Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2008
05/28/2008CN101188231A Semiconductor device and semiconductor wafer and method for manufacturing the same
05/28/2008CN101188230A Package structure and its making method
05/28/2008CN101188229A Semiconductor device
05/28/2008CN101188227A 半导体装置 Semiconductor device
05/28/2008CN101188226A Chip package structure and fabricating process thereof
05/28/2008CN101188225A Semiconductor package structure
05/28/2008CN101188224A High heat radiation multi-chip integrated high-power white light LED module and its making method
05/28/2008CN101188223A Interconnection structure and its forming method
05/28/2008CN101188222A IC and its making method
05/28/2008CN101188221A Wiring substrate and semiconductor device using the same
05/28/2008CN101188220A Wafer level package with die receiving cavity
05/28/2008CN101188219A Liquid crystal display device drive circuit and manufacture method and display device possessing same
05/28/2008CN101188218A Semiconductor chip having bumps of different heights and semiconductor package including the same
05/28/2008CN101188217A Structures to enhance cooling of computer memory modules
05/28/2008CN101188216A Silicon on insulator device with improved heat removal and method of manufacture
05/28/2008CN101188215A Semiconductor package having structure for warpage prevention
05/28/2008CN101188214A Semiconductor device
05/28/2008CN101188204A Semiconductor device and manufacturing method therefor
05/28/2008CN101188203A Hermetic sealing of micro devices
05/28/2008CN101188194A Bonded wafer and method for producing bonded wafer
05/28/2008CN101188164A An instantaneous voltage restraint component and its making method
05/28/2008CN101187735A Display device and flat display device
05/28/2008CN101187463A LED light source module with heat guiding system and radiation system
05/28/2008CN101187462A Power LED intense light device
05/28/2008CN101187458A LED lamp plate structure with patch type bracket and its production process
05/28/2008CN101187451A LED road lamp
05/28/2008CN101187364A Inverter-integrated electric compressor
05/28/2008CN101186802A Epoxy resin composition for multi-chip package and multi-chip package using same
05/28/2008CN101185991A Jointing material, method for manufacturing jointing material and semiconductor device
05/28/2008CN101185794A Application of chip integration LED in treating photon internal cavity inflammation and treating equipment
05/28/2008CN101185793A Application of chip integration LED in treating photo-power tumor and treating equipment
05/28/2008CN100391253C Method and device for bridging different video formats
05/28/2008CN100391067C Heat sink of encapsulation through high frequency in use for semiconductor laser modulated by electrical absorption
05/28/2008CN100391019C Semiconductor light-emitting device and method of manufacturing the same
05/28/2008CN100390995C 半导体器件 Semiconductor devices
05/28/2008CN100390992C Semiconductor structure comprising electrostatic discharge (ESD) protection device
05/28/2008CN100390989C 电路装置及其制造方法 Circuit device and manufacturing method thereof
05/28/2008CN100390988C Interconnection device and method
05/28/2008CN100390987C Electrostatic discharge protection circuit
05/28/2008CN100390986C Design method of semiconductor integrated circuit device with multi-stage interconnection
05/28/2008CN100390985C Semiconductor with column cap layer and manufacture method thereof
05/28/2008CN100390984C Manufacture method of lead frame
05/28/2008CN100390983C Chip packing-body
05/28/2008CN100390982C Semiconductor device and method of manufacturing semiconductor device
05/28/2008CN100390981C Semiconductor device and method for manufacturing the same
05/28/2008CN100390980C Signal line circuit device
05/28/2008CN100390979C Semiconductor package, electronic apparatus and their manufacture method
05/28/2008CN100390978C Electronic device cooler, electronic device cooling method, and electronic device cooling control program
05/28/2008CN100390977C Semiconductor device and its manufacturing method
05/28/2008CN100390976C Porous structive coramic cooling fin and its making method
05/28/2008CN100390975C Fixing structure for heat-conducting block
05/28/2008CN100390974C Large-area heat sink structure for large power semiconductor device
05/28/2008CN100390973C Semiconductor device and method for manufacturing same
05/28/2008CN100390972C Method and device for producing multi-layer ceramic substrate
05/28/2008CN100390971C Electronic substrate, power module, and motor driver
05/28/2008CN100390970C Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
05/28/2008CN100390969C Semiconductor device
05/28/2008CN100390968C Cover glass for semiconductor package and method for producing same
05/28/2008CN100390958C Plasma enhanced ALD of tantalum nitride and bilayer
05/28/2008CN100390952C Method for cutting fuse structure
05/28/2008CN100390951C Method for manufacturing electronic component-mounted board
05/28/2008CN100390944C Interlayer medium, semiconductor structure and method for making the semiconductor structure
05/28/2008CN100390934C Method for producing chip fuse and products thereof
05/28/2008CN100390929C Method of forming semiconductor parts and semiconductor parts
05/28/2008CN100390924C Semiconductor device and its making method and device
05/28/2008CN100390700C Tamper-resistant packaging and approach using magnetically-set data
05/28/2008CN100390488C Heat transmission device and its manufacture method
05/28/2008CN100389889C Hot melt conductor paste composition
05/27/2008US7380220 Dummy fill for integrated circuits
05/27/2008US7379728 Wireless communication system
05/27/2008US7379412 Methods for writing and reading highly resolved domains for high density data storage
05/27/2008US7379306 Multilayer substrate including components therein
05/27/2008US7379224 Electrochromic rearview mirror assembly incorporating a display/signal light
05/27/2008US7379184 Overlay measurement target
05/27/2008US7379113 Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lens
05/27/2008US7378924 Filter with improved capacitive coupling portion
05/27/2008US7378898 Voltage droop suppressing circuit
05/27/2008US7378748 Solid-state imaging device and method for manufacturing the same
05/27/2008US7378747 Semiconductor device chip and semiconductor device chip package
05/27/2008US7378746 Composite bump
05/27/2008US7378745 Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns
05/27/2008US7378744 Plasma treatment at film layer to reduce sheet resistance and to improve via contact resistance
05/27/2008US7378743 Circuit board and electronic assembly
05/27/2008US7378742 Compliant interconnects for semiconductors and micromachines
05/27/2008US7378741 Semiconductor component and corresponding fabrication/mounting method
05/27/2008US7378740 Dual damascene structure for the wiring-line structures of multi-level interconnects in integrated circuit
05/27/2008US7378739 Capacitor and light emitting display using the same
05/27/2008US7378738 Method for producing self-aligned mask, articles produced by same and composition for same
05/27/2008US7378737 Structures and methods to enhance copper metallization
05/27/2008US7378736 Ball grid array structures having tape-based circuitry
05/27/2008US7378735 High performance sub-system design and assembly
05/27/2008US7378734 Stacked contact bump
05/27/2008US7378733 Composite flip-chip package with encased components and method of fabricating same
05/27/2008US7378732 Semiconductor package
05/27/2008US7378731 Heat spreader and package structure utilizing the same
05/27/2008US7378730 Thermal interconnect systems methods of production and uses thereof
05/27/2008US7378729 Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
05/27/2008US7378728 Electronic component mounting package and package assembled substrate
05/27/2008US7378727 Memory device and a method of forming a memory device
05/27/2008US7378726 Stacked packages with interconnecting pins
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