Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2008
06/04/2008CN101192614A Thin film transistor substrate and its producing method
06/04/2008CN101192613A Non-volatile memory device and method of fabricating the same
06/04/2008CN101192611A Hybrid layer three-dimensional storage
06/04/2008CN101192609A Semiconductor integrated circuit and fabrication method for the same
06/04/2008CN101192608A 半导体集成电路及其制作方法 Semiconductor integrated circuit and manufacturing method thereof
06/04/2008CN101192607A Semiconductor device
06/04/2008CN101192606A Esd protection circuit
06/04/2008CN101192604A Integrated circuit element, chip and method of manufacture
06/04/2008CN101192601A Illumination device with semiconductor light-emitting elements
06/04/2008CN101192600A Stack type chip package with radiation structure
06/04/2008CN101192599A Stack type chip package structure with wire frame inner pin installed with transfer welding pad
06/04/2008CN101192597A High low temperature protective circuit
06/04/2008CN101192596A Semiconductor device and display device having alignment mark
06/04/2008CN101192595A Multi-speed interconnected reliability testing structure
06/04/2008CN101192594A Shallow ditch groove separation process monitoring domain and monitoring method
06/04/2008CN101192593A Semiconductor device and method for manufacturing the same
06/04/2008CN101192592A Metal conducting wire mosaic structure and method of manufacture
06/04/2008CN101192591A Circuit substrate for enhancing lead wire tensile strength and its integrated circuit package structure
06/04/2008CN101192590A Ball grid array packaging substrate for enhancing spherical washer fixation and ball grid array packaging structure
06/04/2008CN101192589A Substrate with non-welding cover defined metal spherical pad
06/04/2008CN101192588A Wire bonding and method for forming same
06/04/2008CN101192587A Semiconductor device and method of manufacturing the same
06/04/2008CN101192586A Embedded type chip packaging structure
06/04/2008CN101192585A Stackable semi-conductor packaging structure
06/04/2008CN101192584A Electrode, device and electronic apparatus having the device
06/04/2008CN101192583A Semiconductor device and method of manufacturing semiconductor device
06/04/2008CN101192582A Bonding structures and methods for manufacturing same
06/04/2008CN101192581A Semiconductor device and semiconductor package containing the same
06/04/2008CN101192580A 半导体器件 Semiconductor devices
06/04/2008CN101192579A Semiconductor component
06/04/2008CN101192578A Pixel structure and its manufacture method
06/04/2008CN101192567A Method of forming metal line in semiconductor device
06/04/2008CN101192566A Semiconductor device and method for manufacturing the same
06/04/2008CN101192550A Semiconductor packaging member and method for fabricating the same
06/04/2008CN101192547A Semiconductor component buried loading plate splicing structure and its manufacture method
06/04/2008CN101192545A Sensing and detecting type packaging piece and its method for making
06/04/2008CN101192544A Semiconductor component buried loading plate splicing structure and its manufacture method
06/04/2008CN101192542A Circuit board structure and its manufacture method
06/04/2008CN101192533A Etch stop layer and its forming method
06/04/2008CN101192514A Semiconductor device and method for fabricating the same
06/04/2008CN101192394A Semiconductor device and electronic device using the same
06/04/2008CN101192275A Memory card packaging structure and its manufacture method
06/04/2008CN101192274A Card with interface contact and its manufacture method
06/04/2008CN100392922C Connector, electronic device and connector mounting method
06/04/2008CN100392856C Power semiconductor module
06/04/2008CN100392855C U-grooved integrated chip and method for fabricating same
06/04/2008CN100392854C Integrated circuit, integrated circuit generation method, and data processing system
06/04/2008CN100392853C Void-free metal interconnection steucture and method of forming the same
06/04/2008CN100392852C Electronic component plane button ultra-thin packed substrate and making method thereof
06/04/2008CN100392851C Semiconductor component plane button type ultra-thin packed substrate and making method thereof
06/04/2008CN100392850C Lead-frame and semi-conductor device with same
06/04/2008CN100392849C Package body and package body module
06/04/2008CN100392848C Semiconductor device and electronic apparatus equipped with the semiconductor device
06/04/2008CN100392847C 冷却装置 Cooling device
06/04/2008CN100392846C Integrated circuit arrangement consisting of flat substrate
06/04/2008CN100392845C Packaging structure with high adhesivity between substrate and packing colloid
06/04/2008CN100392843C 半导体器件 Semiconductor devices
06/04/2008CN100392835C Electronic component and method for manufacturing the same
06/04/2008CN100392834C Reinforced solder bump structure and method for forming a reinforced solder bump
06/04/2008CN100392809C Method for fabricating inner connecting lines in insulating layer of wafer, and structure
06/04/2008CN100392806C Electronic part and method for manufacturing the same
06/04/2008CN100392760C Semiconductor storage device
06/04/2008CN100392692C Plasma display apparatus
06/04/2008CN100392386C Method for packaging electrochemical working electrode by nano material toughened epoxy resin
06/04/2008CN100391995C Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
06/03/2008US7382662 Twin insulator charge storage device operation and its fabrication method
06/03/2008US7382621 Video graphics array (VGA) card assembly
06/03/2008US7382620 Method and apparatus for optimizing heat transfer with electronic components
06/03/2008US7382618 Heat dissipating apparatus for computer add-on cards
06/03/2008US7382617 Heat sink assembly
06/03/2008US7382389 Methods and systems for thermal-based laser processing a multi-material device
06/03/2008US7382060 Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
06/03/2008US7382059 Semiconductor package structure and method of manufacture
06/03/2008US7382058 Top layers of metal for high performance IC's
06/03/2008US7382057 Surface structure of flip chip substrate
06/03/2008US7382056 Integrated passive devices
06/03/2008US7382054 Method for forming self-aligned contacts and local interconnects simultaneously
06/03/2008US7382053 Power supply wiring structure
06/03/2008US7382052 Post passivation interconnection schemes on top of IC chip
06/03/2008US7382051 Semiconductor device with reduced contact resistance
06/03/2008US7382050 Semiconductor device and method for producing the same
06/03/2008US7382049 Chip package and bump connecting structure thereof
06/03/2008US7382048 Acoustic transducer module
06/03/2008US7382047 Heat dissipation device
06/03/2008US7382046 Semiconductor device protection cover, and semiconductor device unit including the cover
06/03/2008US7382045 IC card and method of manufacturing the same
06/03/2008US7382044 Semiconductor device package diepad having features formed by electroplating
06/03/2008US7382043 Method and apparatus for shielding an integrated circuit from radiation
06/03/2008US7382042 COF flexible printed wiring board and method of producing the wiring board
06/03/2008US7382041 Organic-inorganic composite insulating material for electronic element, method of producing same and field-effect transistor comprising same
06/03/2008US7382040 Organic field effect transistor and display using same
06/03/2008US7382038 Semiconductor wafer and method for making the same
06/03/2008US7382037 Semiconductor device with a peeling prevention layer
06/03/2008US7382025 ESD protection structure with lower maximum voltage
06/03/2008US7382020 Semiconductor integrated circuit
06/03/2008US7382005 Circuit component with bump formed over chip
06/03/2008US7382004 Semiconductor sensing device
06/03/2008US7382000 Semiconductor device
06/03/2008US7381986 Arrangement for testing semiconductor chips while incorporated on a semiconductor wafer
06/03/2008US7381978 Contact opening metrology
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