A Semiconductor integrated circuit and method for manufacturing the same |
| 05/07/2008 | CN101174623A Integrated circuit device and capacitor pairs |