Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/27/2008US7378725 Semiconducting device with stacked dice
05/27/2008US7378724 Cavity structure for semiconductor structures
05/27/2008US7378723 Method and apparatus for decoupling conductive portions of a microelectronic device package
05/27/2008US7378722 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
05/27/2008US7378721 Chip on lead frame for small package speed sensor
05/27/2008US7378720 Integrated stress relief pattern and registration structure
05/27/2008US7378718 Fuse element with adjustable resistance
05/27/2008US7378702 Vertical memory device structures
05/27/2008US7378616 Heating apparatus and method for semiconductor devices
05/27/2008US7378344 Method of manufacturing a semiconductor device including a silicide layer having an NiSi phase provided on source and drain regions
05/27/2008US7378338 Method of forming an interconnect structure diffusion barrier with high nitrogen content
05/27/2008US7378333 Semiconductor device and manufacturing method thereof
05/27/2008US7378330 Cleaving process to fabricate multilayered substrates using low implantation doses
05/27/2008US7378301 Method for molding a small form factor digital memory card
05/27/2008US7378299 Leadless semiconductor package and manufacturing method thereof
05/27/2008US7378297 Methods of bonding two semiconductor devices
05/27/2008US7378296 Print mask and method of manufacturing electronic components using the same
05/27/2008US7378163 Higher melting substrate is an oxide or nitride of aluminum, titanium or zirconium; layer is silica powder, glass powder, glaze powder, copper oxide, lead oxide, hafnium oxide, or boron oxide and has embedded nanostructure stalagmites or columns extending towards the substrate; no polishing required
05/27/2008US7378053 Method for producing copper-based material with low thermal expansion and high heat conductivity
05/27/2008US7377306 Radiation fin, cooling device, electronic equipment, and manufacturing method of cooling device
05/27/2008US7377031 Fabrication method of semiconductor integrated circuit device
05/22/2008WO2008061128A2 Copper-metallized integrated circuits having an overcoat for protecting bondable metal contacts and improving mold compound adhesion
05/22/2008WO2008061127A1 Integrated circuit having a distributed network of landing pads
05/22/2008WO2008061122A2 Semiconductor device manufactured using an electrochemical deposition process for copper interconnects
05/22/2008WO2008060816A2 Stackable micropackages and stacked modules
05/22/2008WO2008060772A1 Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
05/22/2008WO2008060530A1 Ion beam treatment for the structural integrity of air-gap iii-nitride devices produced by photoelectrochemical (pec) etching
05/22/2008WO2008060447A2 Microcircuit package having ductile layer
05/22/2008WO2008060280A1 Board on chip package and process for making same
05/22/2008WO2008059856A1 Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
05/22/2008WO2008059693A1 Electronic component package
05/22/2008WO2008059643A1 Three-dimensional electronic circuit apparatus
05/22/2008WO2008059612A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device
05/22/2008WO2008059433A1 Bond pad structure and method for producing same
05/22/2008WO2008059301A1 An electronic component and method for its production
05/22/2008WO2008058932A1 Structure and method for enhancing resistance to fracture of bonding pads
05/22/2008WO2008058474A1 Conductor polymer composite carrier with isoproperty conductive columns
05/22/2008WO2008042657A3 Methods of formimg a single layer substrate for high capacity memory cards
05/22/2008WO2008042478A3 Wide band and radio frequency waveguide and hybrid integration in a silicon package
05/22/2008WO2008042129A3 Liquid immersion cooled multichip module
05/22/2008WO2008040596A3 Heat sink for cooling an electrical component
05/22/2008WO2008017556A3 Molded housing used in force fit method
05/22/2008WO2007100642A3 No lead package with heat spreader
05/22/2008US20080119142 Spread spectrum isolator
05/22/2008US20080119061 Semiconductor chip having bumps of different heights and semiconductor package including the same
05/22/2008US20080119038 Use of palladium in ic manufacturing with conductive polymer bump
05/22/2008US20080119029 Wafer scale thin film package
05/22/2008US20080118737 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
05/22/2008US20080117596 Axial-flow fan unit and heat-emitting element cooling
05/22/2008US20080117586 Accessible electronic storage apparatus
05/22/2008US20080117585 Accessible electronic storage apparatus
05/22/2008US20080117149 Liquid crystal display device
05/22/2008US20080117011 Inductors having input/output paths on opposing sides
05/22/2008US20080116611 Method of Manufacturing Multilayer Wiring Board
05/22/2008US20080116591 Semiconductor device and method for manufacturing same
05/22/2008US20080116590 Semiconductor device
05/22/2008US20080116589 Ball grid array package assembly with integrated voltage regulator
05/22/2008US20080116588 Assembly and Method of Placing the Assembly on an External Board
05/22/2008US20080116587 Conductor polymer composite carrier with isoproperty conductive columns
05/22/2008US20080116586 Methods for manufacturing thermally enhanced flip-chip ball grid arrays
05/22/2008US20080116585 Multi-chip structure
05/22/2008US20080116584 Self-aligned through vias for chip stacking
05/22/2008US20080116582 Interconnect Structures with Improved Electromigration Resistance and Methods for Forming Such Interconnect Structures
05/22/2008US20080116581 Post passivation interconnection schemes on top of the ic chips
05/22/2008US20080116580 Semiconductor package and fabrication method thereof
05/22/2008US20080116579 Method of manufacturing multilevel interconnect structure and multilevel interconnect structure
05/22/2008US20080116578 Initiation layer for reducing stress transition due to curing
05/22/2008US20080116577 Semiconductor device and production method therefor
05/22/2008US20080116576 Semiconductor devices and methods of manufacture thereof
05/22/2008US20080116575 Nitride semiconductor device and method of manufacturing the same
05/22/2008US20080116574 BGA package with encapsulation on bottom of substrate
05/22/2008US20080116573 Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
05/22/2008US20080116572 Semiconductor memory modules, methods of arranging terminals therein, and methods of using thereof
05/22/2008US20080116571 Structures to enhance cooling of computer memory modules
05/22/2008US20080116570 Heatplates for heatsink attachment for semiconductor chips
05/22/2008US20080116569 Embedded chip package with improved heat dissipation performance and method of making the same
05/22/2008US20080116568 Direct semiconductor contact ebullient cooling package
05/22/2008US20080116567 Flip Chip Assembly Having Improved Thermal Dissipation
05/22/2008US20080116566 Electronic component and method for manufacturing the same
05/22/2008US20080116565 Circuit board structure with embedded semiconductor chip and method for fabricating the same
05/22/2008US20080116564 Wafer level package with die receiving cavity and method of the same
05/22/2008US20080116563 Semiconductor package having structure for warpage prevention
05/22/2008US20080116562 Carrier structure for semiconductor chip and method for manufacturing the same
05/22/2008US20080116561 Chip carrier film having leads with improved strength and semiconductor package utilizing the film
05/22/2008US20080116560 Method of packaging a device having a tangible element and device thereof
05/22/2008US20080116559 Semiconductor device, stacked semiconductor device and interposer substrate
05/22/2008US20080116558 Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package
05/22/2008US20080116557 Semiconductor package having improved heat spreading performance
05/22/2008US20080116556 Package structure having through hole in spacer thereof
05/22/2008US20080116555 Package structure of memory card and manufacturing method thereof
05/22/2008US20080116554 Packaging micro devices
05/22/2008US20080116553 Wirebond Package Design for High Speed Data Rates
05/22/2008US20080116552 Electronic System With Lead Free Interconnections And Method of Fabrication
05/22/2008US20080116551 Method For Producing A Laser Diode Component, Housing For A Laser Diode Comoponent, And Laser Diode Component Itself
05/22/2008US20080116550 Integrated battery pack with lead frame connection
05/22/2008US20080116549 Transmission type photo interrupter and manufacturing method for same
05/22/2008US20080116548 Wire bond and method of forming same
05/22/2008US20080116547 IC package keeping attachment level of leads on chip during molding process
05/22/2008US20080116546 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
05/22/2008US20080116545 Packaged semiconductor chips
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