Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/22/2008US20080116544 Packaged semiconductor chips with array
05/22/2008US20080116543 Semiconductor devices and methods of manufacture thereof
05/22/2008US20080116542 Gate Dielectric Having a Flat Nitrogen Profile and Method of Manufacture Therefor
05/22/2008US20080116541 Structure for integrating an rf shield structure in a carrier substrate
05/22/2008US20080116535 Methods and apparatus for a dual-metal magnetic shield structure
05/22/2008US20080116526 Semiconductor device and method for manufacturing the same
05/22/2008US20080116518 Metal-oxide-semiconductor device and manufacturing method thereof
05/22/2008US20080116480 Method and device for electrostatic discharge protection
05/22/2008US20080116455 Technique for aging induced performance drift compensation in an integrated circuit
05/22/2008US20080115968 Solder joint reliability in microelectronic packaging
05/22/2008US20080115352 Electronic device and method of manufacturing the same
05/21/2008EP1924130A2 Conductive connecting pin and package substrate
05/21/2008EP1923916A2 Semiconductor device
05/21/2008EP1923915A2 Heat dissipating system having a heat dissipating cavity body
05/21/2008EP1923914A1 Heat sink and method of producing the same
05/21/2008EP1923913A1 Integrated circuit packaging and method of making the same
05/21/2008EP1923892A1 System that prevents reduction in data retention
05/21/2008EP1923426A1 Resin composition and hybrid integrated circuit board making use of the same
05/21/2008EP1923416A1 Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them
05/21/2008EP1922756A1 Electrically shielded through-wafer interconnect
05/21/2008EP1922755A2 Semiconductor device having improved mechanical and thermal reliability
05/21/2008EP1922754A2 Semiconductor device with supporting structure for isolation and passivation layers
05/21/2008EP1922753A1 Dry etchback of interconnect contacts
05/21/2008EP1922747A2 Registration mark within an overlap of dopant regions
05/21/2008EP1922177A1 Cooling body for an electronic housing
05/21/2008EP1741135B1 Method for the production of a chip module
05/21/2008EP1058949B1 Rf mos transistor
05/21/2008EP1016337B1 Temperature control system for an electronic device
05/21/2008EP0996154B1 Semiconductor device and method for manufacturing the same, circuit substrate, and electronic device
05/21/2008DE112006001732T5 Bleifreies Halbleitergehäuse Lead-free semiconductor package
05/21/2008DE102007050843A1 Integrated circuit manufacturing method, involves forming hole via intermediate layer to expose buffer layer section, removing exposed section to expose catalyst layer section, and waxing carbon-nano tubes at catalyst layer exposed section
05/21/2008DE102007046085A1 Nanoröhrenverstärkte Lötkappe, Verfahren zur Montage und Chip-Pakete und Systeme, die diese enthalten Nanotubes reinforced Lötkappe, method for mounting and chip packages and systems containing these
05/21/2008DE102007046021A1 Halbleiteranordnung, Halbleitermodul und Verfahren zum Verbinden eines Halbleiterchips mit einem Keramiksubstrat A semiconductor device, semiconductor module and method for connecting a semiconductor chip to a ceramic substrate
05/21/2008DE10018358B4 Halbleiter-Bauteil und dessen Herstellungsverfahren Semiconductor device and its manufacturing method
05/21/2008CN201064085Y Fixing structure of heat radiating base
05/21/2008CN201064083Y Rotating shaft type heat radiator
05/21/2008CN201064082Y Heat radiator with multiway air passage
05/21/2008CN201064080Y Fan cooling-free system module group
05/21/2008CN201064077Y Loop type hot pipe full aluminum heat radiator
05/21/2008CN201064076Y Heat collector structure of improved water-cooled heat radiator
05/21/2008CN201064075Y Heat radiator fin and heat radiator fin fastening apparatus
05/21/2008CN201064074Y Heat pipe radiator
05/21/2008CN201064073Y Monitor with heat radiating function
05/21/2008CN201064071Y Non-fan cooling structure for host of POS machine
05/21/2008CN201064068Y Composition improvement of heat radiator
05/21/2008CN201064063Y Heat radiator for video control card
05/21/2008CN201064062Y Multifunctional heat conducting device
05/21/2008CN201064061Y Fixing base for heat radiator
05/21/2008CN201064047Y Fastening structure of heat radiator and fan
05/21/2008CN201064045Y Fastener for heat radiation fan
05/21/2008CN201064044Y Fastener of heat radiator
05/21/2008CN201063965Y Electronic component heat radiating structure
05/21/2008CN201063345Y Non-insulation bi-tower type diode module
05/21/2008CN201063344Y Silicon chain module
05/21/2008CN201063343Y Bracket structure of LED
05/21/2008CN201063342Y Multiple-chip packaging structure
05/21/2008CN201063341Y Substrate for packaging chip
05/21/2008CN201063340Y Memory cooling construction
05/21/2008CN201063339Y Clamper type cooling device
05/21/2008CN201063338Y Auxiliary cooling device for memory radiator fan
05/21/2008CN201063337Y Packaging structure for inductance component
05/21/2008CN201063146Y Device for cooling computer cabinet CPU
05/21/2008CN201062784Y Cooling structure of high-power LED lamp base
05/21/2008CN201062783Y Cooling plate of LED lamp
05/21/2008CN201062782Y Ultra-high-power LED composite lamp wick
05/21/2008CN201062770Y Support structure of LED
05/21/2008CN201062740Y High-power LED street lamp
05/21/2008CN201062736Y High-power LED street light fitting
05/21/2008CN201062734Y High-power LED lamp for highroad, railway, walking, mine, light projector, landscape and tunnel
05/21/2008CN101185164A Carbon nanotube bond pad structure and method therefor
05/21/2008CN101185153A Semiconductor package and method for forming the same
05/21/2008CN101185146A Magnetically differential inductors and associated methods
05/21/2008CN101184386A Method for producing electromagnetic shielding component of mobile phone
05/21/2008CN101184385A System cooling method and apparatus
05/21/2008CN101184360A Pattern film, method of manufacturing the pattern film, and printed circuit board and semiconductor package having the pattern film
05/21/2008CN101183833A Hot pipe technique based frequency conversion power unit
05/21/2008CN101183706A Embedded electronic component structure and method of producing the same
05/21/2008CN101183677A Packaging structure and method for manufacturing the packaging structure
05/21/2008CN101183676A 封装结构及其制造方法 Package structure and method for manufacturing
05/21/2008CN101183675A Hermetically sealed wafer level packaging for optical mems devices
05/21/2008CN101183673A Stacked multi-chip semiconductor package structure and package method
05/21/2008CN101183672A Memory device and method manufacturing the same
05/21/2008CN101183671A Image sensor including spatially different active and dark pixel interconnect patterns
05/21/2008CN101183670A Semiconductor device, stacked semiconductor device and interposer substrate
05/21/2008CN101183669A Package designs for vertical conduction die
05/21/2008CN101183668A Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof
05/21/2008CN101183662A Method for forming MIM in semiconductor device
05/21/2008CN101183661A Post-channel interconnection implementing method for balancing stress of silicon chip
05/21/2008CN101183660A Semiconductor laminated structure and method of producing the same
05/21/2008CN101183653A Wafer structure and forming method thereof
05/21/2008CN101183652A Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
05/21/2008CN101183576A Plug-in type thermal sensitive element with overflowing and ESD double protection and method of producing the same
05/21/2008CN101183575A Novel plug-in thermal sensitive element with overflowing and ESD double protection and method of producing the same
05/21/2008CN101183570A Wiring material and wiring board using the same
05/21/2008CN101182976A Dissipating heat cavity and phase-change heat radiating device with the same
05/21/2008CN101182920A Illuminating device, electro-optic device, and electronic apparatus
05/21/2008CN101182919A High power LED lamp
05/21/2008CN100389509C Sealing structure with barrier membrane for electronic element, display device, electronic apparatus, and fabrication method for electronic element
05/21/2008CN100389505C Led housing and fabrication method thereof
05/21/2008CN100389497C Structure for packaging image sensor
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