Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/15/2008US20080111234 Electronic assembly with hot spot cooling
05/15/2008US20080111233 Semiconductor package with embedded die
05/15/2008US20080111232 Semiconductor package
05/15/2008US20080111231 Semiconductor Device Comprising a Housing and a Semiconductor Chip Partly Embedded in a Plastic Housing Composition, and Method for Producing the Same
05/15/2008US20080111230 Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor package
05/15/2008US20080111229 Semiconductor package and method for manufacturing the same
05/15/2008US20080111228 Wafer Level Chip Size Packaged Chip Device With An N-Shape Junction Inside And Method Of Fabricating The Same
05/15/2008US20080111227 Semiconductor package structure for vertical mount and method
05/15/2008US20080111226 Integration using package stacking with multi-layer organic substrates
05/15/2008US20080111225 Semiconductor device package
05/15/2008US20080111224 Multi stack package and method of fabricating the same
05/15/2008US20080111223 Wafer Level Chip Size Packaged Chip Device With A Double-Layer Lead Structure And Method Of Fabricating The Same
05/15/2008US20080111222 Bridge stack integrated circuit package system
05/15/2008US20080111221 Radiation Hardened Lateral MOSFET Structure
05/15/2008US20080111220 Electronic assembly and circuit board
05/15/2008US20080111219 Package designs for vertical conduction die
05/15/2008US20080111218 Integrated circuit package system with encapsulation lock
05/15/2008US20080111217 Integrated circuit package system with heat sink
05/15/2008US20080111216 Component arrangement comprising a carrier
05/15/2008US20080111215 Integrated circuit package system
05/15/2008US20080111213 Through-wafer interconnects for photoimager and memory wafers
05/15/2008US20080111207 High-Voltage Semiconductor Device and Method of Fabricating the Same
05/15/2008US20080111191 Electronic circuit, electronic device, method of driving electronic device, electro-optical device and electronic apparatus
05/15/2008US20080111164 via is formed of one or more cylindrical structures made up of carbon nanotubes; good resistance to migration causing the breaking of a wiring line, and having improved reliability
05/15/2008US20080111159 Image sensor including spatially different active and dark pixel interconnect patterns
05/15/2008US20080111151 Power Module, Method of Producing Same, and Air Conditioner
05/15/2008US20080111147 Phosphor-Converted LED Devices Having Improved Light Distribution Uniformity
05/15/2008US20080111136 Tft-lcd pixel unit and method for manufacturing the same
05/15/2008US20080110600 Cooling apparatus for electronic devices
05/15/2008US20080110597 Cooling apparatus having low profile extrusion and method of manufacture therefor
05/15/2008US20080110530 for a flip chip having solder bumps suited for a simple one step application to a printed circuit board; assists in solder assembly of integrated circuit device to circuit board and for shock resistance; resin, solvent, and fluxing agent
05/15/2008US20080110021 Component-embedded board fabrication method and apparatus for high-precision and easy fabrication of component-embedded board with electronic components embedded in wiring board
05/15/2008DE202008001968U1 Anordnungssystem Assembly system
05/15/2008DE19920757B4 Verfahren zum Bilden eines nicht-linearen Schaltelementes auf einer integrierten Schaltung und elektrische Zwischenverbindungsstruktur A method of forming a non-linear switching element on an integrated circuit and electrical interconnect structure
05/15/2008DE112006001866T5 Gefalzter Rahmenträger für MOSFET GBA Folded frame support for MOSFET GBA
05/15/2008DE112006001431T5 Integrierter Schaltungsträger mit Metall und Partikeln gefüllten Durchkontaktierungen Integrated circuit substrate with metal particles and filled vias
05/15/2008DE102007050420A1 ESD-Schutzanordnung und ESD-Schutzverfahren ESD protection order and ESD protection method
05/15/2008DE102007047247A1 Semiconductor component for use in semiconductor chip package, has electrode contact point arranged on substrate, where external connection having conductive liquid is arranged on point, and container arranged on point is filled with liquid
05/15/2008DE102007038515A1 Vorrichtung zur Passivierung eines Bauelements und Verfahren zur Herstellung der Vorrichtung Apparatus for passivation of a device and method for manufacturing the device
05/15/2008DE102006053982A1 Electromagnetic screening structure for e.g. molded interconnect device of electronic or opto-electronic assembly, has flat metal coating applied over flat metal seed layer and in electrical contact with seed layer
05/15/2008DE102006053853A1 Cooling body arrangement for e.g. integrated switching circuit, has frame with integrated spring unit, which pre-stresses cooling body on printed circuit board in contact surface-normal, where spring unit is designed as leaf spring
05/15/2008DE102006053211A1 Enclosed electronic and/or opto-electronic component producing method, involves separating interconnection substrate along predetermined trace within frame, so that interconnection substrate is divided into individual components
05/15/2008DE102006052863A1 Protection structure for semiconductor sensor i.e. ion-sensitive field-effect transistor sensor, has insulating layer arranged between semiconducting layer and metallic layer, and electrically insulating semiconducting and metallic layers
05/15/2008DE102006052620A1 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist. Circuit arrangement having a power module that is combined with a circuit board.
05/15/2008DE102006052619A1 Schaltungsanordnung mit einem Leistungsmodul, das mit einer Leiterplatte kombiniert ist Circuit arrangement having a power module that is combined with a printed circuit board
05/15/2008DE102006051491A1 Metallisierungsschichtstapel mit einer Aluminiumabschlussmetallschicht Metallization layer with an aluminum final metal layer
05/15/2008DE102006049949B3 Semiconductor module, has flat conductor chip island defining electrically conducting portion and insulation layer, and semiconductor chip arranged on electrically conducting portion and positively bonded on insulation layer
05/15/2008DE102005022226B4 Kühlanordnung für in einem Gehäuse angeordnete elektronische Bauelemente Cooling arrangement arranged in a housing for electronic components
05/15/2008DE102004033647B4 Gehäusestruktur Housing structure
05/15/2008DE10144207B4 Anordnung mit mindestens zwei unterschiedlichen elektronischen Halbleiterschaltungen und Verwendung der Anordnung zur schnellen Datenübertragung Arrangement with at least two different electronic semiconductor circuits and use of the arrangement for fast data transfer
05/15/2008CA2668973A1 Chip module for an rfid system
05/14/2008EP1921911A1 Power module and motor integrated control unit
05/14/2008EP1921904A1 Ceramic electronic component and method for manufacturing the same
05/14/2008EP1921676A1 Heat sink
05/14/2008EP1921675A1 Circuit board and semiconductor module using this, production method for circuit board
05/14/2008EP1921674A1 Semiconductor device and method for manufacturing same
05/14/2008EP1921670A2 Manufacturing method of semiconductor device
05/14/2008EP1921114A1 Heat-curable silicone composition and light emitting diode element using same
05/14/2008EP1920464A2 Method and apparatus for evaporative cooling within microfluidic systems
05/14/2008EP1920463A1 Thermal interface materials, methods of preparation thereof and their applications
05/14/2008EP1920462A2 Method for the production of a semiconductor component comprising a planar contact, and semiconductor component
05/14/2008EP1920460A1 Methods of forming through-wafer interconnects and structures resulting therefrom
05/14/2008EP1920459A1 Manufacturing method of semiconductor device
05/14/2008EP1920034A1 Thermally conductive grease
05/14/2008EP1920007A1 Insulating liquid die-bonding agent and semiconductor device
05/14/2008EP1714530B1 Method for increasing a routing density for a circuit board and such a circuit board
05/14/2008EP1685600A4 Stackable electronic assembly
05/14/2008EP1344435B1 Parallel plane substrate
05/14/2008EP1011139B1 Printed wiring board and method for manufacturing the same
05/14/2008EP0898785B1 Active matrix displays and method of making
05/14/2008CN201060873Y Plate type LED substrates
05/14/2008CN201060872Y Bracket of side light-emitting diode
05/14/2008CN201060867Y Infrared receiver electromagnetic internal screening device
05/14/2008CN201060866Y Panel structure for producing plate type LED substrates
05/14/2008CN201060865Y Non-basic island lead frame
05/14/2008CN201060864Y Briquetting of power device
05/14/2008CN201059527Y High heat conducting light-emitting diode lamp source module group
05/14/2008CN201059525Y Heat radiating device of LED luminous module group
05/14/2008CN201059524Y LED light source assembly
05/14/2008CN201059523Y Heat power supply disperse heat radiation model set mounted on led lamp
05/14/2008CN201059522Y Multiple layer arranged luminous diode dissipating heat structure
05/14/2008CN201059521Y LED lighting lamp structure
05/14/2008CN201059520Y LED light bulb dissipating heat seat
05/14/2008CN201059518Y B grade dissipating heat structure of luminous diode lighting lamp
05/14/2008CN201059517Y LED illumination device
05/14/2008CN201059516Y Illuminating body dissipating heat structure
05/14/2008CN201059514Y Improved LED lamp set
05/14/2008CN201059513Y LED lamp set with heat radiator
05/14/2008CN201059512Y LED lighting module group with dissipating heat and auto-power-off functions
05/14/2008CN201059511Y Self heat radiating device of LED lamps
05/14/2008CN201059510Y High power LED spotlight
05/14/2008CN201059468Y Energy-saving projector lamps
05/14/2008CN201059443Y LED road lamp
05/14/2008CN101180728A Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
05/14/2008CN101180727A Printed wiring board
05/14/2008CN101180726A System and method for die attach using a backside heat spreader
05/14/2008CN101180684A Anti-fuse memory device
05/14/2008CN101180562A Optically enabled hybrid semiconductor package
05/14/2008CN101179920A Apparatus for dissipating heat from a heat-generating device
05/14/2008CN101179919A Radiator fastener
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