| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/29/2008 | US20080122058 Partially stacked semiconductor devices |
| 05/29/2008 | US20080122057 Silicon carrier having increased flexibility |
| 05/29/2008 | US20080122056 Semiconductor device package |
| 05/29/2008 | US20080122055 Method and system for fabricating semiconductor components with lens structures and lens support structures |
| 05/29/2008 | US20080122053 Integrated Circuit Package and a Method for Forming an Integrated Circuit Package |
| 05/29/2008 | US20080122052 Member for Semiconductor Device and Production Method Thereof |
| 05/29/2008 | US20080122051 Module comprising polymer-containing electrical connecting element |
| 05/29/2008 | US20080122050 Semiconductor Device And Production Method For Semiconductor Device |
| 05/29/2008 | US20080122049 Leadframe finger design to ensure lead-locking for enhanced fatigue life of bonding wire in an overmolded package |
| 05/29/2008 | US20080122048 Stamped leadframe and method of manufacture thereof |
| 05/29/2008 | US20080122047 Collective and synergistic MRAM shields |
| 05/29/2008 | US20080122046 Semiconductor device manufacturing method, wafer, and wafer manufacturing method |
| 05/29/2008 | US20080122045 Dual liner capping layer interconnect structure |
| 05/29/2008 | US20080122044 Method manufacturing capacitor dielectric |
| 05/29/2008 | US20080122043 Layered Semiconductor Wafer With Low Warp And Bow, And Process For Producing It |
| 05/29/2008 | US20080122040 Varying Pitch Adapter and a Method of Forming a Varying Pitch Adapter |
| 05/29/2008 | US20080122039 Intergrated circuit device, chip, and method of fabricating the same |
| 05/29/2008 | US20080122038 Guard ring structure with metallic materials |
| 05/29/2008 | US20080122035 Semiconductor device |
| 05/29/2008 | US20080122031 Vertical electrical device |
| 05/29/2008 | US20080121982 read only memory cells comprising electroconductive metal and silicide layers separated by dielectric layers |
| 05/29/2008 | US20080121942 Memory formation with reduced metallization layers |
| 05/29/2008 | US20080121921 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 05/29/2008 | US20080121915 Semiconductor device and display device having alignment mark |
| 05/29/2008 | US20080121881 Semiconductor device |
| 05/29/2008 | US20080121880 Method of measuring thickness of layer in image sensor and pattern for the same |
| 05/29/2008 | US20080121879 High density integrated circuit apparatus, test probe and methods of use thereof |
| 05/29/2008 | US20080121878 Interposer, semiconductor chip mounted sub-board, and semiconductor package |
| 05/29/2008 | US20080121845 Oxetane composition, associated method and article |
| 05/29/2008 | DE202008003184U1 Elektronisches Gerät mit einer Kühlanordnung An electronic apparatus with a cooling arrangement, |
| 05/29/2008 | DE19950538B4 Halbleiterdrucksensorvorrichtung mit Schutzelementen Semiconductor pressure sensor apparatus with protective elements |
| 05/29/2008 | DE112004000572B4 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes |
| 05/29/2008 | DE10302022B4 Verfahren zur Herstellung eines verkleinerten Chippakets Process for the preparation of a reduced chip package |
| 05/29/2008 | DE102007054064A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device |
| 05/29/2008 | DE102007049961A1 ESD-Schutz für integrierte Schaltungen ESD Protection for Integrated Circuits |
| 05/29/2008 | DE102007046471A1 Electronic device for encapsulating antenna device to provide e.g. wireless personal area network, has cavity arranged in substrate in proximity to antenna structure, which is integrated in chip housing |
| 05/29/2008 | DE102007038335A1 Halbleitervorrichtung Semiconductor device |
| 05/29/2008 | DE102006055455A1 Cooling element for semi-conductor components, has spheroidization, which is formed between chamfers of closure profile, where spheroidization, which is limited by base plate, forms channel shaped hollow chamber |
| 05/29/2008 | DE102006055340A1 Explosionsfester Modulaufbau für Leistungsbauelemente, insbesondere Leistungshalbleiterbauelemente und dessen Herstellung Explosion-proof module structure for power devices, in particular power semiconductor components and its preparation |
| 05/29/2008 | DE102006053922A1 Modul mit Trägerelement Module with support element |
| 05/29/2008 | DE102005021513B4 Abschirmvorrichtung für ein elektronisches, funktechnisches Modul Screening device for an electronic, funk technical module |
| 05/29/2008 | DE102004063523B4 Halbleitervorrichtung Semiconductor device |
| 05/29/2008 | DE102004005666B4 Hochfrequenzanordnung, Verfahren zur Herstellung einer Hochfrequenzanordnung und Verwendung der Hochfrequenzanordnung A radio frequency device, method for manufacturing a high frequency assembly and use of the high-frequency arrangement |
| 05/29/2008 | CA2670204A1 Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof |
| 05/28/2008 | EP1926144A2 Semiconductor device and manufacturing method thereof |
| 05/28/2008 | EP1926143A1 Cooling unit for semi-conductor components or similar heat sources and method for its manufacture |
| 05/28/2008 | EP1926142A1 Insulating circuit board and insulating circuit board provided with cooling sink section |
| 05/28/2008 | EP1926140A2 Semiconductor devices having air gaps |
| 05/28/2008 | EP1926138A1 Device identifying method, device manufacturing method and electronic device |
| 05/28/2008 | EP1926136A2 Electronic component and method for manufacturing the same |
| 05/28/2008 | EP1926135A2 Electronic component and method for manufacturing the same |
| 05/28/2008 | EP1925898A1 Heat sink |
| 05/28/2008 | EP1925192A1 Laminated substrate for mounting electronic parts |
| 05/28/2008 | EP1925028A2 Protective barrier layer for semiconductor device electrodes |
| 05/28/2008 | EP1925027A2 Semiconductor assembly and packaging for high current and low inductance |
| 05/28/2008 | EP1925026A2 Thermally conductive thermoplastics for die-level packaging of microelectronics |
| 05/28/2008 | EP1924960A1 Chip module and method for producing a chip module |
| 05/28/2008 | EP1924947A1 Protection against manipulation and through-drilling for an apparatus to be connected to an electrical circuit |
| 05/28/2008 | EP1924321A1 Miniaturized co-fired electrical interconnects for implantable medical devices |
| 05/28/2008 | EP1212791A4 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 05/28/2008 | CN201066985Y An expansion heat radiation device |
| 05/28/2008 | CN201066984Y Water cooling heat radiation bar and heat radiation device with this bar |
| 05/28/2008 | CN201066983Y Improved fitting structure of heat radiator base and thermal pipe |
| 05/28/2008 | CN201066982Y Heat radiation module with low wind resistance and high heat radiation efficiency |
| 05/28/2008 | CN201066981Y Heat discharge module connecting multiple heating component and host board with dischargeable heat |
| 05/28/2008 | CN201066980Y Heat radiator of no energy consumption, no noise and water cooling self-circulation electronic component |
| 05/28/2008 | CN201066978Y Multi-layer heat radiator |
| 05/28/2008 | CN201066977Y Combined heat radiator |
| 05/28/2008 | CN201066697Y Encapsulation structure for side emission LED part |
| 05/28/2008 | CN201066696Y Encapsulation structure for high-power LED chip and high-power LED lighting part |
| 05/28/2008 | CN201066694Y A high-power LED encapsulation structure |
| 05/28/2008 | CN201066687Y Break protection circuit for LED |
| 05/28/2008 | CN201066686Y A CPU heat radiator |
| 05/28/2008 | CN201066483Y A memory heat radiation device |
| 05/28/2008 | CN201066110Y Radiation structure and LED lamp bulb radiation structure |
| 05/28/2008 | CN201066107Y Large power light-emitting diode metal substrate |
| 05/28/2008 | CN201066102Y Large power LED lamp support |
| 05/28/2008 | CN201066099Y Integral large power LED bracket favorable to heat-conductive performance |
| 05/28/2008 | CN201066093Y Thin large power LED lamp fixture |
| 05/28/2008 | CN101189925A 嵌入式电容结构 Embedded capacitor structure |
| 05/28/2008 | CN101189921A Circuit base plate and its making method and electronic component using the same |
| 05/28/2008 | CN101189718A Reduced inductance interconnect for enhanced microwave and millimeter-wave systems |
| 05/28/2008 | CN101189717A Printed wiring board with built-in semiconductor element and method for manufacturing same |
| 05/28/2008 | CN101189180A Thin package for a micro component |
| 05/28/2008 | CN101188926A Heat conduction bus, particularly for a microprocessor-based computation unit |
| 05/28/2008 | CN101188925A Electronic apparatus |
| 05/28/2008 | CN101188922A Heat radiator |
| 05/28/2008 | CN101188921A Heat radiator |
| 05/28/2008 | CN101188247A An organic electric luminescent display and its making method |
| 05/28/2008 | CN101188245A Solid-state imaging device, imaging apparatus and camera |
| 05/28/2008 | CN101188243A 薄膜晶体管面板及其制造方法 The thin film transistor panel and manufacturing method |
| 05/28/2008 | CN101188242A Thin film transistor substrate and method of producing the same |
| 05/28/2008 | CN101188240A A programmable non volatile memory unit, array and its making method |
| 05/28/2008 | CN101188239A Semiconductor device and its forming method |
| 05/28/2008 | CN101188238A Semiconductor component |
| 05/28/2008 | CN101188237A Semiconductor anti-static protection structure |
| 05/28/2008 | CN101188235A Layered integrated circuit memory |
| 05/28/2008 | CN101188234A Quanta trap infrared detector for multi-folded light dispersion coupling |
| 05/28/2008 | CN101188233A Encapsulation structure of spacer with ventilation hole |
| 05/28/2008 | CN101188232A Laminated encapsulation structure and its making method |