Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/13/2008US7372148 Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
05/13/2008US7372147 Supporting a circuit package including a substrate having a solder column array
05/13/2008US7372146 Semiconductor module
05/13/2008US7372145 Bonded assembly having improved adhesive bond strength
05/13/2008US7372144 High speed electronics interconnect and method of manufacture
05/13/2008US7372143 Printed circuit board including via contributing to superior characteristic impedance
05/13/2008US7372142 Vertical conduction power electronic device package and corresponding assembling method
05/13/2008US7372141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides
05/13/2008US7372140 Memory module with different types of multi chip packages
05/13/2008US7372139 Semiconductor chip package
05/13/2008US7372138 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
05/13/2008US7372137 Semiconductor device and manufacturing method thereof
05/13/2008US7372136 Chip card retaining mechanism
05/13/2008US7372135 Multi-chip image sensor module
05/13/2008US7372134 Integrated circuit edge protection method and apparatus
05/13/2008US7372133 Microelectronic package having a stiffening element and method of making same
05/13/2008US7372132 Resin encapsulated semiconductor device and the production method
05/13/2008US7372131 Routing element for use in semiconductor device assemblies
05/13/2008US7372130 Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
05/13/2008US7372129 Two die semiconductor assembly and system including same
05/13/2008US7372128 Integrated circuit anti-interference outline structure
05/13/2008US7372120 Methods and apparatus to optically couple an optoelectronic chip to a waveguide
05/13/2008US7372107 SOI chip with recess-resistant buried insulator and method of manufacturing the same
05/13/2008US7372085 Top layers of metal for high performance IC's
05/13/2008US7372074 Surface preparation for selective silicon fusion bonding
05/13/2008US7372069 Interface for UV-curable adhesives
05/13/2008US7371974 Multilayer printed wiring board
05/13/2008US7371973 Contact node
05/13/2008US7371693 Manufacturing method of semiconductor device with chamfering
05/13/2008US7371692 Method for manufacturing a semiconductor device having a W/WN/polysilicon layered film
05/13/2008US7371687 Electronic circuit device
05/13/2008US7371679 Semiconductor device with a metal line and method of forming the same
05/13/2008US7371678 Semiconductor device with a metal line and method of forming the same
05/13/2008US7371676 Method for fabricating semiconductor components with through wire interconnects
05/13/2008US7371675 Method and apparatus for bonding a wire
05/13/2008US7371653 Metal interconnection structure of semiconductor device and method of forming the same
05/13/2008US7371651 Flat-type capacitor for integrated circuit and method of manufacturing the same
05/13/2008US7371622 Etchant for signal wire and method of manufacturing thin film transistor array panel using etchant
05/13/2008US7371618 Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
05/13/2008US7371615 Heat sink and method for its production
05/13/2008US7371612 Method of fabrication of stacked semiconductor devices
05/13/2008US7371610 Process for fabricating an integrated circuit package with reduced mold warping
05/13/2008US7371609 Stacked module systems and methods
05/13/2008US7371608 Method of fabricating a stacked die having a recess in a die BGA package
05/13/2008US7371607 Method of manufacturing semiconductor device and method of manufacturing electronic device
05/13/2008US7371606 Manufacturing method of a semiconductor device
05/13/2008US7371602 Semiconductor package structure and method for manufacturing the same
05/13/2008US7371598 Wiring substrate and method of manufacturing thereof, and thin film transistor and method of manufacturing thereof
05/13/2008US7371312 Using cell voltage as a monitor for deposition coverage
05/13/2008US7371299 Set of resin sheets and method for producing ceramic structure using the same, and ceramic structure
05/13/2008US7371286 Wiring repair apparatus
05/13/2008US7371072 Spring interconnect structures
05/13/2008US7371071 Connection structure of circuit substrate
05/13/2008US7370693 Radiating module and the manufacturing method thereof
05/13/2008US7370412 Method for connecting electronic device
05/13/2008CA2454289C High speed circuit board and method for fabrication
05/13/2008CA2362962C A system for providing an integrated circuit with a unique identification
05/08/2008WO2008055105A2 Non-pull back pad package with an additional solder standoff
05/08/2008WO2008055003A1 Ic socket having heat dissipation function
05/08/2008WO2008054957A1 System and method for providing a nanoscale, highly selective, and thermally resilient silicon, germanium, or silicon-germanium etch-stop
05/08/2008WO2008054929A2 Methods and apparatus for a quad flat no-lead (qfn) package
05/08/2008WO2008054680A2 A metallization layer stack without a terminal aluminum metal layer
05/08/2008WO2008054660A2 Wafer-level fabrication of lidded chips with electrodeposited dielectric coating
05/08/2008WO2008054324A1 Double-stacked ebg structure
05/08/2008WO2008054015A1 Thermoelectric element and thermoelectric module
05/08/2008WO2008053956A1 Ceramic substrate, electronic device and method for producing ceramic substrate
05/08/2008WO2008053843A1 Heat conducting sheet, process for producing the same, and radiator utilizing the sheet
05/08/2008WO2008053785A1 Phase-change heat dissipating member
05/08/2008WO2008053736A1 Thermoelectric module and metallized substrate
05/08/2008WO2008053694A1 Novel lamellar zirconium phosphate
05/08/2008WO2008053586A1 Semiconductor device
05/08/2008WO2008052327A1 Lighting device package
05/08/2008WO2008012209A3 Integrated circuit heat dissipation device
05/08/2008WO2008011442A3 Method and apparatus for effecting stable operation of resonant tunneling diodes
05/08/2008WO2008008758A3 An interconnect structure with dielectric air gaps
05/08/2008WO2008008140A3 Methods and apparatus for passive attachment of components for integrated circuits
05/08/2008WO2008005122A3 Hinged leadframe assembly for an electrical connector
05/08/2008WO2007092654A3 Magnetic alignment of integrated circuits to each other
05/08/2008US20080108232 Device for controlling a vehicle
05/08/2008US20080108205 Semiconductor device and method for manufacturing the same
05/08/2008US20080108201 Configurable Integrated Circuit Capacitor Array Using Via Mask Layers
05/08/2008US20080108182 Method for fabricating semiconductor package free of substrate
05/08/2008US20080108180 Nanoparticle filled underfill
05/08/2008US20080108178 Thermoplastic fluxing underfill method
05/08/2008US20080108169 Ultrathin module for semiconductor device and method of fabricating the same
05/08/2008US20080108168 Structure of image sensor module and method for manufacturing of wafer level package
05/08/2008US20080108167 Solid state image pickup device and method of producing solid state image pickup DMCE
05/08/2008US20080107373 Diffusion and Laser Photoelectrically Coupled Integrated Circuit Signal Line
05/08/2008US20080106877 System and method for manufacturing C-shaped leads
05/08/2008US20080106875 Circuit Device And Method Of Manufacturing The Same
05/08/2008US20080106469 Semiconductor Device
05/08/2008US20080106291 High density integrated circuit apparatus, test probe and methods of use thereof
05/08/2008US20080106287 Scan testing system, method and apparatus
05/08/2008US20080106209 Electric module, methods of manufacturing and driving the same, and electronic instrument
05/08/2008US20080105988 Electrical component having external contacting
05/08/2008US20080105987 Semiconductor device having interposer formed on chip
05/08/2008US20080105986 Electronic Device, a Chip Contacting Method and a Contacting Device
05/08/2008US20080105985 Component stacking for integrated circuit electronic package
05/08/2008US20080105984 Semiconductor chip stack package with reinforcing member for preventing package warpage connected to substrate
05/08/2008US20080105983 Method of forming metal line of semiconductor device, and semiconductor device
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