Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2008
06/05/2008US20080128881 Semiconductor device
06/05/2008US20080128878 Method and Apparatus for Carbon Dioxide Gettering for a Chip Module Assembly
06/05/2008US20080128877 Semiconductor device
06/05/2008US20080128876 Chip on leads
06/05/2008US20080128875 Integrated circuit with on-chip memory and method for fabricating the same
06/05/2008US20080128874 Semiconductor device
06/05/2008US20080128873 Semiconductor device and printed circuit board
06/05/2008US20080128872 Semiconductor device and method for producing a semiconductor device
06/05/2008US20080128871 Apparatus and Process for Producing Thin Films and Devices
06/05/2008US20080128870 Semiconductor Constructions
06/05/2008US20080128869 Novel contact etch stop film
06/05/2008US20080128867 Method for forming micro-pattern in a semiconductor device
06/05/2008US20080128865 Carrier structure embedded with semiconductor chip and method for fabricating thereof
06/05/2008US20080128848 Solid-state imaging device
06/05/2008US20080128838 Sensor module and method of manufacturing same
06/05/2008US20080128817 Electrostatic discharge protection circuit using triple welled silicon controlled rectifier
06/05/2008US20080128816 Esd protection circuit
06/05/2008US20080128756 Semiconductor device, semiconductor system and semiconductor device manufacturing method
06/05/2008US20080128701 Electronic device, thin film transistor structure and flat panel display having the same
06/05/2008US20080128696 Methods for discretized processing and process sequence integration of regions of a substrate
06/05/2008US20080128695 Flip chip semiconductor die internal signal access system and method
06/05/2008US20080128694 Manufacturing Method For Semiconductor Chips And Semiconductor Wafer
06/05/2008US20080128693 Reliability test structure for multilevel interconnect
06/05/2008US20080128692 Multi-purpose poly edge test structure
06/05/2008US20080128691 Test structures for development of metal-insulator-metal (MIM) devices
06/05/2008US20080128690 Scribe based bond pads for integrated circuits
06/05/2008US20080128159 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/05/2008US20080127489 Wiring substrate, manufacturing method thereof, and semiconductor device
06/05/2008US20080127488 Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom
06/05/2008DE202008004241U1 Kühlrippe Fin
06/05/2008DE202008003492U1 Kühlkörper Heat Sink
06/05/2008DE19804748B4 Anordnung und Verfahren der Isolierung gegen mechanische Spannung bei der Befestigung von Halbleiterchips Arrangement and method of the insulation against mechanical stress at the mounting of semiconductor chips
06/05/2008DE112006000992T5 Siliziumnitridsubstrat, die Herstellungsmethode und das Siliziumnitrid-Verdrahtungssubstrat sowie das Halbleitermodul, die mit Hilfe von der Technik gemacht wird Silicon nitride substrate, the manufacturing method and the silicon wiring substrate and the semiconductor module, which is made with the aid of the technique
06/05/2008DE112005003629T5 IC-Baugruppe und Verfahren zur Herstellung einer IC-Baugruppe IC package and method for manufacturing an IC module
06/05/2008DE10351014B4 Diodenstruktur und integrale Leistungsschaltanordnung mit Low-Leakage-Diode Diode structure and integral power switching device with low leakage diode
06/05/2008DE10227342B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement
06/05/2008DE102007054866A1 Halbleitermodul und Verfahren zur Herstellung desselben Semiconductor module and method of manufacturing the same
06/05/2008DE102007023666A1 Semiconductor component e.g. silicon chip, has passivation layer extended on contact distributor layer and comprising opening that is arranged on section of contact distributor layer, and connection contact arranged on opening
06/05/2008DE102006057718A1 Semiconductor component e.g. semiconductor laser diode, has relaxation layer arranged between functional layer and solder and/or between solder and carrier substrate, where relaxation layer has thickness of micrometers, and is made of gold
06/05/2008DE102006056777A1 Electronic package for integrated circuit, has shielding layer provided on carrier element e.g. interposer, for electric and magnetic shielding of circuit element e.g. capacitor and coil, of chip
06/05/2008DE102006056363A1 Halbleitermodul mit mindestens zwei Substraten A semiconductor module having at least two substrates,
06/05/2008DE102006056361A1 Modul mit polymerhaltigem elektrischen Verbindungselement Polymer-module with electrical connection element
06/05/2008DE102006043785B4 Elektronische Baugruppe Electronic assembly
06/05/2008DE102006034589B4 Strom begrenzende Halbleiteranordnung Current limiting semiconductor device
06/05/2008DE10111200B4 Integrierte Halbleiterschaltung A semiconductor integrated circuit
06/05/2008DE10044429B4 Elektrische Keramikkomponente Electric ceramic component
06/05/2008CA2680066A1 Outdoor-type high-power light emitting diode illumination device
06/05/2008CA2667640A1 Superconducting shielding for use with an intergrated circuit for quantum computing
06/04/2008EP1928024A1 Carrier film for chip modules which is adapted for automatic control of wiring and method of manufacturing chip modules
06/04/2008EP1928023A2 Cooling apparatus for memory modules
06/04/2008EP1928022A1 Interposer and electronic device using the same
06/04/2008EP1928018A2 Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet
06/04/2008EP1927636A1 Aryl(thio)ether aryl polysiloxane composition and methods for making and using same
06/04/2008EP1927137A1 Method for cutting solid-state image pickup device
06/04/2008EP1927117A1 A trimmable film resistor and a method for forming and trimming a film resistor
06/04/2008EP1926554A2 Cure catalyst, composition, electronic device and associated method
06/04/2008EP1842408A4 Low thermal resistance power module assembly
06/04/2008EP1165311A4 Multilayer ceramic circuit boards with embedded resistors
06/04/2008EP1082757B1 Semiconductor device with transparent link area for silicide applications and fabrication thereof
06/04/2008CN201069782Y LED lead frame and LED with this frame
06/04/2008CN201069781Y LED lead frame and LED with this frame
06/04/2008CN201069774Y Base plate of thin film transistor array
06/04/2008CN201069773Y Luminant structure
06/04/2008CN201069771Y Mounting type LED
06/04/2008CN201069770Y Audion down-lead framework
06/04/2008CN201069769Y Encapsulation structure for small communication module
06/04/2008CN201069768Y Device for water cooling/oil cooling computer CPU heat radiation system
06/04/2008CN201069144Y LEDLED module group sealing structure
06/04/2008CN201069139Y LED lamp device with radiation structure
06/04/2008CN201069134Y LEDLED backlight module
06/04/2008CN201069078Y Large power semi-conductor LED illuminating source device
06/04/2008CN101194547A Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method
06/04/2008CN101194361A Layer sequence and method of manufacturing a layer sequence
06/04/2008CN101194360A Interposer and semiconductor device
06/04/2008CN101194359A Sub-mount and its manufacturing method
06/04/2008CN101194357A 半导体集成电路装置 The semiconductor integrated circuit device
06/04/2008CN101194356A Technique for forming copper-containing lines embedded in low-k dielectric by providing a stiffening layer
06/04/2008CN101193545A Folded heatsink and memory module
06/04/2008CN101193543A Electronic apparatus
06/04/2008CN101193542A Heat radiation device and wind guide sheet
06/04/2008CN101193541A Heat radiation assembly
06/04/2008CN101193540A Heat radiation module and its flat thermal pole and heat radiation device
06/04/2008CN101193539A Heat radiator with dust-removing function
06/04/2008CN101193538A Heat radiator with dust-removing structure
06/04/2008CN101193537A Heat radiator
06/04/2008CN101193535A Heat pipe radiator
06/04/2008CN101193534A Heat radiator
06/04/2008CN101193533A Radiator combination
06/04/2008CN101193532A Heat radiator
06/04/2008CN101193531A Heat radiator
06/04/2008CN101193529A Heat radiator
06/04/2008CN101193528A Heat radiator
06/04/2008CN101193527A Liquid-cooling heat radiator
06/04/2008CN101193515A Heat radiator clamping device
06/04/2008CN101193514A Clamper and heat radiation module with this clamper
06/04/2008CN101192753A Static discharge protection circuit and structure for part charging mode
06/04/2008CN101192640A Luminous diode with heat radiating device
06/04/2008CN101192639A Light emitting diode packaging structure
06/04/2008CN101192637A Luminous diode element
06/04/2008CN101192620A Solid-state imaging device
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