| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/21/2008 | CN100389495C Electrostatic discharge conduction device and mixed power integrated circuits using same |
| 05/21/2008 | CN100389493C Heat sink |
| 05/21/2008 | CN100389492C Heat sink and method for making same |
| 05/21/2008 | CN100389489C Low energy dosage monitoring using wafer impregnating machine |
| 05/21/2008 | CN100389166C Thermal interface material and its production method |
| 05/20/2008 | US7376928 Basic cell, edge cell, wiring shape, wiring method, and shield wiring structure |
| 05/20/2008 | US7376923 Semiconductor integrated circuit, method of manufacturing semiconductor integrated circuit, charge pump circuit, layout designing apparatus, and layout designing program |
| 05/20/2008 | US7376852 Method for controlling power change for a semiconductor module |
| 05/20/2008 | US7376318 Circuit board and its manufacturing method |
| 05/20/2008 | US7376212 RF isolator with differential input/output |
| 05/20/2008 | US7375982 Thin film deposition as an active conductor and method therefor |
| 05/20/2008 | US7375978 Method and apparatus for trace shielding and routing on a substrate |
| 05/20/2008 | US7375967 Portable electronic device and heat-dissipation method and battery charger thereof |
| 05/20/2008 | US7375962 Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus |
| 05/20/2008 | US7375773 Active matrix substrate and display device |
| 05/20/2008 | US7375435 Chip package structure |
| 05/20/2008 | US7375434 Semiconductor chip with flexible contacts at a face |
| 05/20/2008 | US7375433 Semiconductor device packaging substrate and semiconductor device packaging structure |
| 05/20/2008 | US7375432 Via attached to a bond pad utilizing a tapered interconnect |
| 05/20/2008 | US7375431 Solder bump formation in electronics packaging |
| 05/20/2008 | US7375429 Integrated circuit component and mounting method thereof |
| 05/20/2008 | US7375428 Flip-chip bonding structure using multi chip module-deposited substrate |
| 05/20/2008 | US7375427 Semiconductor device, circuit board, electro-optic device, electronic device |
| 05/20/2008 | US7375426 Semiconductor package |
| 05/20/2008 | US7375425 Fabricating stacked chips using fluidic templated-assembly |
| 05/20/2008 | US7375424 Wirebonded device packages for semiconductor devices having elongated electrodes |
| 05/20/2008 | US7375423 Semiconductor device |
| 05/20/2008 | US7375422 Stacked-type semiconductor package |
| 05/20/2008 | US7375421 High density multilayer circuit module |
| 05/20/2008 | US7375420 Large area transducer array |
| 05/20/2008 | US7375419 Stacked mass storage flash memory package |
| 05/20/2008 | US7375418 Interposer stacking system and method |
| 05/20/2008 | US7375417 NANO IC packaging |
| 05/20/2008 | US7375416 Leadframe enhancement and method of producing a multi-row semiconductor package |
| 05/20/2008 | US7375415 Die package with asymmetric leadframe connection |
| 05/20/2008 | US7375411 Method and structure for forming relatively dense conductive layers |
| 05/20/2008 | US7375408 Fabricating method of a high voltage metal oxide semiconductor device |
| 05/20/2008 | US7375403 Semiconductor device and method of manufacturing the same |
| 05/20/2008 | US7375398 High voltage FET gate structure |
| 05/20/2008 | US7375397 Semiconductor device having an SOI structure and method for manufacturing the same |
| 05/20/2008 | US7375373 Thin film transistor array panel |
| 05/20/2008 | US7375371 Structure and method for thermally stressing or testing a semiconductor device |
| 05/20/2008 | US7375158 A liquid curable liquid bisphenol type epoxy resin or a curable polysiloxane having two alkenyl group/molecule and a liquid organopolysiloxane having two silicon-bonded hydrogen atoms per molecule, a hydrosilation catalyst; Cu /Zn/ Al type memory alloy filler; alumina |
| 05/20/2008 | US7375026 Local multilayered metallization |
| 05/20/2008 | US7375024 Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature |
| 05/20/2008 | US7375020 Method of forming bumps |
| 05/20/2008 | US7375019 Image sensor and method for fabricating the same |
| 05/20/2008 | US7375009 Method of forming a conductive via through a wafer |
| 05/20/2008 | US7375007 Method of manufacturing a semiconductor device |
| 05/20/2008 | US7374969 Semiconductor package with conductive molding compound and manufacturing method thereof |
| 05/20/2008 | US7374967 Multi-stack chip size packaging method |
| 05/20/2008 | US7374956 Method for improved metrology by protecting photoresist profiles |
| 05/20/2008 | US7374820 cyclic silylvinylsiloxane mixed with a germanium alkoxylate or halide; dielectrics for integrated circuits; improved mechanical properties and low dielectric constant |
| 05/20/2008 | CA2430747C Radiation emitter devices and method of making the same |
| 05/15/2008 | WO2008057895A1 Multi-component electronic package with planarized embedded-components substrate |
| 05/15/2008 | WO2008057872A2 Vertical integration of passive component in semiconductor device package for high electrical performance |
| 05/15/2008 | WO2008057837A1 Systems and methods to passivate on-die redistribution interconnects |
| 05/15/2008 | WO2008057770A2 Partially patterned lead frames and methods of making and using the same in semiconductor packaging |
| 05/15/2008 | WO2008057739A2 Multi-component package with both top and bottom side connection pads for three-dimensional packaging |
| 05/15/2008 | WO2008057367A1 Epoxy removal process for microformed elctroplated devices |
| 05/15/2008 | WO2008056748A1 Interlayer insulating film, wiring structure, electronic device and method for manufacturing the interlayer insulating film, the wiring structure and the electronic device |
| 05/15/2008 | WO2008056725A1 Electronic component for surface mounting |
| 05/15/2008 | WO2008056499A1 Semiconductor device and method for manufacturing same |
| 05/15/2008 | WO2008056295A1 A semiconductor device and a method of manufacturing thereof |
| 05/15/2008 | WO2008056195A1 A multi-chip package |
| 05/15/2008 | WO2008055887A1 Interconnect layers without electromigration |
| 05/15/2008 | WO2008055708A2 Microelectronic subassembly, and method for the production thereof |
| 05/15/2008 | WO2008037634B1 Design rules for on-chip inductors |
| 05/15/2008 | WO2008036707A3 Electronic device module comprising an ethylene multi-block copolymer |
| 05/15/2008 | WO2007149492A3 Improved packaging of hybrid integrated circuits |
| 05/15/2008 | WO2007109265B1 Iii-nitrite power semiconductor device |
| 05/15/2008 | WO2007106634A3 Semiconductor device packaging |
| 05/15/2008 | WO2007095468A3 Multi-chip module for battery power control |
| 05/15/2008 | US20080113471 Method of Making Multi-Chip Package with High-Speed Serial Communications between Semiconductor Dice |
| 05/15/2008 | US20080113257 Membrane electrode assemblies for use in fuel cells |
| 05/15/2008 | US20080112151 Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
| 05/15/2008 | US20080112139 Power converter package and thermal management |
| 05/15/2008 | US20080112136 Circuit board adapted to fan and fan structure |
| 05/15/2008 | US20080111565 Concept of compensating for piezo influences on integrated circuitry |
| 05/15/2008 | US20080111255 Semiconductor integrated circuit and multi-chip module |
| 05/15/2008 | US20080111254 Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film |
| 05/15/2008 | US20080111253 Integrated circuit having a distributed network of landing pads |
| 05/15/2008 | US20080111252 Low loop height ball bonding method and apparatus |
| 05/15/2008 | US20080111251 Method of manufacturing an electronic component comprising an integrated circuit and a winding assembly |
| 05/15/2008 | US20080111250 Structure and method for enhancing resistance to fracture of bonding pads |
| 05/15/2008 | US20080111249 Semiconductor device and method for manufacturing same |
| 05/15/2008 | US20080111248 Flip Chip And Wire Bond Semiconductor Package |
| 05/15/2008 | US20080111247 Electronic device and method of fabricating the same |
| 05/15/2008 | US20080111246 Method and apparatus for strapping two polysilicon lines in a semiconductor integrated circuit device |
| 05/15/2008 | US20080111245 Electric Element, Memory Device, and Semiconductor Integrated Circuit |
| 05/15/2008 | US20080111244 Copper-metallized integrated circuits having an overcoat for protecting bondable metal contacts and improving mold compound adhesion |
| 05/15/2008 | US20080111243 High performance system-on-chip using post passivation process |
| 05/15/2008 | US20080111242 Integrated circuit chips with fine-line metal and over-passivation metal |
| 05/15/2008 | US20080111241 Semiconductor device and manufacturing method thereof |
| 05/15/2008 | US20080111240 Semiconductor Device and Method for Fabricating the Same |
| 05/15/2008 | US20080111239 Interconnect structure having enhanced electromigration reliabilty and a method of fabricating same |
| 05/15/2008 | US20080111238 Integrated circuit processing system |
| 05/15/2008 | US20080111237 Semiconductor device manufactured using an electrochemical deposition process for copper interconnects |
| 05/15/2008 | US20080111236 Low fabrication cost, high performance, high reliability chip scale package |
| 05/15/2008 | US20080111235 Semiconductor device and method of manufacturing the same |