Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/14/2008CN101179918A Method for manufacturing cooling device assembly
05/14/2008CN101179914A Method and apparatus for fixing heat exchanger
05/14/2008CN101179892A Temperature control method and apparatus for high-power LED
05/14/2008CN101179113A Hermetic seal for light emitting display device, method, and apparatus
05/14/2008CN101179102A LED lamp and producing process
05/14/2008CN101179093A Organic light-emitting display device and fabricating method of the same
05/14/2008CN101179091A Three-dimensional stacked WO3 resistor accidental memory structure and manufacturing method therefor
05/14/2008CN101179088A Multidirection conductive electric enhanced type CCM packaging structure and encapsulation method thereof
05/14/2008CN101179086A Packaging structure of mosaic type image sensing chip
05/14/2008CN101179085A Active elements array substrates and manufacturing method therefor
05/14/2008CN101179082A The thin fime transistor plate and method for making the same
05/14/2008CN101179081A Pixel structure
05/14/2008CN101179080A Thin-film transistor substrates
05/14/2008CN101179075A High-voltage-withstanding semiconductor device and fabrication method thereof
05/14/2008CN101179074A Integration semiconductor device and manufacturing method thereof
05/14/2008CN101179071A Semiconductor integrated circuit and multi-chip module
05/14/2008CN101179070A Serpentine ballasting resistors for multi-finger ESD protection device
05/14/2008CN101179069A Electronic element packaging structure
05/14/2008CN101179068A Multi stack package and method of fabricating the same
05/14/2008CN101179067A Light source assembly and luminous chip packaging body
05/14/2008CN101179066A Chip embedding bury type packaging structure
05/14/2008CN101179065A Semi-conductor light source device
05/14/2008CN101179064A Conductivity device anti electromigration
05/14/2008CN101179063A Layout of induction coil and manufacturing method therefor
05/14/2008CN101179062A 半导体器件安装板及半导体封装 The semiconductor device mounting board and the semiconductor package
05/14/2008CN101179061A Electronic diode for ferroalloy lead wire commutation and method of producing the same
05/14/2008CN101179060A Packaging structure for maintaining pin supporting plane on mould sealing wafer
05/14/2008CN101179059A Clip type semconductor device and making method thereof
05/14/2008CN101179058A 半导体芯片及半导体装置 The semiconductor chip and semiconductor device
05/14/2008CN101179057A Novel bond pad design to minimize dielectric cracking
05/14/2008CN101179056A Wafer level package configured to compensate size difference in different types of packages
05/14/2008CN101179055A Semi-conductor power module and dissipating heat method thereof
05/14/2008CN101179054A Method for manufacturing SOQ substrate
05/14/2008CN101179053A Thin-film transistor array substrates and manufacturing method therefor
05/14/2008CN101179050A Method of fabricating semiconductor integrated circuit device and semiconductor integrated circuit device by the same
05/14/2008CN101179048A Method of manufacturing semiconductor device
05/14/2008CN101179011A Method of forming a cell identification, display substrate and display device having the same
05/14/2008CN101179006A Method for protecting an alignment mark
05/14/2008CN101178171A LED lamp heat sinking method using air pressure and wind tunnel
05/14/2008CN101178170A Flexible heat conducting soft package and illumination device using the same
05/14/2008CN101177234A Electronic device and method for manufacturing thereof
05/14/2008CN100388516C Light source module
05/14/2008CN100388512C Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof
05/14/2008CN100388507C Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
05/14/2008CN100388506C Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same
05/14/2008CN100388494C System and method of heat dissipation in semiconductor devices
05/14/2008CN100388493C Semiconductor device
05/14/2008CN100388491C Display circuit structure
05/14/2008CN100388486C Power semiconductor module
05/14/2008CN100388485C Resin sealing semiconductor device and producing method thereof
05/14/2008CN100388482C Semiconductor device and switching element
05/14/2008CN100388481C Integrate circuit chip structure
05/14/2008CN100388480C Thin film in low dielectric constant and fabricating method
05/14/2008CN100388479C Buried digit line stack and process for making same
05/14/2008CN100388478C Semiconductor device
05/14/2008CN100388477C Interconnection structure and its forming method
05/14/2008CN100388476C Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device
05/14/2008CN100388475C Lead carriage and packing structure using same
05/14/2008CN100388474C Thermally enhanced microcircuit package and method of forming same
05/14/2008CN100388473C Radiating fin, and its manufacturing method
05/14/2008CN100388472C Cooling device using multiple fans and heat sinks
05/14/2008CN100388471C Shielding module
05/14/2008CN100388470C Substrate
05/14/2008CN100388469C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/14/2008CN100388468C Holder and mask structure, interconnected circuit structure and its manufacturing method
05/14/2008CN100388467C Semiconductor package and producing method thereof and semiconductor device
05/14/2008CN100388465C Method for forming a semiconductor device
05/14/2008CN100388462C Method of protecting cmos from electrostatic discharge effect
05/14/2008CN100388449C Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
05/14/2008CN100388447C Semiconductor structured chip embedded structure of base plate and method of preparation
05/14/2008CN100388443C Method for fabricating a thin film semiconductor device
05/14/2008CN100388436C Metal fuse structure of semiconductor assembly part and its manufacturing method
05/14/2008CN100388099C Method for sealing electroluminescence display devices and its sealing areas and sealing patterns
05/14/2008CN100387749C Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
05/14/2008CN100387738C Self-encapsulated silver alloys for interconnects
05/14/2008CN100387378C Electric contactor and alloy for electrode, preparing method thereof
05/13/2008US7373627 Method of designing wiring structure of semiconductor device and wiring structure designed accordingly
05/13/2008US7373625 System and method for product yield prediction
05/13/2008US7372736 Monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout
05/13/2008US7372616 Complex microdevices and apparatus and methods for fabricating such devices
05/13/2008US7372170 Flip chip interconnection pad layout
05/13/2008US7372169 Arrangement of conductive pads on grid array package and on circuit board
05/13/2008US7372168 Semiconductor chip capable of implementing wire bonding over active circuits
05/13/2008US7372167 Semiconductor device and method of manufacturing semiconductor device
05/13/2008US7372166 Sublithographic contact structure, phase change memory cell with optimized heater shape, and manufacturing method thereof
05/13/2008US7372165 Method for making a semiconductor device having increased conductive material reliability
05/13/2008US7372164 Semiconductor device with parallel interconnects
05/13/2008US7372163 Semiconductor device and production method therefor
05/13/2008US7372162 Multiple selectable function integrated circuit module
05/13/2008US7372161 Post passivation interconnection schemes on top of the IC chips
05/13/2008US7372160 Barrier film deposition over metal for reduction in metal dishing after CMP
05/13/2008US7372159 Semiconductor device
05/13/2008US7372157 Semiconductor device including titanium wires and manufacturing method therefor
05/13/2008US7372155 Top layers of metal for high performance IC's
05/13/2008US7372154 Semiconductor device
05/13/2008US7372153 Integrated circuit package bond pad having plurality of conductive members
05/13/2008US7372152 Copper interconnect systems
05/13/2008US7372151 Ball grid array package and process for manufacturing same
05/13/2008US7372150 Semiconductor wafer having identification indication
05/13/2008US7372149 High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus
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