Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2014
07/08/2014US8772912 Electronic device
07/08/2014US8772909 Isolator with integral transformer
07/08/2014US8772908 Conductive pads defined by embedded traces
07/08/2014US8772906 Thermally insulated phase change material cells
07/08/2014US8772884 Integrally molded die and bezel structure for fingerprint sensors and the like
07/08/2014US8772882 Semiconductor device and method of manufacturing semiconductor device
07/08/2014US8772876 High-voltage silicon-on-insulator transistors and methods of manufacturing the same
07/08/2014US8772871 Partially depleted dielectric resurf LDMOS
07/08/2014US8772812 Curable organopolysiloxane composition and optical semiconductor device
07/08/2014US8772772 System and method for increasing productivity of combinatorial screening
07/08/2014US8772154 Integrated circuits including barrier polish stop layers and methods for the manufacture thereof
07/08/2014US8772153 Semiconductor device with air gap therein and manufacturing method thereof
07/08/2014US8772152 Method for package-on-package assembly with wire bonds to encapsulation surface
07/08/2014US8772089 Chip package structure and manufacturing method thereof
07/08/2014US8772088 Method of manufacturing high frequency module and high frequency module
07/08/2014US8772084 Multi-chip semiconductor package and method of fabricating the same
07/08/2014US8771828 Sealing film and a semiconductor device using the same
07/08/2014US8770462 Solder paste transfer process
07/08/2014US8769810 Part mounting method
07/08/2014CA2641812C Lead-free solder alloy for high-temperature environments
07/03/2014WO2014106051A1 Heat sink apparatus and method for power semiconductor device module
07/03/2014WO2014105989A1 Wafer level packaging of microbolometer vacuum package assemblies
07/03/2014WO2014105233A2 Processes for multi-layer devices utilizing layer transfer
07/03/2014WO2014104972A1 Fabrication of optical elements and modules incorporating the same
07/03/2014WO2014104760A1 Thermal diffusion apparatus for cooling electronic equipment
07/03/2014WO2014104719A1 Curable polysiloxane composition for optical instrument, packaging material, and optical instrument
07/03/2014WO2014104718A1 Olefin resin composition
07/03/2014WO2014104715A1 Copolymer
07/03/2014WO2014104609A1 Siloxane monomer, sealant composition, sealant, and electronic device
07/03/2014WO2014104598A1 Composition for encapsulant, encapsulant, and electronic element
07/03/2014WO2014104597A1 Composition for encapsulant, encapsulant, and electronic element
07/03/2014WO2014104522A1 Encapsulating composition, barrier layer including same, and encapsulated apparatus including same
07/03/2014WO2014104516A1 Circuit board having interposer embedded therein, electronic module using same, and method for manufacturing same
07/03/2014WO2014104388A2 Curable silicone composition, cured product thereof, and optical semiconductor device
07/03/2014WO2014104218A1 Method for manufacturing circuit board to which electronic component is joined
07/03/2014WO2014104035A1 Reflective substrate
07/03/2014WO2014104020A1 Method for producing glass including different elements
07/03/2014WO2014103993A1 Semiconductor device manufacturing method
07/03/2014WO2014103965A1 Substrate for power module, substrate for power module having metal member, power module having metal member, method for manufacturing substrate for power module, method for manufacturing substrate for power module having metal member
07/03/2014WO2014103936A1 Glass for encapsulating semiconductor and sheath tube for encapsulating semiconductor
07/03/2014WO2014103902A1 Conductive structure, method for producing conductive structure, and display device
07/03/2014WO2014103552A1 Liquid epoxy resin composition
07/03/2014WO2014103373A1 Electronic device
07/03/2014WO2014103133A1 Semiconductor device
07/03/2014WO2014103036A1 Semiconductor device and automobile
07/03/2014WO2014103019A1 Semiconductor element cooling structure and electronic apparatus provided with same
07/03/2014WO2014102881A1 Semiconductor device, mis transistor, and multilayer wiring substrate
07/03/2014WO2014102880A1 Semiconductor device, mis transistor, and multilayer wiring substrate
07/03/2014WO2014102260A1 Chip antenna, electronic component, and method for producing same
07/03/2014WO2014102121A1 Component comprising component element and a support
07/03/2014WO2014101648A1 Package-on-package device
07/03/2014WO2014101337A1 Busbar type power module support
07/03/2014WO2014101080A1 Method for manufacturing flexible electronic device and substrate for manufacturing flexible electronic device
07/03/2014US20140187734 Composition for encapsulant, encapsulant, and electronic device
07/03/2014US20140187659 Composition for electronic device
07/03/2014US20140187034 Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible c4 connections and a method of forming the integrated circuit chip
07/03/2014US20140187000 Semiconductor device and manufacturing method therefor
07/03/2014US20140184864 Solid-state imaging device and electronic apparatus
07/03/2014US20140184322 Through silicon via repair circuit
07/03/2014US20140184321 Signal path of a multiple-patterned semiconductor device
07/03/2014US20140184320 Signal path of a multiple-patterned semiconductor device
07/03/2014US20140183761 Semiconductor Device and Method of Forming Embedded Wafer Level Chip Scale Packages
07/03/2014US20140183760 System and Method to Improve Package and 3DIC Yield in Underfill Process
07/03/2014US20140183759 Method of manufacturing semiconductor device and semiconductor device
07/03/2014US20140183757 Semiconductor device including passivation layer encapsulant
07/03/2014US20140183756 Three-dimensional semiconductor device
07/03/2014US20140183755 Semiconductor package and fabrication method thereof
07/03/2014US20140183754 Through-Vias and Methods of Forming the Same
07/03/2014US20140183752 Semiconductor assembly with built-in stopper, semiconductor device and build-up circuitry and method of making the same
07/03/2014US20140183751 Three-dimensional structure in which wiring is provided on its surface
07/03/2014US20140183750 Ultrathin buried die module and method of manufacturing thereof
07/03/2014US20140183749 Semiconductor device and method of fabricating the same
07/03/2014US20140183748 Microbump and Sacrificial Pad Pattern
07/03/2014US20140183747 Multi-die, high current wafer level package
07/03/2014US20140183746 Zero Stand-Off Bonding System and Method
07/03/2014US20140183744 Package substrate with bondable traces having different lead finishes
07/03/2014US20140183743 Manganese metal film forming method, processing system, electronic device manufacturing method and electronic device
07/03/2014US20140183742 Manganese-containing film forming method, processing system, electronic device manufacturing method and electronic device
07/03/2014US20140183741 Mask read-only memory (rom) and method for fabricating the same
07/03/2014US20140183740 Methods of exposing conductive vias of semiconductor devices and associated structures
07/03/2014US20140183739 Dual damascene structure with liner
07/03/2014US20140183738 Cobalt based interconnects and methods of fabrication thereof
07/03/2014US20140183737 Diffusion Barriers
07/03/2014US20140183735 System and method of combining damascenes and subtract metal etch for advanced back end of line interconnections
07/03/2014US20140183734 Semiconductor device
07/03/2014US20140183733 Metal core solder ball and heat dissipation structure for semiconductor device using the same
07/03/2014US20140183732 Package on package bonding structure and method for forming the same
07/03/2014US20140183731 Package on Package (PoP) Bonding Structures
07/03/2014US20140183730 Semiconductor device having a liquid cooling module
07/03/2014US20140183729 Sensor packages having semiconductor dies of differing sizes
07/03/2014US20140183728 Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure
07/03/2014US20140183727 Waterfall wire bonding
07/03/2014US20140183726 Package substrate, method for manufacturing the same, and package on package substrate
07/03/2014US20140183725 Post-passivation interconnect structure and method of forming the same
07/03/2014US20140183724 Substrate for semiconductor package, semiconductor package using the same, and manufacturing method thereof
07/03/2014US20140183723 Stacked multi-chip package and method of making same
07/03/2014US20140183722 Semiconductor device and method for manufacturing same
07/03/2014US20140183721 Semiconductor package and fabrication method thereof
07/03/2014US20140183720 Methods of manufacturing integrated circuits having a compressive nitride layer
07/03/2014US20140183719 Electronic assembly includes a composite carrier
1 ... 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 ... 2262